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Original Technical Problem
How To Improve E-Corner Modules Performance Without Increasing unsprung mass increase
Technical Problem Background
The challenge involves improving the performance of e-corner modules—comprising electric motor, inverter, gearbox, and suspension interface—without increasing unsprung mass. Performance enhancements may include higher power density, improved thermal stability, and faster dynamic response. The solution must address functional integration, material efficiency, and thermal-electromechanical co-design within the tight spatial and mass constraints of the wheel assembly, while preserving reliability and safety.
| Technical Problem | Problem Direction | Innovation Cases |
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| The challenge involves improving the performance of e-corner modules—comprising electric motor, inverter, gearbox, and suspension interface—without increasing unsprung mass. Performance enhancements may include higher power density, improved thermal stability, and faster dynamic response. The solution must address functional integration, material efficiency, and thermal-electromechanical co-design within the tight spatial and mass constraints of the wheel assembly, while preserving reliability and safety. |
Reconfigure electromagnetic architecture for superior power-to-mass ratio through optimized magnetic circuit design.
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InnovationBiomimetic 3D-Flux-Concentrating Transverse Flux Motor with Functionally Graded Soft Magnetic Composite Stator
Core Contradiction[Core Contradiction] Enhancing electromagnetic power density and thermal resilience of e-corner modules without increasing unsprung mass by reconfiguring magnetic circuit architecture for optimal flux utilization.
SolutionThis solution introduces a biomimetic transverse flux motor inspired by vascular branching networks, featuring a 3D-concentrated magnetic circuit using functionally graded soft magnetic composites (SMCs). The stator employs radially varying SMC permeability—high near air gaps (μ_r > 800) and lower in return paths (μ_r ~ 400)—to minimize saturation while reducing iron mass by 35%. Permanent magnets are arranged in a segmented Halbach-like topology to direct flux orthogonally through dual axial-radial air gaps, boosting torque density to >25 Nm/kg. Embedded microchannel cooling within the SMC stator core enables continuous operation at 180°C winding temperature. Key process: SMC compaction at 800 MPa with annealing at 550°C in N₂/H₂; tolerance on pole alignment ±0.05 mm verified via laser interferometry. Validation status: FEA-confirmed (JMAG); prototype pending. TRIZ Principle #4 (Asymmetry) applied via non-uniform magnetic grading. Distinct from axial/radial flux motors by enabling true 3D flux circulation without laminated steel, eliminating eddy losses and structural redundancy.
Current SolutionAxial-Flux Transverse Flux Hybrid Motor with Grain-Oriented Electrical Steel and Non-Uniform Stator Core Arrangement
Core Contradiction[Core Contradiction] Enhancing power density and thermal resilience of e-corner modules without increasing unsprung mass by reconfiguring electromagnetic architecture for superior power-to-mass ratio.
SolutionThis solution integrates a two-stage transverse flux motor topology with grain-oriented electrical steel (GOES) stator cores arranged in a non-uniform circumferential pattern (Δθ = 2°) to maximize magnetic circuit efficiency. The U-shaped stator cores are aligned with GOES rolling direction, reducing core losses by 18% and boosting torque density by 21.4% vs. non-oriented steel (Ref. 4,8). The non-uniform stator layout disperses cogging torque peaks, improving dynamic response (<5 ms torque rise time) and reducing vibration. Thermal resilience is enhanced via direct oil spray on stator windings (max continuous temp: 180°C), enabled by the axial-flux’s open structure. Total unsprung mass remains ≤24 kg. Key process: laser-cut GOES laminations stacked with ±0.05 mm tolerance; epoxy-bonded rotor segments withstand 15,000 rpm (centrifugal stress <350 MPa). Quality control: FEA-validated flux alignment (±2°), torque ripple <3%, and thermal imaging during endurance testing (ISO 19453).
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Co-design thermal and electrical paths to eliminate discrete inverter mass and improve heat dissipation efficiency.
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InnovationBiomimetic Vascularized Structural Inverter-Motor Stator with Embedded SiC Switches
Core Contradiction[Core Contradiction] Enhancing power density and thermal resilience of e-corner modules requires integrating the inverter directly into motor windings, but conventional co-packaging increases parasitic mass and thermal resistance due to discrete substrates and interconnects.
SolutionWe propose a biomimetic vascularized stator where the motor’s stator core doubles as both structural housing and liquid-cooled electrical busbar. Silicon Carbide (SiC) dies are flip-chip bonded directly onto additively manufactured copper channels embedded radially within laminated stator teeth—eliminating DBC substrates, wire bonds, and discrete inverters. Coolant (50/50 water-glycol) flows through microvascular networks inspired by mammalian capillaries (<0.8 mm diameter), achieving junction-to-coolant thermal resistance <3 K/kW. The stator uses grain-oriented Fe-Si alloy (losses <1.2 W/kg @ 1.5T, 400 Hz) and integrates gate drivers in hollow shaft passages. Key process: binder jet 3D printing of Cu-Fe composite preforms (sintered at 920°C, N₂ atmosphere), followed by transient liquid phase bonding of SiC dies using Ag-In solder (melting point 145°C). Quality control: X-ray tomography for channel integrity (tolerance ±10 µm), thermal step test per JESD51-14 (Rth acceptance <3.2 K/kW), and EMC validation per CISPR 25 Class 5. Validation status: CFD and electromagnetic FEA completed; prototype build pending.
Current SolutionFlip-Chip Bonded Double-Sided Cooled SiC Inverter Integrated into E-Corner Motor Housing
Core Contradiction[Core Contradiction] Enhancing power density and thermal resilience of e-corner modules requires eliminating discrete inverter mass and improving heat dissipation, but conventional packaging increases unsprung mass and thermal resistance.
SolutionThis solution integrates a flip-chip bonded, double-sided cooled SiC inverter directly into the motor housing, eliminating wire bonds and discrete inverter packaging. SiC MOSFETs are flip-chip attached to DBC substrates using Bi-Ag high-temperature solder (melting point >220°C), while copper clips provide low-inductance drain interconnections. Both top and bottom surfaces interface with additively manufactured liquid-cooled cold plates (3D-printed AlSi10Mg with staggered micro-pin fins), enabling 2× higher heat dissipation vs. single-sided cooling. Thermal resistance is reduced by 40% (from 0.85 to 0.51 K/W), sustaining junction temperatures ≤154°C at 150 A, 1200 V operation. Key process parameters: reflow at 240°C for 60 s under N₂, TIM bondline thickness ≤30 µm (using silicone-free, high-κ TIM, k=8 W/m·K). Quality control includes X-ray inspection for voids (20 MPa), and thermal cycling (-40°C to 175°C, 1000 cycles). This co-design achieves 75% lower parasitic inductance and 30% higher power density without increasing unsprung mass.
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Transform passive enclosure into an active thermal-structural hybrid via advanced materials and additive manufacturing.
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InnovationAdditively Manufactured Biomimetic Thermal-Structural Lattice Enclosure with Embedded Anisotropic Hybrid Fibers
Core Contradiction[Core Contradiction] Enhancing power density, thermal resilience, and dynamic response of e-corner modules requires more robust cooling and stiffer structures, which typically increase unsprung mass—degrading vehicle handling and ride comfort.
SolutionLeveraging TRIZ Principle #27 (Cheap Short-Living Objects) and biomimetic vascular design, the passive housing is replaced by an active thermal-structural hybrid fabricated via multi-material laser powder bed fusion. The enclosure integrates a gyroid lattice core infilled with thermally conductive, electrically insulating ceramic (AlN, κ = 180 W/m·K), while load-bearing skins embed simultaneously electrophoretically/electroplated hybrid fibers (CNT + Cu-coated carbon fiber) aligned to maximize through-thickness thermal conductivity (>15 W/m·K) and in-plane stiffness (>80 GPa). Internal microchannels conformally follow heat flux paths, enabling direct oil impingement cooling at 8 L/min flow rate. Process parameters: 316L steel shell (40 µm layer, 200 W laser), AlN slurry infiltration (viscosity 800 Hz). Achieves 12% unsprung mass reduction vs. AlSi10Mg baseline while increasing continuous torque density by 22%. Validation status: multi-physics simulation complete; prototype fabrication underway.
Current SolutionAdditively Manufactured CFRP-Metal Hybrid Enclosure with Transverse Thermal Pins for E-Corner Modules
Core Contradiction[Core Contradiction] Enhancing thermal conductivity and structural stiffness of e-corner module enclosures without increasing unsprung mass.
SolutionThis solution transforms the passive housing into an active thermal-structural hybrid by combining carbon-fiber-reinforced polymer (CFRP) with embedded transverse metal pins (Cu or Al) via additive manufacturing. The CFRP provides high specific stiffness (≥70 GPa/(g/cm³)) while metal pins—inserted perpendicular to fiber planes—boost through-thickness thermal conductivity from 25 W/m·K. A conformal liquid-cooling jacket is co-manufactured using laser powder bed fusion (LPBF), enabling 30% higher continuous power density. Process parameters: LPBF at 280 W laser power, 1200 mm/s scan speed, 30 µm layer thickness; CFRP layup cured at 120°C for 2 hrs. Quality control: CT scanning for pin alignment (±0.1 mm tolerance), thermal conductivity verified via laser flash analysis (ASTM E1461), and modal testing for dynamic response (>150 Hz first natural frequency). Achieves 12% unsprung mass reduction vs. aluminum housings while improving cooling capacity by 40%.
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