Enhancing 3D Structure Adhesion in Semiconductor Devices
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Summary
Problems
Existing semiconductor device fabrication methods face challenges in achieving adequate adhesion and shear strength of 3D structures to substrates, particularly in configurations where metallurgical bonding is not feasible, leading to reliability issues during handling and assembly.
Innovation solutions
The use of photodefinable materials, such as polyimides, is applied over 3D structures and substrates, selectively exposed to radiant energy to form collars that enhance adhesion without altering electrical characteristics or increasing package height, thereby improving shear strength and robustness.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If metallurgical bonding is used to attach 3D structures to bond pads, then electrical connectivity is achieved, but shear strength and adhesion are insufficient for reliable mechanical support
Why choose this principle:
A collar structure is formed around the 3D structure before final assembly, creating a mechanical interlock that provides preliminary structural support and enhances shear strength before the device undergoes bonding processes
Principle concept:
If metallurgical bonding is used to attach 3D structures to bond pads, then electrical connectivity is achieved, but shear strength and adhesion are insufficient for reliable mechanical support
Why choose this principle:
The collar is formed from a material composite that combines structural support properties with adhesion enhancement capabilities, creating a multi-functional structure that simultaneously provides mechanical strength and bonding surface
Application Domain
Data Source
AI summary:
The use of photodefinable materials, such as polyimides, is applied over 3D structures and substrates, selectively exposed to radiant energy to form collars that enhance adhesion without altering electrical characteristics or increasing package height, thereby improving shear strength and robustness.
Abstract
Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.