Bubble-Assisted Die Transfer for Precise Alignment
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Summary
Problems
The transfer and placement of semiconductor dies, particularly LED dies, in laser-assisted applications face complexities such as accurate placement and alignment issues during the transition from a carrier to a receive substrate.
Innovation solutions
A method and system utilizing a transfer material that forms a bubble upon exposure to light energy, allowing the die to be transferred from a carrier to a receive substrate while in contact with the bubble, and a transfer material with a reactive portion and die contact portion to support and form a bubble for die transfer.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If laser assisted transfer is used to transfer LED die from carrier to receive substrate, then transfer speed and productivity can be improved, but accurate placement and alignment become more difficult to control
Why choose this principle:
A transfer material is introduced as an intermediary between the die and carrier. This transfer material includes a reactive portion that forms a bubble when exposed to light energy, and a die contact portion that interfaces with the die. The bubble acts as a mediator to transfer the die from the carrier to the receive substrate, enabling both rapid transfer and precise placement control.
Principle concept:
If laser assisted transfer is used to transfer LED die from carrier to receive substrate, then transfer speed and productivity can be improved, but accurate placement and alignment become more difficult to control
Why choose this principle:
The transfer material undergoes a parameter change when the reactive portion is exposed to light energy, transforming from a non-reactive state to forming a bubble. This parameter change (formation of bubble) enables controlled transfer of the die, allowing the system to achieve both high speed and high precision by controlling when and where the bubble forms.
Application Domain
Data Source
AI summary:
A method and system utilizing a transfer material that forms a bubble upon exposure to light energy, allowing the die to be transferred from a carrier to a receive substrate while in contact with the bubble, and a transfer material with a reactive portion and die contact portion to support and form a bubble for die transfer.
Abstract
A method of transferring a die from a carrier to a receive substrate is provided. The method includes the steps of: (a) supporting a die on a carrier, a transfer material being provided between the die and the carrier; (b) exposing the transfer material to light energy to form a bubble in the transfer material; and (c) transferring the die from the carrier to a receive substrate using the bubble, the die being in contact with the bubble when the die contacts the receive substrate.