Composite Electroplated Substrate for Crack-Resistant LEDs
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Summary
Problems
Vertical type light-emitting diodes (LEDs) often crack during manufacturing due to differences in thermal expansion coefficients of materials, affecting their lifetime, and high temperature processes for composite electroplating are not suitable for light-emitting diode chip production.
Innovation solutions
A light-emitting diode structure incorporating a composite electroplated substrate with a reflective layer, seed layer, interfacial layer, intermediate layer, and protection layer, utilizing materials like copper-diamond, nickel-silicon carbide, and multiple-film layers to manage thermal expansion and stress, including materials such as copper, gold, nickel, and titanium for enhanced thermal conductivity and toughness.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If metal matrix composite material is produced by fusing materials in a high temperature process, then high thermal conductivity and low thermal expansion coefficient are achieved, but the process is not suitable for light-emitting diode chip manufacturing
Why choose this principle:
The patent changes the processing parameters from high temperature fusion to low temperature electroplating process. The electroplating process operates at temperatures suitable for LED chip manufacturing while still achieving composite material formation with desired thermal properties.
Principle concept:
If metal matrix composite material is produced by fusing materials in a high temperature process, then high thermal conductivity and low thermal expansion coefficient are achieved, but the process is not suitable for light-emitting diode chip manufacturing
Why choose this principle:
The patent replaces the thermal fusion process with an electrochemical deposition process. Instead of using high temperature to fuse materials, electroplating is used to deposit composite material layers onto the substrate, achieving the same functional result through a different physical mechanism.
Application Domain
Data Source
AI summary:
A light-emitting diode structure incorporating a composite electroplated substrate with a reflective layer, seed layer, interfacial layer, intermediate layer, and protection layer, utilizing materials like copper-diamond, nickel-silicon carbide, and multiple-film layers to manage thermal expansion and stress, including materials such as copper, gold, nickel, and titanium for enhanced thermal conductivity and toughness.
Abstract
The application is related to a method of forming a substrate of a light-emitting diode by composite electroplating. The application illustrates a light-emitting diode comprising the following elements: a light-emitting epitaxy structure, a reflective layer disposed on the light-emitting epitaxy structure, a seed layer disposed on the reflective layer, a composite electroplating substrate disposed on the seed layer by composite electroplating, and a protection layer disposed on the composite electroplating substrate.