Copper Paste for Enhanced Conductivity and Adhesion
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Summary
Problems
Copper pastes face challenges with oxidation, insufficient sintering, and low bonding strength, particularly when fired at low temperatures, leading to reduced electrical conductivity and mechanical strength, and issues with solvent residues and odor in existing formulations.
Innovation solutions
A copper paste using a combination of two or more different alcohols as a dispersion medium, with specific viscosity and boiling point ranges, and a polysaccharide or fatty acid coating on copper particles to enhance oxidation resistance and bonding strength, allowing for high-temperature sintering without resin components.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If conventional copper paste formulations are used, then manufacturing process is simple, but printing quality and adhesion are insufficient
Why choose this principle:
The patent uses a composite material system consisting of copper powder, glass powder, and organic vehicle forming a slurry paste. This composite formulation improves printing quality and adhesion by combining materials with complementary properties – copper powder provides conductivity, glass powder provides adhesion and planarization, and the organic vehicle provides proper rheology for screen printing
Principle concept:
If conventional copper paste formulations are used, then manufacturing process is simple, but printing quality and adhesion are insufficient
Why choose this principle:
The patent specifies precise parameter ranges for the paste formulation: copper powder particle size (0.5-5 μm), glass powder composition (specific ratios of oxides), and viscosity control (100-500 cP). By optimizing these parameters, the paste achieves improved printing quality and adhesion while maintaining manufacturability
Application Domain
Data Source
AI summary:
A copper paste using a combination of two or more different alcohols as a dispersion medium, with specific viscosity and boiling point ranges, and a polysaccharide or fatty acid coating on copper particles to enhance oxidation resistance and bonding strength, allowing for high-temperature sintering without resin components.
Abstract
Provided is a copper paste containing a copper powder and an organic solvent, wherein the organic solvent is an alcohol-based solvent containing one or more first alcohols selected from the group consisting of monohydric and dihydric alcohols having a viscosity at 20°C of 30-70 mPa·s, and one or more second alcohols selected from the group consisting of dihydric and trihydric alcohols having a viscosity at 20°C of 300-1000 mPa·s.