Cryogenic Electrostatic Chuck for Precise Etching
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Summary
Problems
Existing electrostatic chucks used in semiconductor manufacturing processes are not capable of operating effectively in cryogenic ranges, leading to substrate temperature control issues and etching profile degradation due to thermal expansion mismatches between chuck materials, resulting in breakage and inefficient substrate transfer.
Innovation solutions
A cryogenic electrostatic chuck system with a substrate holder and a body featuring a thermal conductivity adjustment channel made of metal-based materials, using a gas supply unit to adjust thermal conductivity based on pressure, ensuring temperature uniformity and stability for cryogenic processes.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the electrostatic chuck is operated at a cryogenic range, then the temperature control for cryogenic processes is improved, but the chuck breaks due to thermal expansion mismatch between aluminum chuck body and ceramic substrate holder
Why choose this principle:
The patent changes the material parameter (coefficient of thermal expansion) of the chuck body from aluminum to Invar alloy, which has a CTE of 1.2×10^-6/°C. This parameter change allows the chuck body to match the thermal expansion characteristics of the ceramic substrate holder at cryogenic temperatures, preventing structural failure while maintaining cryogenic temperature control capability
Principle concept:
If the electrostatic chuck is operated at a cryogenic range, then the temperature control for cryogenic processes is improved, but the chuck breaks due to thermal expansion mismatch between aluminum chuck body and ceramic substrate holder
Why choose this principle:
The patent employs a composite structure where the chuck body is made of Invar alloy and the substrate holder is made of ceramic materials. This composite material approach combines the low thermal expansion properties of Invar with the electrical insulation and mechanical strength of ceramic, creating aChuck system that can withstand cryogenic temperatures without breaking
Application Domain
Data Source
AI summary:
A cryogenic electrostatic chuck system with a substrate holder and a body featuring a thermal conductivity adjustment channel made of metal-based materials, using a gas supply unit to adjust thermal conductivity based on pressure, ensuring temperature uniformity and stability for cryogenic processes.
Abstract
A cryogenic electrostatic chuck system and a method for controlling the same according to a preferred embodiment of the present invention is capable of performing a cryogenic process for a substrate, such as a cryogenic etching process and a cryogenic deposition process, even in a cryogenic range, and is capable of implementing a vertical etch profile, which is ideal for feature etching, with a high aspect ratio.