Dissolvable Layer Solution for Flexible Display Manufacturing
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Summary
Problems
Conventional methods for separating a flexible base from a carrier substrate in flexible display panel manufacturing, such as mechanical peeling and laser separation, result in damage to the flexible base and performance degradation of thin film transistors due to heat and irradiation effects.
Innovation solutions
A flexible display motherboard with a dissolvable layer between the carrier substrate and the flexible base, which is dissolved by a solvent to separate the flexible display panel without mechanical peeling or laser irradiation, thereby minimizing damage and maintaining display device performance.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If mechanical separation is used to separate the flexible base from the carrier substrate, then the separation process is simple, but it causes a great quantity of micro-particles, incomplete peeling and serious damage to the flexible base
Why choose this principle:
The patent introduces a release layer as an intermediary between the flexible base and the carrier substrate. This release layer enables clean separation by providing a dedicated interface that peels away from the flexible base without damaging it, while allowing the flexible base to be completely separated from the carrier substrate without leaving micro-particles or causing incomplete peeling.
Principle concept:
If laser separation is used to separate the flexible base from the carrier substrate, then micro-particles are reduced and process precision is improved, but high heat causes carbonization in the irradiated region affecting substrate transmittance and laser irradiation penetrates the substrate causing thin film transistor threshold voltage drift
Why choose this principle:
The release layer serves as a mediator that absorbs the separation energy, allowing the flexible base to be separated from the carrier substrate without direct laser irradiation of the flexible base itself. The laser irradiates the release layer which then peels away, taking the separation energy with it and preventing heat-induced carbonization and threshold voltage drift in the thin film transistors.
Application Domain
Data Source
AI summary:
A flexible display motherboard with a dissolvable layer between the carrier substrate and the flexible base, which is dissolved by a solvent to separate the flexible display panel without mechanical peeling or laser irradiation, thereby minimizing damage and maintaining display device performance.
Abstract
A flexible display motherboard and a manufacturing method thereof are provided. The flexible display motherboard includes a carrier substrate and a flexible display panel unit formed thereon. The flexible display panel unit includes a flexible base formed on the carrier substrate, and a display region and a periphery region which are positioned on the flexible base. A display device is formed in the display region, and the periphery region surrounds the display region. The flexible display panel unit further includes a dissolvable layer positioned between the carrier substrate and the flexible base. The dissolvable layer is formed at least in an area corresponding to the display region. The dissolvable layer is dissolvable in a solvent.