Dynamic Contamination Control in Semiconductor Lithography
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Summary
Problems
The lithography process in semiconductor manufacturing is hindered by contamination from solidified photoresist residue in the drain cup structure, which can clog ventilation systems, leading to reduced productivity and yield.
Innovation solutions
A sensor and flow meter system monitors contamination levels, triggering solvent dispensing to decontaminate the drain cup structure dynamically, ensuring timely cleaning and maintaining ventilation efficiency.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If manual maintenance and cleaning schedules are used, then contamination is eventually removed, but productivity is reduced due to unnecessary maintenance interruptions
Why choose this principle:
The system employs sensors (optical, acoustic, or mass flow sensors) that continuously monitor contamination levels in the drain cup structure and provide feedback to the controller. The controller adjusts cleaning operations based on actual contamination levels, triggering solvent dispensing only when contamination thresholds are exceeded, thereby eliminating unnecessary maintenance interruptions while ensuring contamination is removed when needed.
Principle concept:
If manual maintenance and cleaning schedules are used, then contamination is eventually removed, but productivity is reduced due to unnecessary maintenance interruptions
Why choose this principle:
The lithography apparatus performs its own maintenance through an automated cleaning system. When sensors detect contamination levels exceeding predefined thresholds, the controller automatically triggers solvent dispensing through dispensing structures, and the system self-regulates the cleaning process without external intervention, maintaining both reliability and productivity.
Application Domain
Data Source
AI summary:
A sensor and flow meter system monitors contamination levels, triggering solvent dispensing to decontaminate the drain cup structure dynamically, ensuring timely cleaning and maintaining ventilation efficiency.
Abstract
The present disclosure describes a lithography apparatus comprising a photoresist coating unit configured to perform one or more coating processes on a substrate. The lithography apparatus further comprises a detection unit configured to determine a contamination level of a contaminant from the one or more coating processes adheres on a sidewall of the lithography apparatus. The lithography apparatus further comprises a controller unit configured to adjust one or more operations of the lithography apparatus based on a comparison between the contamination level and a baseline cleanliness requirement of the lithography apparatus.