Efficient Packaging for Miniaturized System-in-Package Structures
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Summary
Problems
The increasing miniaturization of integrated circuits leads to smaller package units and jigs, making handling difficult and resulting in low throughput and yield due to the complexity in bonding upper component stacks to units during the packaging process.
Innovation solutions
A method where a plurality of unsawed bottom units, each comprising a package substrate and a die, are placed on a jig, with upper component stacks bonded using solder balls, and a reflow process is performed to join them, allowing for easier handling and increased throughput.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the size of integrated circuits is downscaled to increase productivity, then the productivity improves, but the handling difficulty increases and yield decreases
Why choose this principle:
Multiple bottom units are kept connected through the package substrate strip during bonding operations, merging multiple handling operations into a single unified process. This eliminates the need to handle individual small jigs separately, thereby maintaining productivity while reducing handling difficulty.
Principle concept:
If the size of integrated circuits is downscaled to increase productivity, then the productivity improves, but the handling difficulty increases and yield decreases
Why choose this principle:
The package substrate strip is divided into multiple bottom units that remain connected during processing. This segmentation allows the system to process multiple units simultaneously while maintaining ease of handling through the continuous strip structure, resolving the contradiction between productivity and handling ease.
Application Domain
Data Source
AI summary:
A method where a plurality of unsawed bottom units, each comprising a package substrate and a die, are placed on a jig, with upper component stacks bonded using solder balls, and a reflow process is performed to join them, allowing for easier handling and increased throughput.
Abstract
A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.