Electrostatic Chuck Design for Improved Reliability and Thermal Control
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Summary
Problems
Existing electrostatic chuck devices face issues with breakdowns and non-uniform temperature distribution due to organic adhesive layers and differences in adhesive thickness, leading to electrical short-circuits and inadequate heat transfer.
Innovation solutions
A configuration where a sheet-shaped or film-shaped first insulating member is adhered to the ceramic plate's surface to cover the internal electrode, and a second insulating member is applied to the cooling base with a heating member on top, integrated through an organic adhesive layer to prevent breakdowns and ensure uniform voltage application.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If an organic adhesive layer is used to integrate the electrostatic chuck portion and cooling base portion, then the components can be easily assembled, but non-uniform adhesive distribution causes electrical breakdowns between the electrostatic chuck portion and cooling base portion
Why choose this principle:
A sheet-shaped insulating member is introduced as an intermediary component between the electrostatic chuck portion and cooling base portion. This insulating member serves as a reliable electrical barrier that prevents breakdowns, while the organic adhesive layer continues to provide easy assembly and bonding functionality.
Principle concept:
If an organic adhesive layer is used to integrate the electrostatic chuck portion and cooling base portion, then the components can be easily assembled, but non-uniform adhesive distribution causes electrical breakdowns between the electrostatic chuck portion and cooling base portion
Why choose this principle:
The structure combines multiple materials with different functions: the sheet-shaped insulating member provides electrical insulation, the organic adhesive layer provides bonding and assembly ease, and together they form a composite structure that achieves both reliability and ease of manufacture.
Application Domain
Data Source
AI summary:
A configuration where a sheet-shaped or film-shaped first insulating member is adhered to the ceramic plate's surface to cover the internal electrode, and a second insulating member is applied to the cooling base with a heating member on top, integrated through an organic adhesive layer to prevent breakdowns and ensure uniform voltage application.
Abstract
Provided is an electrostatic chuck device in which breakdown between an electrostatic chuck portion and a cooling base portion can be prevented, voltage endurance can be improved, uniformity in the in-plane temperature of a mounting surface of the electrostatic chuck portion where a plate-shaped sample is mounted can be improved, and voltage endurance of a heating member can be improved by applying a uniform voltage between the electrostatic chuck portion and the cooling base portion. An electrostatic chuck device ( 10 ) includes: an electrostatic chuck portion ( 11 ) that includes a ceramic plate-shaped body and an internal electrode 18 for electrostatic adsorption; and a cooling base portion ( 12 ) that adjusts a temperature of the internal electrode ( 18 ) for electrostatic adsorption, in which a first insulating member ( 20 ) is adhered to a second main surface of the ceramic plate-shaped body through a first adhesive ( 19 ) so as to cover a periphery of the internal electrode for electrostatic adsorption ( 18 ), a second insulating member ( 14 ) is adhered to a top surface of the cooling base portion ( 12 ) through a second adhesive ( 13 ), a heating member ( 15 ) is provided on a top surface of the second insulating member ( 14 ), and the electrostatic chuck portion ( 11 ) and the cooling base portion ( 12 ) are adhered to each other and integrated through an organic adhesive layer ( 16 ).