Inductive Component Design for Reliable Semiconductor Devices
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Summary
Problems
As semiconductor devices integrate more components into a given area, challenges arise in manufacturing due to increased integration density, particularly in forming inductive components with precise electrical properties and avoiding issues like cracking and unpredictable shape/size of conductive features.
Innovation solutions
A method involving a double exposure process for forming a polymer layer with a concave shape, combined with slanted sidewalls and adjustable angles, is used to create an inductive component with tunable electrical properties, reducing cracking and ensuring consistent inductance and coupling factors.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If conventional single exposure process is used to form polymer layer, then manufacturing process is simple, but polymer layer shape is unpredictable and leads to inconsistent inductance values
Why choose this principle:
The exposure process is segmented into multiple sequential exposure steps, where each exposure uses a different mask pattern to progressively define the polymer layer shape. This segmentation allows precise control over the final polymer profile, ensuring consistent inductance values while managing complexity through systematic process breakdown.
Principle concept:
If conventional single exposure process is used to form polymer layer, then manufacturing process is simple, but polymer layer shape is unpredictable and leads to inconsistent inductance values
Why choose this principle:
Mask patterns are designed and prepared in advance with specific geometric features that pre-determine the desired polymer layer shape. The masks are crafted beforehand to account for photoresist behavior and development characteristics, enabling predictable polymer formation without requiring complex real-time adjustments during exposure.
Application Domain
Data Source
AI summary:
A method involving a double exposure process for forming a polymer layer with a concave shape, combined with slanted sidewalls and adjustable angles, is used to create an inductive component with tunable electrical properties, reducing cracking and ensuring consistent inductance and coupling factors.
Abstract
A method of forming a semiconductor device includes: forming a passivation layer over a conductive pad that is disposed over a substrate; and forming an inductive component over the passivation layer, including: forming a first insulation layer and a first magnetic layer successively over the passivation layer; forming a first polymer layer over the first magnetic layer; forming a first conductive feature over the first polymer layer; forming a second polymer layer over the first polymer layer and the first conductive feature; patterning the second polymer layer, where after the patterning, a first sidewall of the second polymer layer includes multiple segments, where an extension of a first segment of the multiple segments intersects the second polymer layer; and after patterning the second polymer layer, forming a second insulation layer and a second magnetic layer successively over the second polymer layer.