Inductor Component Manufacturing: Reducing Resistance Variations
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Summary
Problems
Inductor components with inductor electrodes within insulating layers face increased resistance and reliability issues due to lamination skew, leading to variations in resistance values and heat emission when current is applied, which affects their performance and reliability.
Innovation solutions
The method involves manufacturing inductor components by first completing the inductor electrode and then embedding it in a single-layer resin structure, eliminating lamination skew and reducing connection resistance through ultrasonic bonding, thereby maintaining consistent characteristics and reliability.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If column-shaped conductors are formed as via conductors or through-hole conductors in each magnetic layer and stacked in an overlapping manner, then the inductor electrode can be formed within the multilayer substrate, but lamination skew results in smaller connected surface area between adjacent conductors, increasing resistance value and causing variation in resistance value
Why choose this principle:
The patent divides the formation process into separate stages: first forming the inductor electrode structure on a support plate, then separately forming the resin layer with via holes, and finally assembling them. This segmentation eliminates the lamination skew problem that occurs when trying to align conductors across multiple magnetic layers simultaneously.
Principle concept:
If column-shaped conductors are formed as via conductors or through-hole conductors in each magnetic layer and stacked in an overlapping manner, then the inductor electrode can be formed within the multilayer substrate, but lamination skew results in smaller connected surface area between adjacent conductors, increasing resistance value and causing variation in resistance value
Why choose this principle:
The support plate serves as an intermediary substrate that holds the inductor electrode structure during manufacturing. This intermediary allows precise positioning of column-shaped conductors before final assembly, eliminating positioning errors that would occur during direct lamination of multiple layers.
Application Domain
Data Source
AI summary:
The method involves manufacturing inductor components by first completing the inductor electrode and then embedding it in a single-layer resin structure, eliminating lamination skew and reducing connection resistance through ultrasonic bonding, thereby maintaining consistent characteristics and reliability.
Abstract
An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.