Infrared Light Cutting in Miniaturized Camera Systems
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Summary
Problems
The existing semiconductor imaging instruments require a thick infrared light cutting filter, which hinders miniaturization, especially in devices like mobile phones, and adds to manufacturing costs due to the need for additional processing steps and materials.
Innovation solutions
A semiconductor imaging instrument with a color filter layer containing an infrared light absorbing dye is integrated onto the imaging device array, providing both infrared light cutting and high visible light transmissibility, eliminating the need for a separate infrared light cutting filter and reducing manufacturing complexity.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a separate infrared light cutting filter is mounted on the camera optical system, then infrared light cutting function is achieved, but the thickness of the optical system increases and miniaturization becomes difficult
Why choose this principle:
The patent combines the infrared light cutting function with the color filter layer by incorporating an infrared light absorbing dye into the color filter. This merging eliminates the need for a separate infrared cut filter, thereby reducing the overall thickness of the optical system while maintaining both color filtering and infrared cutting functions.
Principle concept:
If a separate infrared light cutting filter is mounted on the camera optical system, then infrared light cutting function is achieved, but the thickness of the optical system increases and miniaturization becomes difficult
Why choose this principle:
The color filter layer is designed to perform multiple functions: color separation and infrared light cutting. By making the color filter layer universal, the patent eliminates the need for additional dedicated infrared cut filters, thus reducing optical system thickness without compromising infrared cutting performance.
Application Domain
Data Source
AI summary:
A semiconductor imaging instrument with a color filter layer containing an infrared light absorbing dye is integrated onto the imaging device array, providing both infrared light cutting and high visible light transmissibility, eliminating the need for a separate infrared light cutting filter and reducing manufacturing complexity.
Abstract
A semiconductor imaging instrument is disclosed, including a prescribed substrate, an imaging device array provided on the substrate and having plural semiconductor imaging devices and electrodes for outputting a signal charge upon photoelectric conversion of received light, and a color filter layer provided on the imaging device array, with an infrared light absorbing dye being contained in the color filter layer.