Integrated Spacer Design for Efficient Power Modules
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Summary
Problems
Existing double-sided cooling power modules face challenges in maintaining electrical conductivity and spacing between substrates without separate spacers, which can be tilted during bonding, increase manufacturing costs, and hinder heat dissipation due to thermal overlap and wire bonding processes.
Innovation solutions
Integrally forming spacers with the substrates, eliminating the need for separate spacers, and using conductive pastes to connect metal circuits, thereby reducing manufacturing complexity and improving heat dissipation.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If separate spacers are used to maintain space between substrates, then spacing is secured, but manufacturing complexity and costs increase
Why choose this principle:
The spacer structure is merged with the substrate by integrally forming the spacer from the substrate material itself. The spacer extends directly from the metal circuit on the substrate surface, eliminating the need for separate spacer components and reducing manufacturing steps while maintaining precise spacing between substrates
Principle concept:
If separate spacers are used for electrical conduction, then connectivity is achieved, but durability decreases due to tilting and thermal overlap consumption
Why choose this principle:
The spacer and substrate are merged into a single integral structure where the spacer extends directly from the substrate's metal circuit. This integration eliminates the interface between separate components, preventing tilting and thermal overlap consumption that would occur at junctions, thereby enhancing electrical conduction reliability and long-term durability
Application Domain
Data Source
AI summary:
Integrally forming spacers with the substrates, eliminating the need for separate spacers, and using conductive pastes to connect metal circuits, thereby reducing manufacturing complexity and improving heat dissipation.
Abstract
A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.