Leadframe Design for Efficient IC Heat Dissipation
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Summary
Problems
Thick die attach film (DAF) insulation layers in integrated circuit (IC) packages prevent heat generated by hot ICs from dissipating to the substrate, leading to increased thermal resistance between ICs and reduced heat dissipation efficiency.
Innovation solutions
A metal leadframe is disposed on the IC to conduct heat generated by the IC to a package substrate, acting as both an electrical conductor and a heat spreader, while also providing mechanical support for stacked ICs.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If thick die attach film (DAF) insulation layers are used to increase thermal resistance between hot ICs and adjacent ICs, then thermal isolation between ICs is improved, but heat dissipation from IC to substrate is prevented
Why choose this principle:
The patent segments the thermal management function by introducing a dedicated thermal via structure that separates the thermal isolation function (handled by DAF between ICs) from the heat dissipation function (handled by thermal vias to substrate). This allows simultaneous achievement of both thermal isolation and heat dissipation.
Principle concept:
If thick die attach film (DAF) insulation layers are used to increase thermal resistance between hot ICs and adjacent ICs, then thermal isolation between ICs is improved, but heat dissipation from IC to substrate is prevented
Why choose this principle:
The patent introduces thermal vias as an intermediary element between the IC and substrate. These vias act as a mediator that conducts heat away from the IC to the substrate without compromising the thermal isolation provided by the DAF layer, thus resolving the contradiction between isolation and dissipation.
Application Domain
Data Source
AI summary:
A metal leadframe is disposed on the IC to conduct heat generated by the IC to a package substrate, acting as both an electrical conductor and a heat spreader, while also providing mechanical support for stacked ICs.
Abstract
Embodiments include apparatuses, methods, and systems that may include a leadframe of a circuit package to conduct heat generated by an integrated circuit (IC) included in the circuit package, while being a part of an interconnect of the circuit package. In various embodiments, a circuit package may include a package substrate, and an IC attached to the package substrate. A leadframe may be disposed on the IC to conduct heat generated by the IC. In addition, the leadframe may be a part of an interconnect of the circuit package, and the leadframe may be electrically coupled to a component of the IC. Other embodiments may be described and/or claimed.