Reducing Acoustic Noise in Monolithic Ceramic Capacitors
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Summary
Problems
Monolithic ceramic capacitors generate acoustic noise due to electrostrictive vibrations when an AC voltage is applied, causing audible vibrations in circuit boards, which is a problem for various electronic devices.
Innovation solutions
A monolithic ceramic electronic component with a ceramic laminate body and outer electrodes featuring solder-repellent and solder-receivable portions, where the solder-repellent portion is coated with a solder-resistant film to prevent molten solder adhesion, reducing vibrations and noise by isolating the central portion of the capacitor from the circuit board.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the outer electrode is fully covered with solder to ensure secure mounting, then the mounting reliability is improved, but the acoustic noise increases due to vibration transmission
Why choose this principle:
The patent applies different surface properties to different regions of the outer electrode: the central portion has a solder-resistant film for low friction and vibration isolation, while the peripheral portions have solder-wettable surfaces for secure mounting. This local differentiation resolves the contradiction between mounting reliability and noise reduction.
Principle concept:
If the outer electrode is fully covered with solder to ensure secure mounting, then the mounting reliability is improved, but the acoustic noise increases due to vibration transmission
Why choose this principle:
The outer electrode surface is segmented into distinct functional zones: a central solder-repellent area and peripheral solder-receivable areas. This segmentation allows the electrode to simultaneously achieve secure mounting at the periphery while isolating vibrations at the center, resolving the noise-reliability tradeoff.
Application Domain
Data Source
AI summary:
A monolithic ceramic electronic component with a ceramic laminate body and outer electrodes featuring solder-repellent and solder-receivable portions, where the solder-repellent portion is coated with a solder-resistant film to prevent molten solder adhesion, reducing vibrations and noise by isolating the central portion of the capacitor from the circuit board.
Abstract
When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.