Reducing OLED Planarization Layer Roughness for Improved Display Quality
Here’s PatSnap Eureka !
Summary
Problems
The dry etching process in fabricating organic light emitting diode (OLED) display devices causes damage to the planarization layer, leading to increased roughness, which results in decreased reflectivity and variation of color coordinates due to scattered reflection.
Innovation solutions
A method involving annealing and curing the planarization layer after forming a first extension of a via-hole, followed by dry etching the passivation layer, ashing treatment, and surface treatment to reduce the roughness of the planarization layer, thereby minimizing damage and improving the surface smoothness.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If dry etching is performed on the passivation layer using the planarization layer as a mask, then via-holes are formed to connect the pixel electrode to the source/drain electrodes, but the planarization layer becomes damaged and rough due to direct contact with plasma
Why choose this principle:
An additional mask layer (photoresist or hard mask) is introduced between the planarization layer and the plasma during dry etching. This intermediary layer protects the planarization layer from direct plasma damage while still allowing precise via-hole formation through controlled etching of the mask layer and underlying passivation layer.
Principle concept:
If dry etching is performed on the passivation layer using the planarization layer as a mask, then via-holes are formed to connect the pixel electrode to the source/drain electrodes, but the planarization layer becomes damaged and rough due to direct contact with plasma
Why choose this principle:
The planarization layer undergoes preliminary annealing treatment before the dry etching process. This pre-treatment strengthens the planarization layer's resistance to plasma damage, preventing roughness formation during subsequent via-hole etching while maintaining the ability to form precise via-holes.
Application Domain
Data Source
AI summary:
A method involving annealing and curing the planarization layer after forming a first extension of a via-hole, followed by dry etching the passivation layer, ashing treatment, and surface treatment to reduce the roughness of the planarization layer, thereby minimizing damage and improving the surface smoothness.
Abstract
In a method of fabricating organic light emitting diode display, a planarization layer is annealed, cured, provided with an ashing treatment, and surface-treated to reduce roughness of the planarization layer. Therefore, it is possible to improve reduce problems such as a decrease in reflectivity and variation of color coordinates of the organic light emitting diode display due to the roughness of the planarization layer.