Efficient Optoelectronic Substrate Manufacturing via Compression Molding
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Summary
Problems
Current methods for manufacturing optoelectronic component substrates are complex and energy-intensive, particularly due to the need for vacuum deposition techniques, which are not only costly but also environmentally unsustainable, given the high energy consumption and greenhouse gas emissions associated with electric lighting.
Innovation solutions
A method involving preforming a substrate with a patterned face using thermosetting or thermoplastic polymeric materials, followed by compression molding with a reference element having a surface roughness of 50 nanometers or less, to create a substrate suitable for optoelectronic components like OLEDs and organic photovoltaic cells, utilizing additive manufacturing techniques and identical conductive and insulating materials.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If vacuum deposition techniques are used to manufacture substrate, then surface quality can be improved, but device complexity and energy consumption increase significantly
Why choose this principle:
The patent replaces the complex vacuum deposition mechanical system with a simple compression molding process. A reference element with the desired surface finish (Ra ≤ 50 nm) is pressed against the substrate during compression molding, transferring the smooth surface characteristics to the substrate without requiring vacuum facilities or complex deposition equipment.
Principle concept:
If vacuum deposition techniques are used to manufacture substrate, then surface quality can be improved, but device complexity and energy consumption increase significantly
Why choose this principle:
The patent changes the manufacturing approach from depositing material layers in vacuum to molding the substrate directly under pressure. By controlling compression molding parameters (pressure, temperature, time) and using a reference element with specified surface roughness, the substrate achieves the required surface quality through a fundamentally different physical process.
Application Domain
Data Source
AI summary:
A method involving preforming a substrate with a patterned face using thermosetting or thermoplastic polymeric materials, followed by compression molding with a reference element having a surface roughness of 50 nanometers or less, to create a substrate suitable for optoelectronic components like OLEDs and organic photovoltaic cells, utilizing additive manufacturing techniques and identical conductive and insulating materials.
Abstract
The invention relates to a method for manufacturing an optoelectronic component substrate ( 12 ) comprising a stack of layers, the method comprising a step of: preforming a substrate ( 12 ) comprising a face which has a pattern with at least one zone made of a first material and one zone made of a second material, the two materials being thermosetting or thermoplastic materials, the first material being an electrically conductive material and the second material being an electrically insulating material, and molding by compression the face of the substrate ( 12 ) with a face of a reference element ( 22 ) having a surface roughness less than or equal to 50 nanometers.