Phosphonium Catalyst for Reliable Epoxy Resin Curing
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Summary
Problems
Existing epoxy resin compositions used in semiconductor device packaging face challenges in achieving low temperature curability, high storage stability, and minimizing viscosity changes during the curing process, which affects the reliability and mechanical properties of the semiconductor devices.
Innovation solutions
A phosphonium compound is introduced as a curing catalyst in an epoxy resin composition, comprising an epoxy resin, a curing agent, and an inorganic filler, which accelerates curing at a desired temperature range while maintaining low viscosity and storage stability, ensuring reliable encapsulation of semiconductor devices.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If conventional curing catalysts are used in epoxy resin compositions, then curing can proceed at normal temperatures, but the resin composition exhibits high viscosity change and poor storage stability
Why choose this principle:
The patent introduces a phosphonium compound with specific structural parameters (Formula 1 with R1-R7 groups and alkali metal M) to change the catalytic activity parameters. This enables curing at lower temperatures (175°C) while maintaining stable viscosity and storage properties, resolving the contradiction between reliability and ease of manufacture
Principle concept:
If conventional curing catalysts are used in epoxy resin compositions, then curing can proceed at normal temperatures, but the resin composition exhibits high viscosity change and poor storage stability
Why choose this principle:
The patent creates a composite curing catalyst system combining phosphonium compound, alkali metal, and hydrocarbon groups in specific ratios (0.01-5 wt% in the resin composition). This composite structure achieves both low viscosity change during curing and high storage stability, overcoming the limitations of conventional single-component catalysts
Application Domain
Data Source
AI summary:
A phosphonium compound is introduced as a curing catalyst in an epoxy resin composition, comprising an epoxy resin, a curing agent, and an inorganic filler, which accelerates curing at a desired temperature range while maintaining low viscosity and storage stability, ensuring reliable encapsulation of semiconductor devices.
Abstract
A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1: