Precision Substrate Temperature Control Using Embedded Heating Elements
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Summary
Problems
Current temperature control systems for substrate processing in electronic device manufacturing suffer from inaccurate, real-time temperature measurements due to delays and deficiencies in feedback from embedded temperature sensors, leading to uneven processing results such as non-uniform etching or deposition across the substrate surface.
Innovation solutions
A system that utilizes direct current (DC) power to heating elements embedded in zones of a substrate support assembly, measuring voltage and current to determine the temperature of these zones, and adjusts power delivery to maintain precise temperature control through a controller that can provide instantaneous feedback and accurate temperature measurements.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If embedded temperature sensors are used to measure substrate temperature, then temperature measurement capability is provided, but measurement accuracy and real-time performance deteriorate due to feedback delays
Why choose this principle:
The patent uses the heating element as an intermediary to indirectly measure temperature. Instead of using a separate temperature sensor that introduces delay, the system measures the electrical properties (voltage, current, resistance) of the heating element itself, which change with temperature. This eliminates the need for a separate sensing mechanism and provides real-time temperature data without feedback delay.
Principle concept:
If embedded temperature sensors are used to measure substrate temperature, then temperature measurement capability is provided, but measurement accuracy and real-time performance deteriorate due to feedback delays
Why choose this principle:
The heating element is given a dual function: it both heats the substrate and serves as the temperature sensing element. By measuring the electrical properties of the heating element, the system simultaneously controls heating and monitoring functions through a single component, eliminating the time lag associated with separate temperature sensors.
Application Domain
Data Source
AI summary:
A system that utilizes direct current (DC) power to heating elements embedded in zones of a substrate support assembly, measuring voltage and current to determine the temperature of these zones, and adjusts power delivery to maintain precise temperature control through a controller that can provide instantaneous feedback and accurate temperature measurements.
Abstract
A first power is supplied to one or more heating elements embedded into a substrate support assembly of a processing chamber to control a temperature of a substrate placed on the substrate support assembly to a target substrate temperature during performance of a process according to a first process setting. A detection is made that a second process setting is to be applied in the processing chamber during the process. A temperature change of the substrate from the target substrate temperature upon application of the second process setting is determined. A second power to deliver to the heating element(s) to maintain the target substrate temperature is determined. The second power counteracts the temperature change of the substrate upon application of the second process setting. The second power is supplied to the heating element(s) to maintain the temperature of the substrate at the target substrate temperature.