Pulsed Power Control for High-Quality Magnetron Sputtering
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Summary
Problems
High-power impulse magnetron sputtering (HiPIMS) systems face limitations in deposition rate and film stress compared to DC sputtering, and are challenging for insulating substrates and reactive sputtering applications due to high instantaneous current pulses and complex AC mode operations.
Innovation solutions
An electrical power pulse generator system with a main energy storage capacitor and a kick energy storage capacitor, generating high-power pulsed plasma with a configurable positive kick pulse to control ion flux and deposition, including adjustable onset delay, amplitude, and duration, to enhance deposition rate and ionization fraction.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If high-power impulse magnetron sputtering is used to increase deposition rates and ionization fractions, then film quality and adhesion properties improve, but film stress increases and the return effect reduces net deposition
Why choose this principle:
The patent applies periodic pulsed power delivery to the magnetron sputtering system, using high-power impulses followed by lower power intervals. This periodic action allows the plasma to be repeatedly ignited at high power to achieve high ionization fractions and film quality, while the lower power intervals prevent excessive film stress accumulation and reduce the return effect, thereby maintaining net deposition rates
Principle concept:
If high-power impulse magnetron sputtering is used to increase deposition rates and ionization fractions, then film quality and adhesion properties improve, but film stress increases and the return effect reduces net deposition
Why choose this principle:
The system dynamically adjusts power levels, pulse durations, and duty cycles during the sputtering process. By varying these parameters in real-time, the system optimizes the balance between achieving high ionization for film quality and controlling film stress to maintain productivity, adapting to the evolving plasma conditions and material deposition state
Application Domain
Data Source
AI summary:
An electrical power pulse generator system with a main energy storage capacitor and a kick energy storage capacitor, generating high-power pulsed plasma with a configurable positive kick pulse to control ion flux and deposition, including adjustable onset delay, amplitude, and duration, to enhance deposition rate and ionization fraction.
Abstract
An electrical power pulse generator system and a method of the system's operation are described herein. A main energy storage capacitor supplies a negative DC power and a kick energy storage capacitor supplies a positive DC power. A main pulse power transistor is interposed between the main energy storage capacitor and an output pulse rail and includes a main power transmission control input for controlling power transmission from the main energy storage capacitor to the output pulse rail. A positive kick pulse power transistor is interposed between the kick energy storage capacitor and the output pulse rail and includes a kick power transmission control input for controlling power transmission from the kick energy storage capacitor to the output pulse rail. A positive kick pulse power transistor control line is connected to the kick power transmission control input of the positive kick pulse transistor.