Semiconductor Module Design for High-Precision Mounting
Here’s PatSnap Eureka !
Summary
Problems
Current semiconductor modules face challenges in achieving high mounting accuracy and reducing manufacturing cycle time due to difficulties in securing mounting accuracy on the X-Y plane and controlling height along the Z axis when mounting and bonding wiring substrates or sub-mounts with semiconductor elements onto heat sinks.
Innovation solutions
A semiconductor module configuration that includes a wiring substrate with semiconductor elements, a heat sink, a binder, and supports formed on the heat sink, where the binder is positioned between the wiring substrate and heat sink, and the supports are arranged to surround the binder, allowing for provisional fixation and bonding without requiring prolonged tool holding, thereby enhancing accuracy and reducing cycle time.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a binder is used to bond the wiring substrate to the heat sink, then thermal conductivity is improved, but mounting accuracy and height control deteriorate
Why choose this principle:
The bonding structure is divided into two independent parts: a binder in the die pad area for thermal bonding, and separate supports in the peripheral area for mechanical positioning. This segmentation allows each component to perform its specialized function without interfering with the other, resolving the contradiction between thermal conductivity and mounting accuracy.
Principle concept:
If a binder is used to bond the wiring substrate to the heat sink, then thermal conductivity is improved, but mounting accuracy and height control deteriorate
Why choose this principle:
The supports act as intermediary elements that provide mechanical positioning and height control during the bonding process. These supports are formed apart from the binder, allowing the wiring substrate to be accurately positioned before the binder sets, thus maintaining mounting accuracy while still achieving good thermal contact through the binder.
Application Domain
Data Source
AI summary:
A semiconductor module configuration that includes a wiring substrate with semiconductor elements, a heat sink, a binder, and supports formed on the heat sink, where the binder is positioned between the wiring substrate and heat sink, and the supports are arranged to surround the binder, allowing for provisional fixation and bonding without requiring prolonged tool holding, thereby enhancing accuracy and reducing cycle time.
Abstract
A semiconductor module includes: one or more semiconductor elements; a wiring substrate having a first surface on which the one or more semiconductor elements are mounted, the wiring substrate being electrically connected to the one or more semiconductor elements; a heat sink on which the wiring substrate is mounted, the heat sink facing a second surface of the wiring substrate on a reverse side of the first surface; a binder which is formed in a die pad area on the heat sink so as to be present between the wiring substrate and the heat sink, and bonds the wiring substrate and the heat sink; and a support which is formed in a peripheral part of the die pad area on the heat sink, and fixes the wiring substrate to the heat sink by being in contact with a peripheral part of the second surface of the wiring substrate.