Silicon-Based Microchannel Cooling for High-Power Chips
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Summary
Problems
Current IC chip heat dissipation technologies face challenges with high thermal resistance and incompatibility with low-temperature processes, particularly in embedded liquid cooling methods, which affect the efficiency and reliability of high-power chip cooling.
Innovation solutions
A silicon-based fan out package structure with embedded manifold type microchannels, featuring a chip with substrate microchannels, a silicon-based adapter plate with a groove and manifold channel, a low-temperature sealing layer, and a rewiring layer, allowing for efficient heat dissipation without the need for bulky metal fins or heat dissipation fans.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If non-embedded liquid cooling is used with metal block and multiple material interfaces, then heat dissipation structure is simple to implement, but interface thermal resistance increases and heat dissipation efficiency decreases
Why choose this principle:
The patent merges the cooling channel structure directly into the chip substrate, eliminating the separate metal block and multiple material interfaces. The microchannels are formed within the chip itself, creating a unified structure that removes interface thermal resistance while maintaining manufacturing simplicity through integrated fabrication processes.
Principle concept:
If non-embedded liquid cooling is used with metal block and multiple material interfaces, then heat dissipation structure is simple to implement, but interface thermal resistance increases and heat dissipation efficiency decreases
Why choose this principle:
The patent extracts the cooling function from a separate metal block component and integrates it directly into the chip substrate. By taking out the thermal interface materials and separate cooling structure, the design eliminates the associated interface thermal resistances while keeping the overall system manufacturable.
Application Domain
Data Source
AI summary:
A silicon-based fan out package structure with embedded manifold type microchannels, featuring a chip with substrate microchannels, a silicon-based adapter plate with a groove and manifold channel, a low-temperature sealing layer, and a rewiring layer, allowing for efficient heat dissipation without the need for bulky metal fins or heat dissipation fans.
Abstract
The present disclosure relates to a silicon-based fan out package structure including embedded manifold type microchannels, which includes: a chip, which includes a substrate and embedded microchannels located on a back of the substrate; a silicon-based adapter plate, which includes a groove for burying the chip, a manifold channel located below the groove and communicated with the groove, a liquid inlet and a liquid outlet; a low temperature sealing layer for sealingly communicating the embedded microchannels with the manifold channel, the low temperature sealing layer being located between the chip and the silicon-based adapter plate; and a rewiring layer at a top of the chip. The present disclosure also relates to a preparation method for a silicon-based fan out package structure including embedded manifold type microchannels. The silicon-based fan out package structure of the present disclosure has both low temperature process compatibility and packaging compatibility and high heat dissipation efficiency. The embedded manifold type microchannels of the present disclosure have the advantages of short flow distance, small flow resistance and small thermal resistance, and are more suitable for being integrated in high-power chips for efficient heat dissipation.