Preventing Substrate Charging in Semiconductor Processing
Here’s PatSnap Eureka !
Summary
Problems
In semiconductor device manufacturing, substrates are prone to electrical charging due to contact with resin materials in processing chambers, leading to electrical discharge and potential breakdown of surface films or devices during processing and transfer.
Innovation solutions
A substrate processing apparatus with conductive portions in the substrate holding and transfer mechanisms that are electrically grounded, ensuring the substrate remains grounded throughout handling and transfer, preventing electrical induction and discharge.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If resin materials (PTFE, PCTFE) are used for members in the processing chamber to provide chemical resistance, then chemical resistance is improved, but electrical charging of substrates occurs leading to electrical discharge and potential damage to substrate films or devices
Why choose this principle:
A conductive member is introduced as an intermediary between the substrate and the resin member. The conductive member contacts the substrate and provides a grounding path, preventing electrical charging while allowing the resin member to maintain its chemical resistance function. This intermediary element resolves the contradiction by decoupling the electrical grounding function from the chemical resistance function.
Principle concept:
If resin materials (PTFE, PCTFE) are used for members in the processing chamber to provide chemical resistance, then chemical resistance is improved, but electrical charging of substrates occurs leading to electrical discharge and potential damage to substrate films or devices
Why choose this principle:
The solution uses a composite structure combining conductive materials (such as metal or conductive coatings) with resin materials. The conductive portion provides electrical grounding to prevent substrate charging, while the resin portion maintains chemical resistance. This composite approach allows both functions to coexist without interference.
Application Domain
Data Source
AI summary:
A substrate processing apparatus with conductive portions in the substrate holding and transfer mechanisms that are electrically grounded, ensuring the substrate remains grounded throughout handling and transfer, preventing electrical induction and discharge.
Abstract
A substrate processing apparatus includes: a carrier holding unit for holding a carrier which houses a substrate; a substrate holding mechanism for holding a substrate when a predetermined process is executed on the substrate; and a substrate transfer mechanism for transferring a substrate between the substrate holding mechanism and the carrier held by the carrier holding unit. The substrate holding mechanism has a first substrate contacting member which comes in contact with the substrate when the substrate holding mechanism holds the substrate, and at least the substrate contacting portion of the first substrate contacting member includes a conductive portion, which is electrically grounded. The substrate transfer mechanism has a second substrate contacting member which comes in contact with the substrate when the substrate transfer mechanism transfers the substrate, and at least the substrate contacting portion of the second substrate contacting member includes a conductive portion, which is electrically grounded.