Simplified Substrate Manufacturing with Laser-Resistant Patterns
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Summary
Problems
The existing methods for embedding electronic components in circuit substrates are complex and difficult due to the need for precise laser drilling through a solder mask layer, which complicates the process and reduces production yield, especially with thin core layers.
Innovation solutions
A substrate structure with a core layer, patterned metallic pads, and dielectric layers, where a laser-resistant metallic pattern surrounds the component-disposing area, allowing for simultaneous formation of dielectric layers inside and outside the area, and preventing laser penetration, simplifying the process and improving yield.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a solder mask layer is formed and laser drilling is used to create open holes for component disposal, then electronic components can be buried in the substrate, but the process becomes complicated and difficult to control due to the need for accurate laser depth control through thin core layers
Why choose this principle:
The invention extracts and removes the solder mask layer from the substrate structure. By eliminating this layer, the complex process of forming precise open holes through laser drilling is avoided, as there is no need to control laser penetration through the solder mask. The component disposal area is created directly in the core layer without requiring a solder mask overlay.
Principle concept:
If a solder mask layer is formed and laser drilling is used to create open holes for component disposal, then electronic components can be buried in the substrate, but the process becomes complicated and difficult to control due to the need for accurate laser depth control through thin core layers
Why choose this principle:
Instead of forming open holes through the solder mask layer using laser drilling (the conventional approach), the invention inverts the approach by creating the component disposal area directly in the core layer first, then forming dielectric layers over it. This reverses the traditional sequence and eliminates the need for precise laser depth control through thin layers.
Application Domain
Data Source
AI summary:
A substrate structure with a core layer, patterned metallic pads, and dielectric layers, where a laser-resistant metallic pattern surrounds the component-disposing area, allowing for simultaneous formation of dielectric layers inside and outside the area, and preventing laser penetration, simplifying the process and improving yield.
Abstract
A process for a substrate having a component-disposing area is provided, and includes the following steps. A core layer including a first surface, a metallic layer and a component-disposing area is provided. The metallic layer is disposed on the first surface and patterned to form a patterned metallic layer including pads located in the component-disposing area. A first dielectric layer is formed on the first surface and covers the patterned metallic layer. A laser-resistant metallic pattern is formed on the first dielectric layer and surrounds a projection area of the first dielectric layer. A release film is disposed on the projection area and covers a portion of the laser-resistant metallic pattern within the projection area. A second dielectric layer is formed on the first dielectric layer and covers the release film and the laser-resistant metallic pattern. A first open hole and a plurality of second open holes are formed.