Surface-Mount Connector Design for Improved Solderability
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Summary
Problems
The existing surface-mount connector technology faces challenges in achieving uniform height and coplanarity of connectors, leading to poor solderability and reduced product yield due to difficulties in controlling the thickness of solder paste and deformation during the reflow process.
Innovation solutions
The proposed surface-mount connector design includes a first end part bonded to the first circuit board and a second end part with a sidewall and receptacle for receiving a solder bump, which is partially protruded and bonded to the second circuit board, providing a cushioning effect and ensuring electrical connection despite height differences, and optionally features a non-solderable primer to prevent overflow.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If traditional surface-mount connectors are used with solder paste, then electrical connection between circuit boards is achieved, but height differences and poor solderability occur due to uncontrollable solder paste thickness and circuit board deformation
Why choose this principle:
The patent introduces a solder bump as an intermediary element between the surface-mount connector and the solder paste. The solder bump acts as a mediator that compensates for height differences caused by solder paste thickness variations and circuit board deformation, ensuring reliable electrical connection and improving solderability without requiring high coplanarity of the connectors.
Principle concept:
If traditional surface-mount connectors are used with solder paste, then electrical connection between circuit boards is achieved, but height differences and poor solderability occur due to uncontrollable solder paste thickness and circuit board deformation
Why choose this principle:
The solder bump serves as a pre-positioned cushioning element that anticipates and compensates for potential height differences before the soldering process. By placing the solder bump on the solder paste beforehand, the system pre-adapts to variations in solder paste thickness and circuit board deformation, ensuring consistent electrical connection despite manufacturing tolerances.
Application Domain
Data Source
AI summary:
The proposed surface-mount connector design includes a first end part bonded to the first circuit board and a second end part with a sidewall and receptacle for receiving a solder bump, which is partially protruded and bonded to the second circuit board, providing a cushioning effect and ensuring electrical connection despite height differences, and optionally features a non-solderable primer to prevent overflow.
Abstract
The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first end part and a second end part. The first end part is bonded onto the first circuit board. The second end part has a sidewall and a receptacle defined within the sidewall for receiving a solder bump therein. The solder bump is partially protruded from the sidewall and bonded onto the second circuit board such that the first circuit board and the second circuit board are electrically connected to each other.