Thermal Interface Material for Efficient Heat Transfer
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Summary
Problems
Current thermally conductive materials for electronic devices, such as pastes and pads, face challenges including messy handling, high thermal resistance, and limited applicability on non-planar surfaces, as well as difficulties in reworkability and thermal conductivity.
Innovation solutions
A thermal interface material composed of a blend of acrylic polymers, liquid and solid resins, and thermally conductive particles, which forms a film or tape for easy application and handling, providing low thermal resistance and reworkability without the need for solvents or heat, and is suitable for both planar and non-planar surfaces.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If paste-like thermally conductive material is used, then thermal resistance is reduced, but handling becomes messy and difficult
Why choose this principle:
The invention changes the physical state parameter of the thermal interface material from liquid/semi-solid paste to solid foam structure. This parameter change allows the material to maintain low thermal resistance while providing easy handling and application as a solid material that can be cut and positioned without messy spreading.
Principle concept:
If paste-like thermally conductive material is used, then thermal resistance is reduced, but handling becomes messy and difficult
Why choose this principle:
The invention creates a composite material structure by incorporating thermally conductive particles (such as aluminum oxide, zinc oxide, or boron nitride) into a foam matrix. This composite structure combines the low thermal resistance benefit of particle-filled materials with the handling advantages of foam structure, resolving the contradiction between thermal performance and ease of operation.
Application Domain
Data Source
AI summary:
A thermal interface material composed of a blend of acrylic polymers, liquid and solid resins, and thermally conductive particles, which forms a film or tape for easy application and handling, providing low thermal resistance and reworkability without the need for solvents or heat, and is suitable for both planar and non-planar surfaces.
Abstract
A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of acrylic polymer, one or more liquid resins, conductive filler particles and optionally one or more solid resins.