Efficient Thermal Management in Semiconductor Packages
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Summary
Problems
Semiconductor packages face thermal management challenges as individual chips generate excessive heat, degrading system performance or causing failure due to inadequate heat dissipation.
Innovation solutions
The semiconductor package design incorporates a wiring structure with separate signal and heat transfer wiring, an active chip, passive chip, heat transferring terminals, and a heat spreader to create efficient thermal pathways for heat dissipation, utilizing a thermal interface material and encapsulants to manage heat effectively.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If multiple semiconductor chips are mounted in a single package to increase functional density, then the quantity of components and system functionality are improved, but heat generation increases and thermal management becomes inadequate
Why choose this principle:
The patent divides the thermal management function into separate components: heat transfer wiring layers, heat transferring terminals, passive chips, and heat spreaders. This segmentation allows heat to be managed through multiple discrete pathways rather than a single integrated solution, enabling better thermal control in high-density packages.
Principle concept:
If multiple semiconductor chips are mounted in a single package to increase functional density, then the quantity of components and system functionality are improved, but heat generation increases and thermal management becomes inadequate
Why choose this principle:
The patent introduces intermediary thermal management components between the active chips and the package substrate. Heat transferring terminals act as intermediaries to conduct heat away from active chips, while passive chips and heat spreaders serve as intermediate heat distribution elements, facilitating efficient thermal pathways without requiring direct contact between active chips and the package substrate.
Application Domain
Data Source
AI summary:
The semiconductor package design incorporates a wiring structure with separate signal and heat transfer wiring, an active chip, passive chip, heat transferring terminals, and a heat spreader to create efficient thermal pathways for heat dissipation, utilizing a thermal interface material and encapsulants to manage heat effectively.
Abstract
A semiconductor package includes; a wiring structure including signal wiring and heat transfer wiring, an active chip on the wiring structure, a signal terminal disposed between the wiring structure and the active chip, a first heat transferring terminal disposed between the wiring structure and the active chip and connected to the heat transfer wiring, a passive chip on the wiring structure, a second heat transferring terminal disposed between the wiring structure and the passive chip and connected to the heat transfer wiring, and a heat spreader on the passive chip.