Thermal Sensor Integration for Accurate Cooking Temperature
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Summary
Problems
Existing cooking vessels with thermal sensors often inaccurately measure food exposure temperature due to suboptimal sensor positioning, leading to issues like undercooking or overcooking, particularly for less experienced cooks.
Innovation solutions
A cookware apparatus with a thermal sensor positioned within a channel extending through the bottom and sidewall of the vessel, allowing the sensor to accurately measure food exposure temperature while being protected from external heat, and connected to an electronic circuit for temperature determination.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the thermal sensor is positioned in typical cookware locations, then the sensor can be easily integrated into the vessel structure, but the sensor inaccurately measures food exposure temperature due to exposure to external heat and suboptimal positioning
Why choose this principle:
The thermal sensor is segmented from the main vessel body and positioned in a dedicated channel that extends through the bottom and sidewall. This segmentation allows the sensor to be isolated from external heat sources while maintaining structural integration through the channel design.
Principle concept:
If the thermal sensor is positioned in typical cookware locations, then the sensor can be easily integrated into the vessel structure, but the sensor inaccurately measures food exposure temperature due to exposure to external heat and suboptimal positioning
Why choose this principle:
The channel structure acts as an intermediary between the vessel exterior and the thermal sensor. It provides a protected pathway that allows the sensor to measure internal temperature without being directly exposed to external heat, mediating the thermal interaction.
Application Domain
Data Source
AI summary:
A cookware apparatus with a thermal sensor positioned within a channel extending through the bottom and sidewall of the vessel, allowing the sensor to accurately measure food exposure temperature while being protected from external heat, and connected to an electronic circuit for temperature determination.
Abstract
A cooking vessel with a thermal sensor is provided. A cooking apparatus (1000) includes a vessel (1002). The vessel (1002) has a bottom (1005), and a sidewall (1010) surrounding the bottom (1005) and extending upward from the bottom (1005) so as to form a fluid retaining interior region (1003). The sidewall (1010) terminates at a rim (1018). The vessel (1002) also includes a channel (1015) extending through a portion of the bottom (1005) and further extending upward into and through a portion of the sidewa1l (1010). The channel (1015) has an opening (1017) positioned in an external surface (1006) of the sidewall (1010). The cooking apparatus (1000) further includes a thermal sensor (1030) positioned within the channel (1015). The thermal sensor (1030) extends through the portion of the bottom (1005) and further extends upward into and through the portion of the sidewall (1010).