APR 7, 202659 MINS READ
Hexagonal boron nitride exhibits a layered crystallographic structure analogous to graphite, resulting in extreme thermal conductivity anisotropy: 400 W/(m·K) in the basal plane (a-axis direction) versus merely 2 W/(m·K) perpendicular to the layers (c-axis direction) 3. This anisotropy poses significant challenges when h-BN particles are dispersed in thermal greases, as conventional mixing processes induce preferential orientation with the high-conductivity planes aligned parallel to shear flow, thereby directing the low-conductivity c-axis perpendicular to the desired heat transfer path 10. Consequently, the intrinsic high thermal conductivity of h-BN remains underutilized in traditional formulations 15.
The particle morphology critically influences both thermal performance and rheological behavior. Primary h-BN particles typically exhibit platelet or scale-like geometries with long-axis dimensions ranging from 0.5 to 20 μm and aspect ratios (length/thickness) between 1.5 and 10 2,6. When incorporated into grease matrices at volume fractions of 2–20 vol%, these particles increase viscosity substantially, deteriorate wettability on substrate surfaces, and reduce the grease's ability to conform to microscopic surface roughness—collectively elevating interfacial thermal resistance 2. Research demonstrates that controlling primary particle size distribution, with 25–50% of particles below 1 μm and 50–75% in the 1–5 μm range, while limiting particles exceeding 5 μm to under 5%, enables optimal packing density and minimizes metal impurities to below 10 ppm 16.
Advanced characterization reveals that h-BN powders with crystal diameters Lc (002 plane) ≥450 Å and La (100 plane) ≥500 Å, satisfying the ratio 0.70 ≤ Lc/La and oxygen content ≤0.30 wt%, deliver superior thermal conductivity and low viscosity when formulated into resin-based thermal greases 5. The specific surface area of agglomerated h-BN particles should be maintained between 0.5 and 5.0 m²/g to balance thermal pathways with processability 6. Furthermore, the tapped bulk density ratio (tapped/loose bulk density) of ≥2.1, combined with average particle diameters ≥15 μm, facilitates higher packing densities and reduces the required filler loading to achieve target thermal conductivity, thereby lowering material costs 7,8.
To address the thermal anisotropy limitation, researchers have developed agglomerated boron nitride particles wherein primary h-BN platelets are bonded into three-dimensional secondary structures 3,10. These aggregates exhibit complex morphologies with surface irregularities that disrupt uniform orientation during mixing, promoting random spatial distribution of the high-conductivity a-axis directions 7. Patent literature describes aggregates with particle collapse strengths of 1–4 MPa, graphitization indices of 1.8–2.2, and D50 values of 30–200 μm, which maintain structural integrity during high-shear mixing while enabling efficient heat transfer pathways in multiple directions 12,16.
The fabrication of such aggregates typically involves firing mixtures of boron-containing compounds (e.g., boric acid, boron oxide) with nitrogen sources (e.g., urea, melamine) in the presence of alkali metal borates (lithium or sodium borates) at temperatures between 1550–2400°C under nitrogen atmospheres 13,16. The resulting primary particles, with long-axis dimensions of 0.6–4.0 μm and aspect ratios of 1.5–5.0, are subsequently agglomerated using controlled sintering or spray-drying techniques 6. Critical process parameters include maintaining boron impurity content at 1.00–30.00 mass% and oxygen content at 0–100 mass% to optimize both thermal conductivity and dielectric strength 12.
A proven strategy to reduce viscosity while maintaining thermal performance involves incorporating spherical fillers such as alumina (Al₂O₃), aluminum nitride (AlN), or silica alongside h-BN platelets 1,2. The spherical particles (typically 1–10 μm diameter) fill interstitial spaces between h-BN platelets, increasing overall packing density and creating continuous thermal pathways. For instance, thermal greases containing 2–20 vol% h-BN primary particles (0.5–20 μm long axis, aspect ratio 0.3–10) combined with spherical alumina fillers demonstrate significantly lower viscosity (enabling better wettability and conformability to surface irregularities) while achieving thermal conductivities exceeding 3 W/(m·K) 2.
Patent US20201229 describes a highly thermally conductive h-BN/alumina composite fabricated from commercial h-BN powders, achieving enhanced thermal conductivity through optimized filler ratios and interfacial bonding 1. The composite leverages the high in-plane conductivity of h-BN while the alumina provides mechanical reinforcement and reduces thermal contact resistance at filler-matrix interfaces. Experimental data indicate that such hybrid systems reduce interfacial thermal resistance by 20–35% compared to h-BN-only formulations at equivalent total filler loadings 2.
Surface modification of h-BN particles using coupling agents (e.g., silanes, titanates) or coating with nanoscale layers (e.g., silica aerogel, boehmite sol) improves compatibility with polymer matrices and prevents agglomeration during storage 14,15. For thermal grease applications, surface-treated aggregated boron nitride powders exhibit improved dispersion stability, reduced sedimentation rates, and enhanced wettability on metal and ceramic substrates 15. The treatment process typically involves reacting h-BN particle surfaces with organosilane compounds (e.g., aminopropyltriethoxysilane) in alcohol-water solutions at 60–80°C for 2–4 hours, followed by drying at 120°C 15.
An innovative approach involves fusing h-BN particles onto wire-shaped glass fibers using binders such as silica aerogel or boehmite sol, optionally incorporating talc to enhance vertical thermal conductivity and reduce manufacturing costs 14. This architecture increases the contact area between the filler and polymer matrix, resulting in more uniform thermal diffusion and converting the anisotropic thermal conductivity of h-BN to quasi-isotropic behavior 14. The glass fiber substrate (diameter 5–20 μm, length 100–500 μm) provides mechanical support and facilitates three-dimensional thermal network formation within the grease matrix.
The base oil or polymer matrix in h-BN thermal greases must satisfy multiple requirements: thermal stability (typically -40°C to 200°C operating range), chemical inertness, low volatility, and compatibility with h-BN fillers. Common base oils include:
For polymer-thickened greases, polypropylene (PP) at 6–12 wt% in base oil creates a short-fiber cage structure that suspends h-BN particles and prevents settling 4. The manufacturing process involves heating the PP/base oil mixture to 160–180°C to dissolve the polymer, adding 0.1–2 wt% nano-sized h-BN (10–500 nm) pre-dispersed via ultrasonication (20–40 kHz, 30–60 minutes) to reduce agglomeration, then rapidly cooling to 40–60°C to preserve the cage structure 4. This approach yields greases with thermal conductivities of 2.5–4.0 W/(m·K) and cone penetration values (ASTM D217) of 250–350 dmm, suitable for automotive and industrial lubrication applications requiring both thermal management and mechanical load-bearing 4.
The viscosity of h-BN thermal greases must be optimized to ensure (1) ease of application via dispensing or screen-printing, (2) minimal bond-line thickness (typically 25–100 μm) to reduce thermal resistance, and (3) long-term stability without phase separation or oil bleed. At filler loadings of 2–20 vol%, h-BN primary particles increase viscosity exponentially due to their high aspect ratios and tendency to form percolating networks 2. Rheological measurements (using parallel-plate or cone-and-plate geometries at 25°C, shear rates 0.1–100 s⁻¹) reveal that greases with h-BN aspect ratios of 0.3–1.0 exhibit Newtonian or weakly shear-thinning behavior (viscosity 50–200 Pa·s at 10 s⁻¹), whereas those with aspect ratios >3 display pronounced shear-thinning and yield stress (τ₀ = 50–500 Pa) 2.
Incorporating spherical alumina fillers (20–40 vol% of total filler) reduces viscosity by 30–50% at constant h-BN loading, as the spheres act as "ball bearings" that facilitate particle rearrangement under shear 2. Additionally, controlling the particle size distribution—specifically maintaining a bimodal distribution with peaks at 1–5 μm (peak A) and 20–100 μm (peak B), with height ratios (a1/a2) of 0.80–1.00 after 1-minute ultrasonication at 40 kHz—ensures optimal packing and minimizes viscosity increase 9,12.
Thermal conductivity of h-BN greases is typically measured using the transient hot-wire method (ASTM D7896) or laser flash analysis (LFA, ASTM E1461) on cured or compressed samples (thickness 0.5–2.0 mm). Representative performance data from patent literature include:
Interfacial thermal resistance (Rth) between grease and substrates (typically copper or aluminum with Ra = 0.5–2.0 μm) is measured using the ASTM D5470 steady-state method, yielding values of 0.05–0.15 cm²·K/W for optimized h-BN greases at 50 psi contact pressure 2. Lower Rth correlates with smaller h-BN primary particle size (<2 μm) and higher spherical filler content, which improve surface conformability.
Large-scale production of high-purity h-BN powders for thermal grease applications employs continuous reacting furnaces, typically pusher-type tunnel kilns, to ensure consistent crystallinity and particle morphology 13. The process comprises two stages:
Post-synthesis treatments include acid washing (HCl or HNO₃ at 60–90°C for 1–3 hours) to remove residual flux and metal contaminants, followed by water washing, drying (120–150°C, 4–8 hours), and classification via air jet milling or sieving to achieve target particle size distributions 12,13. Quality control parameters include:
Thermal grease manufacturing involves sequential mixing stages to achieve uniform filler dispersion and minimize air entrapment:
| Org | Application Scenarios | Product/Project | Technical Outcomes |
|---|---|---|---|
| United States of America as represented by the Administrator of NASA | Aerospace thermal management systems, satellite electronics cooling, and high-power space equipment requiring efficient heat dissipation with weight constraints. | Hexagonal Boron Nitride/Alumina Composite Material | Achieves higher thermal conductivity through combination of h-BN (400 W/(m·K) in-plane) with alumina, providing lightweight solution for heat dissipation applications. |
| DENKA COMPANY LIMITED | Power electronics cooling, automotive power devices, LED thermal management, and applications requiring conformal contact with microscopic surface irregularities. | Thermal Grease with Optimized h-BN Particles | Reduces interfacial thermal resistance by 20-35% using controlled h-BN primary particles (0.5-20 μm, aspect ratio 0.3-10) combined with spherical alumina fillers, achieving thermal conductivity exceeding 3 W/(m·K) while maintaining low viscosity. |
| TOKUYAMA CORPORATION | Thermal interface materials for CPUs and GPUs, insulating layers in printed wiring boards, heat dissipation sheets for consumer electronics and industrial equipment. | Agglomerated h-BN Powder for Thermal Interface Materials | Achieves enhanced packing density with tapped bulk density ratio ≥2.1 and average particle diameter ≥15 μm, enabling good thermal conductivity (3.8 W/(m·K)) at lower filling amounts, reducing material costs by 30-40%. |
| SHOWA DENKO K.K. | Insulating heat dissipation materials for power modules, high-voltage electrical equipment, and applications requiring both thermal conductivity and electrical insulation properties. | High-Purity h-BN Powder with Controlled Particle Distribution | Delivers high thermal conductivity and dielectric strength through bimodal particle size distribution (peaks at 1-5 μm and 20-100 μm) with boron impurity content 1.00-30.00 mass%, maintaining stability under ultrasonic treatment with particle size ratio 0.80-1.00. |
| CHEORWON PLASMA RESEARCH INSTITUTE | Heat dissipation sheets for smartphones and tablets, thermal pads for power electronics, and applications requiring uniform heat spreading in multiple directions. | h-BN/Glass Fiber Composite Heat Dissipation Filler | Converts anisotropic thermal conductivity to quasi-isotropic behavior by fusing h-BN particles onto wire-shaped glass fibers, enhancing vertical thermal conductivity while reducing manufacturing costs through talc addition and lower binder content. |