APR 1, 202655 MINS READ
Silicone rubber carbon filled composites are built upon organopolysiloxane base polymers, typically represented by the average composition formula RaSiO(4-a)/2, where R denotes unsubstituted or substituted monovalent hydrocarbon groups (commonly methyl, phenyl, vinyl, or trifluoropropyl) and a ranges from 1.90 to 2.05 15. The polymer backbone exhibits inherent flexibility due to the Si-O-Si linkage (bond angle ~143°, bond energy ~452 kJ/mol), conferring excellent low-temperature flexibility (glass transition temperature Tg typically -120 to -60°C) and thermal stability (continuous service temperature up to 200–250°C depending on formulation). Base polymer viscosity typically exceeds 100 mPa·s at 25°C for heat-vulcanized (HTV) systems 2, and can reach ≥250,000 mPa·s for highly filled compositions 811, ensuring adequate filler wetting and dispersion during compounding.
Carbon fillers incorporated into these matrices fall into three primary categories:
Carbon Black (CB): Furnace blacks (N-series per ASTM D1765) or thermal blacks with specific surface areas ranging from 8–200 m²/g (BET method) and dibutyl phthalate (DBP) absorption numbers of 30–280 mL/100g 917. Conductive grades typically exhibit interlayer spacing d(002) of 0.346–0.349 nm, indicating moderate graphitization 17. Silicon-treated carbon blacks, where silicon-containing compounds (e.g., alkoxysilanes) are distributed through the aggregate structure, enhance compatibility with the silicone matrix and improve hardness retention 1.
Carbon Nanotubes (CNTs): Multi-walled carbon nanotubes (MWCNTs) with average outer diameters of 50–120 nm and carbon purity ≥99.3 mass% 6, or fibrous CNTs with length-to-diameter (L/D) ratios ≥500 7. Single-walled carbon nanotubes (SWCNTs) are also employed in liquid silicone rubber (LSR) formulations for high-voltage applications 3. CNTs provide superior electrical percolation at lower loadings (1.5–4.0 mass% for MWCNTs 6) compared to carbon black (typically 20–50 phr for equivalent conductivity).
Hybrid Carbon Systems: Combinations of CNTs with carbon black 710 or graphite 10 to synergistically balance conductivity, mechanical properties, and cost. For example, incorporating CNTs with L/D ≥500 alongside carbon black reduces the total conductive filler requirement while maintaining volume resistivity ≤10⁵ Ω·cm and hardness ≤80 Shore A 10.
Surface modification of carbon fillers is critical for optimizing filler-matrix interactions. Silicon-treated carbon blacks exhibit enhanced dispersion and reduced structure breakdown during mixing 1. Silica-coated conductive carbon blacks (≥60% silica coating, ≥25 wt% silica content) enable high dielectric constant (εr > 10 at 50 Hz) while maintaining insulation resistance ≥10¹² Ω·cm, addressing the challenge of achieving high permittivity without sacrificing insulation 1314. Nickel-coated carbon particles (50–500 phr loading) provide electromagnetic shielding effectiveness while maintaining processability 15.
Silicone rubber carbon filled materials are classified according to functional performance, filler type, and curing mechanism, following industry standards such as ASTM D2000 (automotive rubber products), IEC 60502 (power cables), and ISO 1629 (rubber nomenclature). Key classification axes include:
Insulating Grades: Volume resistivity >10¹² Ω·cm, achieved with silica-coated conductive carbon black at 5–100 phr loading 1314. These materials exhibit dielectric constants of 10–30 (at 50 Hz) with dielectric loss tangent (tan δ) <0.05, suitable for stress control in high-voltage cable accessories and capacitor applications.
Semi-Conductive Grades: Volume resistivity 10³–10⁶ Ω·cm, typically formulated with thermal carbon black (specific surface area 8.0–10.0 m²/g, DBP absorption 30–40 cm³/100g, average particle size 200–330 nm) at 30–60 phr 9. These materials provide controlled field grading in cable joints and terminations.
Conductive Grades: Volume resistivity <10³ Ω·cm, achieved with high-structure carbon blacks (DBP >120 mL/100g) at >50 phr 17 or CNT loadings of 1.5–4.0 mass% 6. Surface resistivity can reach ≤300 Ω/sq for antistatic applications 16.
Tensile strength ranges from 2–10 MPa depending on filler loading and type, with elongation at break typically 100–600%. Hardness (Shore A) spans 30–80 for flexible grades and can exceed 80 for highly filled systems 10. Tear strength (ASTM D624 Die C) typically ranges from 5–25 kN/m. The incorporation of CNTs at optimized loadings (2.5–10 phr for first CNTs with diameter ≤30 nm, plus 5–15 phr for second CNTs with diameter 30–1000 nm) can maintain or enhance mechanical properties while achieving conductivity 18.
Thermally Conductive Grades: Thermal conductivity ≥0.28 W/m·K achieved by combining 40–400 phr thermally conductive powder (e.g., silicon metal, thermal conductivity ≥10 W/m·K, average particle size ≤30 μm) with 1–50 phr carbon black 19. These materials serve in development rolls for electrophotographic imaging systems where heat dissipation is critical.
Standard Thermal Stability: Continuous service temperature 150–200°C, with thermogravimetric analysis (TGA) showing 5% weight loss onset >350°C in nitrogen atmosphere. Thermal expansion coefficient typically 200–300 ppm/°C.
Addition-Cure (Platinum-Catalyzed): Employs vinyl-functional organopolysiloxanes cross-linked with organohydrogenpolysiloxanes in the presence of platinum catalysts (typically Karstedt's catalyst at 1–50 ppm Pt). This system enables low-temperature curing (80–150°C) and produces no volatile by-products, making it suitable for precision molding and LSR applications 319. Carbon black can inhibit platinum catalysts through adsorption; silicon-treated blacks or CNTs mitigate this issue 116.
Peroxide-Cure: Uses organic peroxides (e.g., 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane at 0.1–10 phr) to generate free radicals that cross-link vinyl-containing polysiloxanes at 150–200°C 1519. This system tolerates higher carbon black loadings but generates volatile decomposition products.
Condensation-Cure (RTV): Room-temperature vulcanizing systems using moisture-reactive silanes (e.g., methyltrimethoxysilane) with tin or titanium catalysts. Less common for highly filled conductive systems due to slower cure and lower mechanical strength.
Organopolysiloxanes are synthesized via hydrolysis and polycondensation of chlorosilanes (e.g., dimethyldichlorosilane, methylvinyldichlorosilane) or by equilibration of cyclic siloxanes (e.g., octamethylcyclotetrasiloxane, D4) using acid or base catalysts. For high-molecular-weight polymers (Mw 300,000–800,000 g/mol), anionic ring-opening polymerization of D4 with tetramethylammonium hydroxide catalyst at 80–120°C for 4–8 hours is typical, followed by neutralization and stripping of volatiles under vacuum (<10 mbar, 150–180°C, 2–4 hours).
Silicon-Treated Carbon Black: Carbon black (e.g., N330, N550 grades) is treated with alkoxysilanes (e.g., methyltrimethoxysilane, vinyltrimethoxysilane) or organohydrogensiloxanes. A typical process involves:
The silicon content in treated blacks typically ranges from 0.5–5.0 wt%, measurable by X-ray fluorescence (XRF) or inductively coupled plasma optical emission spectrometry (ICP-OES).
Silica-Coated Conductive Carbon Black: Conductive carbon black is coated with precipitated or fumed silica via sol-gel processes. A representative method:
The resulting material contains ≥25 wt% silica with ≥60% of carbon black surface area coated, verified by transmission electron microscopy (TEM) and energy-dispersive X-ray spectroscopy (EDS).
Carbon Nanotube Dispersion: CNTs are notoriously difficult to disperse due to van der Waals attractions (binding energy ~500 eV/μm for MWCNT bundles). Effective dispersion strategies include:
Mechanical Dispersion: High-shear mixing (5,000–10,000 rpm, 30–60 min), three-roll milling (gap 5–20 μm, 3–5 passes), or ultrasonication (20–40 kHz, 100–500 W, 15–30 min) in the presence of dispersing agents (e.g., low-molecular-weight siloxanes, nonionic surfactants at 0.5–2.0 wt%) 67.
Chemical Functionalization: Oxidative treatment (e.g., refluxing in HNO₃/H₂SO₄ 1:3 v/v at 80°C for 2–4 hours) introduces carboxyl and hydroxyl groups, improving compatibility with silicone matrices. Subsequent silanization with aminopropyltriethoxysilane (APTES) or glycidoxypropyltrimethoxysilane (GPTMS) further enhances interfacial bonding 10.
Batch Mixing (Internal Mixer): A typical formulation sequence for HTV silicone rubber carbon filled compound:
Two-Roll Mill Mixing: For smaller batches or laboratory-scale work, two-roll mills (gap 0.5–2.0 mm, speed ratio 1:1.2–1:1.4, roll temperature 40–60°C) are used. Mixing time typically 20–40 min with periodic cutting and folding to ensure homogeneity.
Liquid Silicone Rubber (LSR) Compounding: For addition-cure LSR systems, CNTs or carbon black are pre-dispersed in Part A (vinyl-functional polymer) using high-shear mixers or bead mills to achieve viscosity of 5,000–41,000 cP initially, rising to 80,000–350,000 cP after aging 16. Part B (hydride cross-linker and catalyst) is prepared separately and mixed with Part A in 1:1 or 10:1 ratios immediately before injection molding or extrusion.
Addition-Cure Systems: Typical curing profiles involve:
Cure kinetics can be monitored via moving die rheometry (MDR) per ASTM D5289, with optimum cure time (t90) typically 3–10 min at 170°C. The presence of carbon black can extend t90 by 10–30% due to catalyst inhibition; silicon-treated blacks reduce this effect 1.
Peroxide-Cure Systems: Curing at 160–180°C for 10–20 min (primary) followed by post-cure at 200–220°C for 4 hours. Peroxide decomposition kinetics follow first-order behavior with half-life of 1–10 min at curing temperature. Scorch safety (ts2) at 120°C should exceed 10 min to ensure safe processing 1519.
Electrical conductivity in carbon-filled silicone rubbers follows percolation theory, where conductivity σ scales as σ ∝ (φ - φc)t above the percolation threshold φc, with critical exponent t ≈ 1.6–2.0 for three-dimensional
| Org | Application Scenarios | Product/Project | Technical Outcomes |
|---|---|---|---|
| CABOT CORPORATION | Silicone rubber compositions requiring improved mechanical properties and hardness retention in automotive, industrial sealing, and elastomeric applications. | Silicon-Treated Carbon Black for Silicone Rubber | Imparts higher hardness to elastomers with silicon-containing compound distributed through carbon black aggregates, providing enhanced reinforcement compared to untreated carbon black. |
| DOW CORNING CORPORATION (DOW SILICONES CORPORATION) | High-voltage cable joints, cable terminals, cable accessories and electrical connectors requiring controlled conductivity and elastomeric properties. | Liquid Silicone Rubber for High Voltage Applications | Achieves electrical conductivity suitable for high-voltage applications using extra conductive carbon black and single-walled carbon nanotubes as fillers in platinum-catalyzed addition-cure systems. |
| LG CHEM LTD. | Conductive and antistatic applications requiring uniform surface and volume resistance with improved mechanical properties and reduced sloughing phenomenon. | Carbon Nanotube-Enhanced Silicone Rubber Composite | Achieves high electrical conductivity with lower filler content using carbon nanotubes with L/D ratio ≥500, reducing total conductive filler requirement while maintaining volume resistivity ≤10⁵ Ω·cm and hardness ≤80 Shore A. |
| MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC | Electric power equipment, telecommunication apparatus, stress control in high-voltage cable accessories, and capacitor applications requiring high permittivity without sacrificing insulation. | High-Dielectric Silicone Rubber Composition | Provides high dielectric constant (εr > 10 at 50 Hz) with excellent insulation resistance (≥10¹² Ω·cm) using silica-coated conductive carbon black (≥60% coating, ≥25 wt% silica content), achieving low specific gravity and excellent tensile strength. |
| SHIN-ETSU CHEMICAL CO. LTD. | Electrophotographic imaging systems and development rolls requiring efficient heat dissipation, thermal management in office equipment, and printing applications. | Thermally Conductive Silicone Development Roll | Achieves thermal conductivity ≥0.28 W/m·K by combining 40-400 phr thermally conductive powder (thermal conductivity ≥10 W/m·K, particle size ≤30 μm) with 1-50 phr carbon black in addition-cure or peroxide-cure systems. |