Wärmeleitfähige silikonzusammensetzung

AT1868500TInactive Publication Date: 2026-01-15SHIN ETSU CHEMICAL CO LTD
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Patent Information

Application Number
AT2022201247T
Authority / Receiving Office
AT · AT
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-10-21
Filing Date
2022-10-13
Publication Date
2026-01-15
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Current heat dissipation materials for semiconductors face challenges in achieving both high thermal conductivity and shift resistance, with existing solutions either compromising on thermal conductivity or shift resistance due to the use of metal oxides and inorganic fillers.

Method used

A thermal conductive silicone composition is developed, comprising specific sizes and shapes of aluminum nitride particles and inorganic particles, along with organopolysiloxanes and catalysts, to enhance thermal conductivity and shift resistance, with a balanced composition that includes 20-80% of larger aluminum nitride particles and 20-50% of smaller inorganic particles, and the use of organohydrogenpolysiloxane and platinum group metal catalysts for improved performance.

Benefits of technology

The composition achieves high thermal conductivity of 7.5 W/m·K or more while maintaining superior shift resistance, ensuring effective heat dissipation and stability against thermal shock and vibration.

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Abstract

The present invention is a thermal conductive silicone composition comprises (C) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 4 µm or more and less than 50 µm; (D) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 50 µm or more and 150 µm or less; and (E) an inorganic particle having an average particle size of 0.1 µm or more and less than 4.0 µm. This provides a thermal conductive silicone composition ensuring both high thermal conductivity and shift resistance.
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