CHIP CARD WITH BIOMETRIC SENSOR

Abstract

The invention relates to a portable communicating object (20) the operating mode of which is a contact or contactless mode, or a hybrid mode which is both contact and contactless, said object comprising a body (50) having external protective layers (15, 16) and an insert (40) placed between said protective layers, said insert (40) comprising a substrate (41) bearing a first electronic component (11; 60) having first connection pads (17) and further bearing at least a second electronic component taking the form of an electronic module (12) placed in a cavity (51) of the body (50), which cavity is obtained by machining, said electronic module (12) having second connection pads (18), and said insert (40) further comprising, on the one hand, interconnecting tracks (21, 22, 23, 24) intended to connect said first electronic component (11; 60) with said electronic module (12) so as to ensure electrical power is supplied thereto or data transferred therebetween, and on the other hand, connecting tracks (29) between said first electronic component (11; 60) and said interconnecting tracks (21, 22, 23, 24), characterized in that said connecting tracks (29) are located on the same side of the insert (40) as the electronic module (12) and in that they have a thickness at least equivalent to the absolute value of the machining tolerance (T) of said cavity (50).

Description

[0001] DESCRIPTION

[0002] Title: Smart card with biometric sensor

[0003] The invention relates to secure and communicating portable objects such as bank cards or chip identification documents, provided with a first microelectronic module with contact, contactless, or mixed contact and contactless operation, and a second electronic module or component such as a biometric sensor intended to communicate with the first module, in particular to transmit biometric information of the user of the chip card to it.

[0004] By way of example and simplification of the description, the invention will be described mainly in the context of its application to smart cards provided with a fingerprint sensor, without however limiting the scope of the invention to other portable objects or other form factors, and to other types of electronic components such as for example screens, or biometric sensors of any kind, or even discrete electronic components not mounted in a support module.

[0005] Contactless smart cards in ISO 7816 format used for banking applications are the most common example of identification cards to which the invention applies. However, the invention also applies to other types of secure documents, including passports and other security documents used for digital identification applications.

[0006] State of the art

[0007] Most known contactless smart cards or dual cards with mixed contact and contactless operation comprise a card body, an electronic module inserted in a cavity of the card body and provided with a microelectronic chip, and an antenna arranged in the card body. This is either galvanically connected to output pads of the microelectronic chip, or inductively coupled to a smaller antenna directly integrated into the electronic module of the smart card. In both configurations, the antenna of the card body allows radio frequency communication with the antenna of a smart card reader.

[0008] The card body antenna generally consists of turns made using electrically conductive tracks, arranged on a flexible insert or substrate which is integrated into the card body and laminated with the layers thereof during card assembly.

[0009] Alternatively, there are purely contact-based smart cards, whose card body does not have an antenna.

[0010] In a number of applications, it becomes necessary to integrate into the smart card one or more electronic modules or components complementary to the main module or component, for example for the integration of biometric sensors capable of collecting biometric information and transmitting it to the main module or component for the purpose of biometric identification of the user of the smart card.

[0011] In this case, as for example in the case of the card shown in Figure 1, the biometric sensor(s) and the main contact or contactless module are arranged on a relatively rigid support in the form of a plate also called a printed circuit or PCB (acronym for the Anglo-Saxon expression "Printed Circuit Board") on which the components are interconnected. This arrangement has several disadvantages.

[0012] Indeed, the interconnection of several electronic modules arranged on a PCB-type support is expensive because it generally requires additional electronic components not integrated into the electronic modules of the smart card, and a modification of the classic manufacturing processes of smart cards, which leads to significant additional costs. It is also unreliable over time because the repeated bending that the product will have to undergo during its use risks breaking more or less quickly the electrical interconnections made on the PCB between the modules.

[0013] However, the market demands increased reliability and lower cost for smart cards or equivalent provided on the one hand with a main electronic module, contact or contactless, and on the other hand with a biometric sensor or other secondary module. This requires finding a way to eliminate the PCB substrate and finding a more reliable and less expensive alternative means of interconnecting the main electronic module of the smart card, used in particular for the identification of the cardholder, and the biometric or other sensor, such as for example a fingerprint sensor, to ensure that all the active and passive electronic components of the smart card are fully distributed between the main electronic module and the secondary electronic module without requiring a PCB type support.

[0014] Document WO 2018 / 158644 A1 discloses a smart card comprising a first electronic bank payment module and a second electronic module provided with a biometric sensor, the two modules being connected to an antenna capable of communicating with an external reader. The antenna serves both for the interconnection between the two modules and for radiofrequency communication. The connection between the modules and the antenna is made by simple drops of solder or an anisotropic conductive film. Attached connection pads are arranged on the insert and connected to the antenna, by an additive process locally creating an excess thickness allowing a connection between the module and the antenna after machining the cavity receiving the module.

[0015] Furthermore, from document FR 2 776 796 A1, a smart card is known which is equipped with a payment module and a display controlled by a microcontroller. The various components are connected by simple floating electrical wires.

[0016] Purpose of the invention

[0017] The general aim of the invention is therefore to propose a new structure for a communicating portable object, in particular a smart card or equivalent, which is free from the above drawbacks, and in particular a structure allowing the various main electronic modules or chips to communicate with each other with secondary modules such as biometric sensors integrated in the smart card or equivalent security documents, without requiring a PCB-type support provided with discrete electronic components.

[0018] Another aim of the invention is to propose a smart card or equivalent comprising several electronic modules capable of communicating with each other, but remaining compatible with an already existing and well-controlled smart card manufacturing process, namely the transfer of thick electronic modules into cavities provided in the card body, as well as the use of the corresponding conventional manufacturing machine park.

[0019] Another aim of the invention is to propose a smart card comprising several electronic modules provided with connection pads potentially located in different planes in the thickness of the card, and interconnection or connection tracks capable of compensating for these positioning differences.

[0020] Another aim of the invention is to propose a smart card structure provided with an insert allowing easy adaptation to various architectures, such as for example a smart card provided with two thick modules, or a thick module and a microelectronic chip mounted in a “flip-chip” manner.

[0021] Summary of the invention

[0022] In principle, the invention consists of proposing an asymmetrical insert (also called an "inlay" in English terminology), provided with a substrate comprising on a first face thin conductive tracks, in particular made of aluminum, of the order of 10 micrometers, for producing interconnection tracks between the different electronic modules or components of a smart card integrating the insert, and the substrate comprising on a second face thicker tracks, of the order of 80 micrometers, typically made of aluminum, for the connection between the interconnection tracks and the connection pads of a relatively thick electronic module. The machining of the cavity intended to receive the electronic module is then carried out at the level of the connection tracks, the thickness of which is calculated as a function of the thickness of the module substrate and the machining tolerance of the cavity of the module to be integrated.In this way it becomes possible to integrate modules of slightly different thicknesses or requiring slightly different machining depths on the same type of insert, the differences in machining depth being absorbed by the sufficient thickness of the connection tracks.

[0023] The invention therefore relates to a portable communicating object with contact, contactless operation, or mixed contact and contactless operation, comprising a body having external protective layers and an insert arranged between said protective layers, said insert comprising a substrate carrying a first electronic component having first connection pads and carrying on the other hand at least one second electronic component in the form of an electronic module arranged in a cavity of the body obtained by machining, said electronic module having second connection pads, and said insert further comprising on the one hand interconnection tracks intended to connect said first electronic component with said electronic module to ensure their electrical power supply or the transfer of data between them,and on the other hand connection tracks between said first electronic component and said interconnection tracks, characterized in that said connection tracks are located on the same side of the insert as the electronic module and in that they have a thickness at least equivalent to the absolute value of the machining tolerance (T) of said cavity.,

[0024] According to one embodiment, said first component and said second electronic component are electronic modules and are composed of a substrate provided with a microelectronic chip protected by a drop of coating resin.

[0025] According to one embodiment, the thickness (denoted E) of the connection tracks at the level of each electronic module is at least equal to the absolute value of the machining tolerance (denoted T) of the cavities of the electronic modules, plus a small margin (denoted R) corresponding to the residual thickness of the connection tracks after machining of each cavity in order to ensure the electrical continuity of the connection tracks, which then results in the relationship: E = T + R.

[0026] According to a practical example of embodiment, the absolute value of said machining tolerance (T) is of the order of 70 micrometers and the connection tracks have a thickness of the order of 80 pm.

[0027] In practice, there may be a difference (denoted D) in thickness between the value of the thicknesses of the substrates of the two electronic modules, in this case the thickness (denoted E) of the connection tracks (29) at the level of each module (11, 12) is preferably at least equal to the absolute value of the machining tolerance (denoted T) of the cavities of the electronic modules, plus a small margin (denoted R) corresponding to the residual thickness of the connection tracks after machining of the cavities in order to ensure their electrical continuity, plus the difference in thickness (D) of the substrates of the modules, which results in the relationship: E = T + R + D.

[0028] For example, the substrate of the first electronic module has a thickness of the order of 200 μm, the substrate of the second electronic module has a thickness of the order of 210 μm, the difference D of the two thicknesses is of the order of 10 μm, and the thickness of the connection tracks is of the order of 80 + 10 = 90 micrometers.

[0029] According to one embodiment, said second electronic module comprises a biometric sensor, in particular a fingerprint sensor.

[0030] According to an alternative embodiment, said first component is a microelectronic chip mounted in a “flip-chip” fashion on one of the faces of the insert.

[0031] According to one embodiment, said first electronic component is a contact module arranged on the same face of the portable object as the second electronic component, and the connection tracks merge with the interconnection tracks between the first component and the second component.

[0032] According to one embodiment, said first electronic component is a contactless module or a dual communication interface module, and the insert comprises an antenna produced in the form of conductive tracks located on one of the faces of the insert. According to one embodiment, the interconnection tracks are located on one face of the substrate.

[0033] According to one embodiment, the interconnection tracks have a thickness of between 10 and 30 micrometers, and the connection tracks have a thickness of between 70 and 100 micrometers.

[0034] According to one embodiment, a first end of each connection track is connected to a connection pad of an electronic component by an anisotropic conductive adhesive.

[0035] According to one embodiment, a second end of each connection track is connected to one end of an interconnection track via a crimp connection.

[0036] According to one embodiment, the insert comprises a polymer substrate with a thickness of between 25 and 250 micrometers, preferably between 25 and 50 micrometers, and the interconnection tracks and the connection tracks are made of aluminum on said polymer sheet.

[0037] According to one embodiment, said polymer substrate has two opposite faces and the interconnection tracks are arranged on a first face of the substrate and the connection tracks are arranged on a second face of said substrate.

[0038] According to one embodiment, said first electronic component is an electronic module comprising a module antenna electromagnetically coupled with an amplification antenna located on the insert and electromagnetically coupled with an antenna also arranged on the insert and ensuring the radiofrequency link with the antenna of the reader.

[0039] According to one embodiment, each electronic module comprises its own module antenna, coupled respectively with an amplification antenna located on the insert and electromagnetically coupled with an antenna also arranged on the insert and ensuring the radiofrequency link with the reader antenna. According to one embodiment, the communicating portable object is in the form of a smart card in the ID1 format defined in the ISO 7810 standard, or in the format of an ID3 electronic passport according to the ISO 7810 standard.

[0040] The invention also relates to a method for manufacturing a portable communicating object as defined above, comprising steps consisting of preparing an insert provided with tracks of an antenna, at least two electronic modules or components provided with connection pads and interconnection tracks extending between said electronic modules or components, characterized in that it further comprises steps consisting of: arranging on one face of the insert connection tracks of thickness greater than the thickness of the tracks of the antennas and of the interconnection tracks, each connection track being arranged between a connection pad of the electronic modules and one end of an interconnection track;

[0041] - interconnect the ends of the connection tracks and the ends of the interconnection tracks using crimps;

[0042] - assemble protective layers on either side of the insert so as to form a body of the portable object;

[0043] - machine one face of the body of the portable object so as to form at least one cavity capable of receiving an electronic module;

[0044] - transfer and glue using anisotropic conductive glue in said cavity an electronic module.

[0045] Other characteristics and advantages of the invention will appear on reading the detailed description given in the context of the application of the invention to a smart card, and the appended drawings in which: Figure 1 represents a known contact and contactless smart card, in exploded perspective view; Figure 2A represents an electrical diagram of an assembly consisting of a smart card reader and a smart card according to the invention comprising two electronic modules interconnected by conductive tracks; Figure 2B represents a more detailed plan view of an embodiment of the smart card shown in Figure 2A; Figure 2C represents a simplified sectional view of the smart card according to Figure 2B, passing through the two electronic modules of the smart card; Figure 2D represents a detailed sectional view of the layers of the smart card of Figure 2B, before assembly focusing on a single electronic module;Figure 2E represents a detailed sectional view of the layers of the smart card of Figure 2B, after assembly; Figure 3A is a plan view of a smart card insert according to an embodiment of the invention; Figure 3B is a sectional view of a smart card according to the invention, integrating an insert according to Figure 3A; Figure 4 represents a variant of the electrical diagram of an assembly consisting of a smart card reader and a smart card provided with two electronic modules interconnected by tracks in accordance with the invention, in which only the main electronic module is provided with a hub; Figure 5 represents a variant of the electrical diagram of an assembly consisting of a smart card reader and a smart card provided with two electronic modules interconnected by tracks in accordance with the invention, but each of the electronic modules being provided with a hub.;

[0046] Detailed description

[0047] Reference is made to Figure 1, which shows an exploded perspective view of a known smart card 10 with mixed contact and contactless operation. This smart card comprises a first electronic module 11 provided with standardized contacts (not shown) according to the ISO 7816-1 standard, and a second electronic module 12, which notably comprises biometric sensors such as fingerprint sensors (not shown). The first electronic module 11 comprises a microelectronic chip (not shown) which securely stores identification information of the cardholder, in particular reference biometric fingerprints of the cardholder. In order to authorize a transaction with the smart card 10, the user must submit his biometric fingerprint to the second electronic module 12, and this fingerprint must then be securely transmitted to the first electronic module 11.It is therefore necessary to set up a communication channel between the first and second electronic modules 11, 12.

[0048] For this purpose, the known smart card 10 comprises a printed circuit 13 (or PCB for "Printed Circuit Board" in English terminology) making it possible to establish a complex circuit between the two modules 11, 12, providing both the electrical power supply of the second module 12 by the first module 11, and the data communication between the two modules 11, 12. In the current state of the art, this printed circuit 13 comprises discrete electronic components (not shown) and is integrated between external faces 15, 16 of the smart card, which is more complicated and more expensive to produce than simply transferring a single electronic module into a cavity provided in a monolithic card body, as is commonly practiced for smart cards provided with a single electronic module.

[0049] Figure 2A shows an electrical diagram of an assembly consisting of a smart card 20 provided with two electronic modules 11, 12 interconnected by conductive tracks 21, 22, 23, 24, and by a smart card reader 27. In this case, it is a smart card 20 of the contactless operation type, provided with an antenna 25 which allows it to establish a radiofrequency link by inductive coupling with the antenna 26 of a remote reader 27.

[0050] On the other hand, the two electronic modules 11, 12, namely for example a conventional main chip card module 11 and a biometric module 12, are connected to each other by galvanic connections, namely conductive tracks 21, 22 which are used for the transmission and reception of data, and conductive tracks 23, 24 which are used for the electrical supply of the biometric module 12 by the main module 11, which captures its energy from the inductive connection with the reader 27. Figure 2B gives a plan view of a schematic embodiment of the chip card 20 of Figure 2A.The main electronic module 11 comprises in a known manner six connection pads 17, namely on the one hand two connection pads 17a which are connected to a first end of the tracks of the antenna 25 of the smart card, which is an antenna in the so-called “ID1” format which is close to the size of the smart card and which runs along the edges of the card body, and on the other hand four connection pads 17b which are connected to a first end of each of the tracks 21, 22, 23, 24 of interconnection between the two electronic modules 11, 12. The biometric electronic module 12 comprises four connection pads 18 which are connected to the second ends of the tracks 21, 22, 23, 24 of interconnection between the two electronic modules 11, 12.

[0051] In order to simplify and make the manufacture of the smart card 20 according to the invention more reliable, the tracks of the antenna 25 and the interconnection tracks 21, 22, 23, 24 are preferably made in a similar manner. These are in particular thin aluminum tracks, with a thickness of the order of 10 micrometers, made on one face of an insert 40, for example by chemical etching.

[0052] However, taking into account the differences in thickness of the electronic modules 11, 12 and the position of their connection pads 17, 18 which may not be in the same plane, it is necessary to resort to particular measures to effectively connect the ends of the antenna 25 and the interconnection tracks 21, 22, 23, 24 to the respective connection pads 17, 18 of the electronic modules 11, 12.

[0053] For this purpose, the invention provides for using conductive connection tracks 29, thicker than the antenna tracks 25 and the interconnection tracks 21, 22, 23, 24 of the modules 11, 12. These connection tracks 29 are dimensioned in 3D (i.e. along a Z axis corresponding to the thickness of the smart card and perpendicular to the XY plane of the smart card) and are of sufficient thickness to be able to compensate or make up for the differences in location on the Z axis between the ends of the antenna tracks 25, the interconnection tracks 21-24, and the corresponding connection pads 17, 18 located on the electronic modules 11, 12. In other words, it can be said that the connection tracks 29 are tracks extending in 3D between the ends of the antenna tracks 25 or interconnection tracks 21-24, and the corresponding connection pads 17, 18 located on the electronic modules 11, 12.

[0054] Furthermore, the connection tracks 29 are machinable and intended to be machined during the formation of the cavities for the insertion of the electronic modules 11, 12 into a card body.

[0055] As the modules 11, 12 are positioned in cavities 51 machined in the card body, so that the connection tracks 29 can play their role and come into contact with the connection pads 17, 18 of the modules 11, 12, it is necessary for the thickness of the connection tracks 29 to be sufficient, at the level of each module, so that in all cases the depth of the plane PI of the cavity (corresponding to the support zone of the connection pads of the module) reaches the connection tracks 29 during the machining of the cavity, but without crossing these connection tracks 29 and eliminating all of their thickness during the machining operation.It is therefore essential that the thickness (denoted E) of the connection tracks 29 at the level of each module 11, 12 is at least equal to the absolute value of the machining tolerance of the cavities 51 of the modules 11, 12 (denoted T), plus a small margin (denoted R) corresponding to the residual thickness of the connection track after machining of the cavity in order to ensure its electrical continuity, which then results in the relationship E = T + R. Thus, for example, if the cavity 51 of a module must be machined to a depth PI + / - 35 micrometers, the recommended thickness of the connection track 29 will for example be of the order of 80 micrometers.

[0056] If in practice there is a difference D in thickness between the value of the thicknesses of the substrates of the two modules, the thickness E recommended above of the connection track 29 should then be increased by the value of this difference D. The recommended value of the thickness E of the connection track 29 will then be equal to T + R + D. For example, if the first module 11 has a substrate thickness of 200 pm and the second module 12 has a thickness of 210 pm, then the difference D is equal to 10 pm, and the recommended thickness of the connection track 29 will be of the order of 80 + 10 = 90 micrometers. According to the invention, the connection tracks 29 are produced on the insert 40 and positioned on the same side of the smart card as the electronic modules 11, 12, when these will be assembled on the smart card, while the antenna tracks 25 and the interconnection tracks 21-24 are produced on the opposite face of the insert 40.The ends 29b of the connection tracks 29 and the ends of the interconnection tracks 21-24 are interconnected for example using crimps 28.

[0057] In practice, the connection tracks 29 will generally have a thickness of the order of 70 to 100 micrometers, in the case of a smart card having a thickness of the order of 800 micrometers.

[0058] The connection tracks 29 have a first end 29a which is positioned opposite a corresponding connection pad 17, 18 of the electronic modules 11, 12. This first end 29a is machined in part during the machining of the receiving cavity 51 of each electronic module. This machining makes it possible to locally reduce the thickness of the end 29a of the connection track 29 to the exact level provided for the positioning of the connection pads 17, 18 of the electronic modules 11, 12. The machined surface of this first end 29a can then be electrically connected to the corresponding connection pad 17, 18 of a module 11, 12 by means of a thin layer of anisotropic conductive adhesive, denoted ACF, which can be dispensed at the same time as the dispensing of the adhesive for fixing each electronic module 11, 12 in its respective cavity of the card body.

[0059] In the case of a contactless chip card and therefore provided with an antenna 25 (figure 2B), the connection tracks 29 have a second end 29b which is positioned opposite one end of one of the antenna tracks 25 or the interconnection tracks 21-24. Said second end 29b of the connection tracks 29 is connected to the corresponding end of an antenna track 25 or an interconnection track 21-24 by means of a metal via, or a crimping connection 28, also called a “crimp” in English terminology. Figure 2C represents a sectional view of the smart card 20 of Figure 2B, passing through the two modules 11, 12. It should be noted that given the small thickness of the different layers of the smart card, the thicknesses have been represented enlarged, and they are not to scale.

[0060] The first electronic module 11 is a conventional module with a dual communication interface, comprising a substrate 70 and on its upper face contacts 63 in ISO 7816 format. A microelectronic chip 60 is fixed under the substrate 70 and protected by a drop of encapsulation resin 62. The output terminals of the microelectronic chip 60 are connected to connection pads 17 of the module 11.

[0061] The second electronic module 12 is a module of similar structure but comprising on the upper face a biometric sensor 61, for example a fingerprint sensor. The chip 60 of this module is connected to connection pads 18 of the module 12. The connection pads 17, 18 are connected to respective connection tracks 29, which are interconnected by interconnection tracks 21-24 via crimps 28.

[0062] Figures 2D and 2E correspond to a partial section of the smart card of Figure 2B at the level of the electronic module 11 according to the dotted line section of Figure 2B. Figure 2D represents an exploded view, corresponding to the situation before assembly of the smart card 20. The card body 50 comprises an upper protective layer 15, a lower protective layer 16, and an insert 40 interposed between these two layers. The insert 40 is inserted into a cavity 51 of the card body and closed on the upper face 15 by the electronic module 11. The structure is the same at the level of the part of the card body which carries the biometric module 12, not shown in this figure.

[0063] The insert 40 comprises a substrate 41 made of plastic material on which conductive tracks 21-24, in particular made of aluminum, have been produced on one face, for example the lower face, for the interconnection of the modules 11, 12. The upper face of the substrate 41 carries the connection tracks 29 in accordance with the invention. They are also made of aluminum, thicker than the interconnection tracks 21-24. Their upper part U corresponds to the area which will be machined during the machining of the cavity 51. When the electronic module 11 is transferred into the cavity 51 of the card body, the connection pads 17, 18 respectively of the module 11 or of the module 12 will be glued to the upper face of the ends 29a of the connection tracks 29, by means of a thin layer of anisotropic conductive adhesive 30.

[0064] Figure 2E represents the same structure as Figure 2D, after transferring the modules 11, 12 into the card body 50. As can be seen, the upper part U of the connection track 29 shown in Figure 2C has disappeared, since it was machined during the machining of each of the cavities 51. This machining is done at a depth adapted to the possibly different thickness between the modules 11, 12.

[0065] More precisely, the connection tracks 29 are designed to initially have a greater thickness to take into account the machining tolerances T of the cavity, which causes them to encroach into the area provided for the cavities of the modules. Thanks to the step of machining the cavities, the excess thickness of the ends 29a of the connection tracks 29 is reduced until the final thickness of these connection tracks is adapted to the thickness of each module, namely that of the main identification module 11 and that of the second electronic module 12.

[0066] Thus, after this step of machining each cavity 51, the machined surfaces of the ends of the connection tracks 29 are located at the bottom of the cavities exactly at a depth corresponding to the thickness of the substrate of each module 11, 12 at the level of its connection pads, which allows precise insertion and bonding of each module, even when these have different thicknesses.

[0067] Figures 3A and 3B show an alternative embodiment of the invention, depending on the type of electronic modules or electronic components integrated into the smart card.

[0068] In these figures 3A and 3B, the smart card is provided with a main component 11 in the form of a microelectronic chip directly connected in “flip-chip” on the lower face of the substrate 41 of the insert 40, and a secondary component formed by a biometric module 12. The upper surface of this biometric module integrates a fingerprint sensor 61. It comprises a microelectronic chip 60 protected by a drop of encapsulation resin 62 housed in the cavity 51 of the card body. As visible in figure 3B, the machining of the plane called “PI” of the cavity 51, corresponding to the thickness of the substrate of the module 12, has locally started the thickness of the connection tracks 29, and the contact pads 18 of the module are then electrically connected to the interconnection tracks 21-24 via the connection tracks 29, and the crimps or crimpings 28.

[0069] In another embodiment (not shown), it is possible to propose a contact-only smart card, comprising two electronic modules arranged on the same face of the smart card. In this case, a single-sided insert metallized on a single face can be used, and then the connection and interconnection tracks between the modules can merge and have the same thickness, namely that which is at least equal to the machining tolerance T of the cavities plus a margin R, as explained above.

[0070] Figure 4 shows a variant of the electrical diagram of an assembly consisting of a smart card reader TJ and a smart card 20 provided with two electronic modules 11, 12 interconnected by tracks 21-24 in accordance with the invention. In this embodiment of the invention, the main electronic module 11 is provided with a module antenna 35, coupled with a concentrator antenna 36, ​​itself electromagnetically coupled with the main antenna 25 in ID1 format. The latter in turn is coupled to the antenna 26 of a remote smart card reader TJ. Therefore, in this embodiment, the interconnections between the tracks 21-24 and the corresponding connection pads 17, 18 of the electronic modules 11, 12 are again made using connection tracks 29 (not shown), in exactly the same way as in the basic embodiment corresponding to Figure 2.

[0071] Figure 5 shows another variant of the electrical diagram of an assembly consisting of a smart card reader TJ and a smart card 20 provided with two electronic modules 11, 12 interconnected by interconnection tracks in accordance with the invention. In this embodiment, both the main electronic module 11 and the biometric module 12 are provided with their own module antenna 35a, 35b coupled to a respective hub 36a, 36b and each module 11, 12 is therefore supplied with energy by electromagnetic coupling between the antenna 25 of the smart card and the antenna TJ of the reader. In this case, the two electronic modules 11, 12 are no longer galvanically interconnected except by interconnection tracks 21-22 ensuring the transfer of data. These two interconnections 21, 22 can also be produced by connection tracks 29 (not shown), as described previously in connection with the embodiment of figure 2.

[0072] Advantages of the invention

[0073] Ultimately, the invention proposes a portable communicating object, in particular a smart card 20 or an electronic passport, making it possible to achieve the intended goals. In particular, the use of an insert provided with connection tracks 29 in excess thickness and machinable locally up to a thickness taking into account the machining tolerances of the cavities and adapted to the thickness of each electronic module, makes it possible to interconnect the electronic modules more efficiently without having to resort to a printed circuit PCB, which contributes to reducing the manufacturing cost of the smart card and increasing the manufacturing yield.

[0074] Furthermore, the structure of the smart card according to the invention is compatible with conventional low-cost, high-yield manufacturing methods, consisting of machining cavities in the card body and then integrating electronic modules into these surface cavities of the card body.

[0075] The proposed technology makes it possible to integrate into the smart card or into an equivalent communicating device, an insert already equipped with components capable of connecting with an embedded module according to the invention.

Claims

DEMANDS 1. A portable communicating object (20) operating with contact, without contact, or with mixed contact and without contact operation, comprising a body (50) having external protective layers (15, 16) and an insert (40) disposed between said protective layers, said insert (40) comprising a substrate (41) carrying a first electronic component (11; 60) having first connection pads (17) and carrying on the other hand at least a second electronic component in the form of an electronic module (12) disposed in a cavity (51) of the body (50) obtained by machining, said electronic module (12) having second connection pads (18), and said insert (40) further comprising on the one hand interconnection tracks (21, 22, 23, 24) intended to connect said first electronic component (11;60) with said electronic module (12) to ensure their power supply or the transfer of data between them, and on the other hand connecting tracks (29) between said first electronic component (11; 60) and said interconnecting tracks (21, 22, 23, 24), characterized in that said connecting tracks (29) are located on the same side of the insert (40) as the electronic module (12) and in that they have a thickness at least equivalent to the absolute value of the machining tolerance (T) of said cavity (50).; 2. Communicating portable object (20) according to claim 1, characterized in that said first component (11) is an electronic module similar to the electronic module (12), the two electronic modules (11, 12) being composed of a substrate (70) provided with a microelectronic chip (60) protected by a drop of encapsulating resin (62).

3. A portable communicating object (20) according to claim 2, characterized in that the thickness (denoted E) of the connection tracks (29) at each electronic module (11, 12) is at least equal to the absolute value of the machining tolerance (denoted T) of the cavities (51) of the modules (11, 12), plus a small margin (noted R) corresponding to the residual thickness of the connecting tracks (29) after machining of the cavities (51) in order to ensure the electrical continuity of the connecting tracks, which then translates into the relationship: E = T + R.

4. Communicating portable object (20) according to any one of claims 1 to 3, characterized in that the absolute value of said machining tolerance (T) is on the order of 70 micrometers and in that the connecting tracks (29) have a thickness on the order of 80 pm.

5. A portable communicating object (20) according to any one of claims 2 to 4, wherein there is a difference (denoted D) in thickness between the value of the thicknesses of the substrates (70) of the two electronic modules (11, 12), characterized in that the thickness (denoted E) of the connecting tracks (29) at the level of each module (11, 12) is at least equal to the absolute value of the machining tolerance (denoted T) of the cavities (51) of the modules (11, 12), plus a small margin (denoted R) corresponding to the residual thickness of the connecting tracks (29) after machining of the cavities (51) in order to ensure their electrical continuity, plus the difference in thickness (D), which is expressed by the relation: E = T + R + D.

6. Communicating portable object (20) according to claim 5, characterized in that the substrate (70) of the first electronic module (11) has a thickness of approximately 200pm, the substrate (70) of the second electronic module (12) has a thickness of approximately 210pm, the difference D of the two thicknesses is approximately 10pm, and the thickness of the connecting tracks (29) is approximately 80 + 10 = 90 micrometers.

7. Communicating wearable object (20) according to any one of claims 2 to 6, characterized in that said second electronic module (12) comprises a biometric sensor, in particular a fingerprint sensor.

8. Communicating portable object (20) according to claim 1, characterized in that said first component is a microelectronic chip (60) mounted as a "flip-chip" on one of the faces of the insert (40).

9. A portable communicating object (20) according to any one of claims 1 to 2, characterized in that said first electronic component (11) is a module with contact disposed on the same face of the portable object as the second electronic component (12), and in that the connecting tracks (29) coincide with the interconnection tracks (21, 22, 23, 24) between the first component (11) and the second component (12).

10. Communicating portable object (20) according to any one of claims 2 to 8, said first electronic component (11) being a contactless module or a dual communication interface module, characterized in that the insert (40) comprises an antenna (25) made in the form of tracks located on one of the faces of the insert (40).

11. Communicating portable object (20) according to any one of the preceding claims, characterized in that the interconnection tracks (21, 22, 23, 24) are located on one face of the substrate (41).

12. Communicating portable object (20) according to any one of the preceding claims, characterized in that the interconnection tracks (21, 22, 23, 24) have a thickness of between 10 and 30 micrometers, and in that said connecting tracks (29) have a thickness of between 70 and 100 micrometers.

13. Communicating portable object (20) according to any one of the preceding claims, characterized in that a first end (29a) of each connecting track (29) is connected to a connecting pad (17, 18) of an electronic component (11, 12) by an anisotropic conductive adhesive.

14. Communicating portable object (20) according to any one of the preceding claims, characterized in that a second end (29b) of each connecting track (29) is connected to one end of an interconnecting track (21, 22, 23, 24) via a connection (28) by crimp.

15. A portable communicating object (20) according to any one of the preceding claims, characterized in that the insert (40) comprises a polymer substrate (41) with a thickness between 25 and 250 micrometers, preferably between 25 and 50 micrometers, and in that the interconnection tracks (21, 22, 23, 21 24) and the connecting tracks (29) are made of aluminium on said polymer sheet.

16. Communicating portable object (20) according to any one of the preceding claims, characterized in that said polymer substrate (41) has two opposite faces and in that the interconnection tracks (21, 22, 23, 24) are arranged on a first face and the connection tracks (29) are arranged on a second face of said substrate (41).

17. Communicating portable object (20) according to any one of claims 2 to 6, characterized in that said first electronic component (11) is an electronic module comprising a module antenna (35) electromagnetically coupled with an amplification antenna (36) located on the insert (40) and electromagnetically coupled with an antenna (25) also disposed on the insert (40) and ensuring the radio frequency link with the antenna (26) of the reader (27).

18. A portable communicating object (20) according to any one of claims 2 to 6, characterized in that each electronic module (11, 12) has its own module antenna (35a, 35b), coupled respectively with an amplification antenna (36a, 36b) located on the insert (40) and electromagnetically coupled with an antenna (25) also disposed on the insert (40) and ensuring the radio frequency link with the antenna (26) of the reader (27).

19. Communicating portable object (20) according to any one of the preceding claims, characterized in that it is in the form of a smart card in ID1 format as defined in ISO 7810, or in the format of an electronic passport ID3 according to ISO 7810.

20. A method for manufacturing a portable communicating object (20) according to any one of the preceding claims, comprising steps of preparing an insert (40) provided with tracks for an antenna (25; 35; 35a, 35b), at least two electronic modules or components (11, 12; 60) provided with connection pads (17, 18) and interconnection tracks (21, 22, 23, 24) extending between said electronic modules or components, characterized in that it further comprises steps of: 22 arrange on one face of the insert (40) connecting tracks (29) with a thickness greater than the thickness of the antenna tracks (25; 35; 35a, 35b) and interconnection tracks (21, 22, 23, 24), each connecting track (29) being arranged between a connection pad (17, 18) of the electronic modules (11, 12) and an end of an interconnection track (21, 22; 23, 24); interconnect the ends (29b) of the connecting tracks (29) and the ends of the interconnection tracks (21, 22, 23, 24) using crimps; - assemble protective layers (15, 16) on either side of the insert (40) so as to form a body (50) of the wearable object (20); - machine one face of the body (50) of the portable object (20) so as to form at least one cavity (51) capable of receiving an electronic module (11, 12); - transfer and glue an electronic module (11, 12) into said cavity (51) using anisotropic conductive glue.