Wafer-handling-baugruppe

AT1934193TUndetermined Publication Date: 2026-07-15ASM IP HLDG BV
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Patent Information

Application Number
AT2024177108T
Authority / Receiving Office
AT · AT
Patent Type
Patents
Current Assignee / Owner
Priority Date
2023-05-24
Filing Date
2024-05-21
Publication Date
2026-07-15
Estimated Expiration
2044-05-21
Patent Text Reader

Abstract

A wafer handling assembly, a semiconductor processing apparatus comprising the wafer handling assembly and a method of forming a layer on a plurality of wafers is disclosed. Embodiments of the described wafer handling assembly comprise a boat having three boat supports per wafer for supporting the wafer in the boat and an end effector comprising three end effector supports for supporting a wafer on the end effector.
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