Ultrasonic transducers, backing structures and related methods

Abstract

There is disclosed an ultrasonic transducer, comprising: a piezoelectric material having a front surface and a back surface, the piezoelectric material being configured to be in acoustic communication with a sample; a backing structure positioned at the back surface of the piezoelectric material and configured to reflect acoustic energy towards the front surface of the piezoelectric material, the backing structure being thermally 5 conductive and electrically conductive, the backing structure comprising: a first dual layer de-matching backing, the first dual layer de-matching backing comprising: a first layer of graphite; and a layer made of tungsten in contact with the first layer of graphite; a second dual layer de-matching backing contacting the first dual layer de-matching backing, the second dual layer de-matching backing comprising: a second layer of graphite; and a layer of copper in contact with the second layer of graphite; wherein each layer of the first 10 dual layer de-matching backing and the second dual layer de-matching backing is configured to resonate and redistribute acoustic energy entering that layer at a relatively low amplitude over a relatively long timeframe; a heat sink in thermal contact with the backing structure; and one or more electrodes in electrical communication with the piezoelectric material. 15 10 15 20 26 23 01 65 10 S ep 2 02 6 1 0 S e p 2 0 2 6 5 2 0 2 6 2 3 0 1 6 5 1 0 1 5

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