An apparatus and method for treating a rotatable metal surface

Abstract

An apparatus for treating at least a portion of a rotatable metal surface (002), the apparatus comprising at least a first treatment unit (004) and a second treatment unit (006), wherein the first treatment unit and second treatment unit comprise or are configured to receive at least a first treatment band (016) and at least a second treatment band (020), respectively, the further wherein the treatment units comprise a mechanism for maneuvering the treatment bands in a treatment direction (018) with respect to the rotatable metal surface, wherein the first treatment unit and second treatment unit are configured to be movable along a lateral axis (Z) with respect to the rotatable metal surface to be treated, wherein said lateral axis is essentially perpendicular to an axis (Y) corresponding to the direction of movement of the rotatable metal surface, further wherein the second treatment band is configured to contact a treatment location (024) on the rotatable metal surface after a predetermined delay time after the first treatment band has contacted the treatment location on the rotatable metal surface. A method for treating a metal surface.

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