Lamination structure with solvent-free adhesive

Abstract

The present invention is related to a laminate (1) for packaging applications, comprising a first substrate layer (2) and an adhesive layer (5) present on a surface of said first substrate layer (2), and a second substrate layer (2’) on which at least one ink layer (4) is provided, characterized in that said adhesive layer (5) is made from a solvent-free one-component adhesive composition comprising isocyanate moieties as functional groups. The present invention is furthermore related to laminate comprising an adhesive layer (5) made from a one-component adhesive composition.

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