SCREEN PANEL AND SCREEN DEVICE
By incorporating a barrier layer between the conductive wiring and the inorganic layer to shield against plasma bombardment, the encapsulation layer achieves uniform thickness and improved water/oxygen blocking in OLED devices.
Patent Information
- Authority / Receiving Office
- BR · BR
- Patent Type
- Applications
- Current Assignee / Owner
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
- Filing Date
- 2023-04-21
- Publication Date
- 2026-07-07
AI Technical Summary
The plasma-enhanced chemical vapor deposition method used in thin-film encapsulation of OLED devices results in irregular thickness of inorganic layers due to plasma bombardment of conductive wiring, affecting the encapsulation's ability to block water and oxygen.
A barrier layer is disposed between the conductive wiring and the first inorganic layer, with its projection covering the conductive wiring's projection on the substrate, preventing high-energy plasma bombardment and ensuring a uniform thickness of the inorganic layer.
This configuration enhances the encapsulation layer's ability to block water and oxygen, preventing irregular thickness and improving production yield by avoiding plasma-induced damage to the conductive wiring.
Smart Images
Figure 00000000_0000_ABST
Abstract
Description
1 / 17 SCREEN PANEL AND SCREEN DEVICE TECHNICAL FIELD
[0001] The present application relates to a display technology, in particular, to a display panel and a display device. BACKGROUND
[0002] Currently, the thin-film encapsulation of organic light-emitting diode (OLED) devices adopts a multi-layered stacked structure that includes inorganic and organic layers. After analysis, it was found that increasing the number of stacking times under a fixed thickness can effectively improve the water and oxygen resistance effect, i.e., a single layer thickness decreases while the number of interfaces increases, which in turn increases the water-oxygen diffusion path and prolongs the water-oxygen invasion time. When the thickness of the inorganic layer increases, the stress and defect density of the inorganic layer increase, weakening the encapsulation performance. Increasing the organic layer releases the stress in the inorganic layer on one hand, and covers the defect position on the other hand, which improves the water resistance of the entire structure.
[0003] In the related technique, a plasma-enhanced chemical vapor deposition (PECVD) method is generally used to fabricate the inorganic layers in an encapsulation layer. With reference to FIG. 1, which illustrates a schematic structural diagram of a screen panel in the related technique. In screen panel 1 of the related technique, a screen area 1000 includes a substrate 10, a planarization layer 30, an anode 41, a pixel definition layer 50, a light-emitting layer 60, a cathode 70, and a light-extracting layer 81; and an area of structure 2000 includes substrate 10, a signaling wiring 21, a planarization layer 30 and a conductive wiring 42 sequentially arranged on substrate 10. The conductive wiring 42 includes an overlay part 421 and an exposure part 422 arranged on one side of the overlay part 421 away from the screen area.An orthographic projection of the light-extracting layer 81 onto the substrate 10 covers an orthographic projection of the overlay part 421 onto the substrate 10, and does not overlap an orthographic projection of the exposure part 422 onto the substrate 10. In practice, during the production of a first inorganic layer 91 of an encapsulation layer 90, the exposure part 422 can be bombarded by plasma, and metal ions present in the conductive wiring 42 are bombarded by the plasma and attached to the edges of a mask, which alters the magnetic field, thereby affecting the distribution of the plasma gas, resulting in a thickness of... Petition 870250076469, dated 08 / 28 / 2025, page 33 / 65 2 / 17 irregular film on the edge of the mask, affecting the ability of the first inorganic layer 91 to block water and oxygen. SUMMARY
[0004] The embodiments of the present application provide a screen and a screen device, which can effectively improve a narrow edge effect of the screen panel and a production yield of a split screen panel without adopting mechanical technology or laser peeling technology.
[0005] To achieve the aforementioned function, the technical solutions provided in the modalities of this application are as follows.
[0006] Some embodiments of this application provide a screen panel, which includes a screen area of a structure area adjacent to the screen area; The structure area includes a substrate, and a signaling wiring, a planarization layer, a conductive wiring, and an encapsulation layer sequentially stacked on the substrate; and the encapsulation layer includes a first inorganic layer arranged over the conductive wiring; The screen area includes the substrate, the planarization layer, and an anode arranged on one side of the planarization layer away from the substrate, and the conductive wiring extends from one side of the anode into the frame area and is connected to the signaling wiring; and the screen panel includes a barrier layer arranged between the conductive wiring and the first inorganic layer, and an orthographic projection of the barrier layer onto the substrate covers an orthographic projection of the conductive wiring onto the substrate.
[0007] In a screen panel according to some embodiments of the present application, the screen panel includes a barrier portion disposed between the planar layer and the encapsulation layer, and the barrier portion is disposed on one side of the conductive wiring away from the screen area; and the barrier layer is in direct contact with one side of the barrier portion close to the conductive wiring in the structure area.
[0008] In a screen panel according to some embodiments of the present application, the barrier part includes a first barrier and a second barrier spaced apart, and the first barrier is located on one side of the second barrier close to the screen area; and the height of the first barrier is greater than the thickness of the conductive wiring, the conductive wiring extends from one side of the anode to the first barrier, and the barrier layer is in direct contact with one side of the first barrier close to the conductive wiring. Petition 870250076469, dated 08 / 28 / 2025, p. 34 / 65 3 / 17
[0009] In a screen panel according to some embodiments of the present application, the screen area includes a pixel-defining layer, a light-emitting layer, a common layer, and a cathode sequentially stacked on the anode, and the first inorganic layer is disposed on one side of the cathode away from the common layer; and the barrier layer includes a light-extracting layer disposed between the cathode and the first inorganic layer, and an orthographic projection of the light-extracting layer onto the substrate covers an orthographic projection of the light-emitting layer onto the substrate.
[0010] In a screen panel according to some embodiments of the present application, the light-extracting layer extends from the screen area to the first barrier and is in direct contact with one side of the first barrier near the conductive wiring; and the orthographic projection of the light-extracting layer onto the substrate covers the orthographic projection of the conductive wiring onto the substrate.
[0011] In a screen panel according to some embodiments of the present application, the conductive wiring includes an overlap part and an exposure part arranged on one side of the overlap part away from the screen area; The light-extracting layer extends in one direction from the screen area toward the conductive wiring and is in direct contact with the overlay part, and the orthographic projection of the light-extracting layer onto the substrate covers an orthographic projection of the overlay part onto the substrate; and the barrier layer includes a barrier sublayer extending from one side of the light-extracting layer to the first barrier, and an orthographic projection of the barrier sublayer onto the substrate covers an orthographic projection of the exposure part onto the substrate.
[0012] In a screen panel according to some embodiments of the present application, the barrier layer includes a barrier sublayer disposed between the light-extracting layer and the first inorganic layer, and extends from the screen area to the first barrier, and an orthographic projection of the barrier sublayer onto the substrate covers the orthographic projection of the conductive wiring onto the substrate.
[0013] In a screen panel according to some embodiments of the present application, the barrier sublayer is made of at least one material selected from magnesium fluoride, aluminum fluoride, sodium fluoride and lithium fluoride.
[0014] In a screen panel according to some embodiments of the present application, the conductive wiring includes a plurality of hollow holes that pass through the conductive wiring in a direction perpendicular to the substrate. Petition 870250076469, dated 08 / 28 / 2025, p. 35 / 65 4 / 17
[0015] In a screen panel according to some embodiments of the present application, the hollow holes have a selected shape of rectangle, circle or triangle.
[0016] Some embodiments of the present application provide a screen device, including a screen panel, which includes a screen area and a frame area adjacent to the screen area; The structure area includes a substrate, and a signaling wiring, a planarization layer, a conductive wiring, and an encapsulation layer sequentially stacked on the substrate; and the encapsulation layer includes a first inorganic layer arranged over the conductive wiring; The screen area includes the substrate, the planarization layer, and an anode arranged on one side of the planarization layer away from the substrate, and the conductive wiring extends from one side of the anode into the frame area and is connected to the signaling wiring; and the screen panel includes a barrier layer arranged between the conductive wiring and the first inorganic layer, and an orthographic projection of the barrier layer onto the substrate covers an orthographic projection of the conductive wiring onto the substrate.
[0017] In a screen device according to some embodiments of the present application, the screen panel includes a barrier portion disposed between the planar layer and the encapsulation layer, and the barrier portion is disposed on one side of the conductive wiring away from the screen area; and the barrier layer is in direct contact with one side of the barrier portion close to the conductive wiring in the frame area.
[0018] In a screen device according to some embodiments of the present application, the barrier part includes a first barrier and a second barrier spaced apart, and the first barrier is located on one side of the second barrier close to the screen area; and the height of the first barrier is greater than the thickness of the conductive wiring, the conductive wiring extends from one side of the anode to the first barrier, and the barrier layer is in direct contact with one side of the first barrier close to the conductive wiring.
[0019] In a screen device according to some embodiments of the present application, the screen area includes a pixel-defining layer, a light-emitting layer, a common layer, and a cathode sequentially stacked on the anode, and the first inorganic layer is disposed on one side of the cathode away from the common layer; and the barrier layer includes a light-extracting layer disposed between the cathode and the Petition 870250076469, dated 08 / 28 / 2025, p. 36 / 65 5 / 17 first inorganic layer, and an orthographic projection of the light-extracting layer onto the substrate covers an orthographic projection of the light-emitting layer onto the substrate.
[0020] In a screen device according to some embodiments of the present application, the light-extracting layer extends from the screen area to the first barrier and is in direct contact with one side of the first barrier near the conductive wiring; and the orthographic projection of the light-extracting layer onto the substrate covers the orthographic projection of the conductive wiring onto the substrate.
[0021] In a screen device according to some embodiments of the present application, the conductive wiring includes an overlay part and an exposure part arranged on one side of the overlay part away from the screen area; The light-extracting layer extends in one direction from the screen area toward the conductive wiring and is in direct contact with the overlay part, and the orthographic projection of the light-extracting layer onto the substrate covers an orthographic projection of the overlay part onto the substrate; and the barrier layer includes a barrier sublayer extending from one side of the light-extracting layer to the first barrier, and an orthographic projection of the barrier sublayer onto the substrate covers an orthographic projection of the exposure part onto the substrate.
[0022] In a screen device according to some embodiments of the present application, the barrier layer includes a barrier sublayer disposed between the light-extracting layer and the first inorganic layer and extending from the screen area to the first barrier, and an orthographic projection of the barrier sublayer onto the substrate covers the orthographic projection of the conductive wiring onto the substrate.
[0023] In a display device according to some embodiments of the present application, the barrier sublayer is made of at least one material selected from magnesium fluoride, aluminum fluoride, sodium fluoride and lithium fluoride.
[0024] In a screen device according to some embodiments of the present application, the conductive wiring includes a plurality of hollow holes that pass through the conductive wiring in a direction perpendicular to the substrate.
[0025] In a screen device according to some embodiments of the present application, the hollow holes have a selected shape of rectangle, circle or triangle. BENEFICIAL EFFECTS
[0026] The embodiments of the present application provide a screen panel and a screen device. By configuring a barrier layer being disposed between a conductive wiring and Petition 870250076469, dated 08 / 28 / 2025, p. 37 / 65 6 / 17 a first inorganic layer, and an orthographic projection of the barrier layer onto a substrate covering an orthographic projection of the conductive wiring onto the substrate, the present application avoids high-energy plasma bombardment damage to the conductive wiring — a problem that occurs when the plasma-enhanced chemical vapor deposition method is used to prepare the first inorganic layer in the related technique, avoiding the presence of an irregular thickness of the first inorganic layer. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The technical solutions and other beneficial effects of this application will be apparent through the detailed description of the specific implementation of this application in combination with the attached drawings.
[0028] FIG. 1 is a schematic structural diagram of a screen panel in the related technique.
[0029] FIG. 2 is a first schematic cross-sectional diagram of a screen panel according to some embodiments of the present application.
[0030] FIG. 3 is a second schematic cross-sectional diagram of a screen panel according to some embodiments of the present application.
[0031] FIG. 4 is a third schematic cross-sectional diagram of a screen panel according to some embodiments of the present application.
[0032] FIG. 5 is a fourth schematic cross-sectional diagram of a screen panel according to some embodiments of the present application.
[0033] FIG. 6 is a top view of a display part according to some embodiments of this application. DETAILED DESCRIPTION
[0034] In conjunction with the drawings in the embodiments of this application, the technical solutions in the embodiments of this application will be described clearly and completely. Apparently, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort belong to the scope of this application.
[0035] The embodiments in this application provide a display panel and a display device. A detailed description follows. It should be noted that the following order of description of the embodiments does not serve as a limitation on a preferred order of embodiments. Furthermore, in the description of this application, the terms “includes” refer to “include, but are not limited to”. The terms “first, second and third” are used only Petition 870250076469, dated 08 / 28 / 2025, p. 38 / 65 7 / 17 as indications and do not impose numerical requirements or establish an order. Several embodiments of this application may exist in the form of a range. It should be understood that the description in range form is only for convenience and objectivity, and should not be understood as a rigid limitation of the scope of this application. Therefore, it should be considered that the range described specifically discloses all possible sub-ranges and a single value within the range.
[0036] With reference to FIGS. 2 to 6, the embodiments of this application provide a screen panel and a screen device. Screen panel 2 includes a screen area 1000 and a structure area 2000 adjacent to screen area 1000. Structure area 2000 includes a substrate 10, a signaling wire 21, a planar layer 30, a conductive wire 42, and an encapsulation layer 90 sequentially stacked on top of substrate 10. The encapsulation layer 90 includes a first inorganic layer 91 arranged over the conductive wire 42. Screen area 1000 includes substrate 10, planar layer 30, and an anode 41 arranged on one side of the planar layer 30 away from substrate 10. The conductive wire 42 extends from one side of the anode 41 into structure area 2000 and is connected to the signaling wire 21.Screen panel 2 additionally includes a barrier layer 80 that is disposed between the conductive wiring 42 and the first inorganic layer 91, and an orthographic projection of the barrier layer 80 onto the substrate 10 covers an orthographic projection of the conductive wiring 42 onto the substrate 10.
[0037] It should be noted that a plasma-enhanced chemical vapor deposition (PECVD) method is generally used to prepare inorganic layers of an encapsulation layer in the related technique. In practice, during the production of the inorganic layers, a mask may be provided and attached to a substrate to protect certain functional areas, so as to avoid damage to wiring in the functional areas.In contrast, since an area of the structure of a screen panel in the related technique includes a substrate, and a signaling wiring, a planarization layer, and a conductive wiring sequentially arranged on the substrate, a portion of the conductive wiring exposed outside the mask can be bombarded by plasma, and metal ions present in the conductive wiring are bombarded by the plasma and bound to the edge of the mask, resulting in alteration of the magnetic field due to the bombarded metal ions, which affects the distribution of the plasma gas, resulting in uneven thickness of the inorganic layer at the edge of the mask, affecting the ability of the inorganic layer to block water and oxygen.
[0038] It can be understood that, when configuring the barrier layer being placed between the Petition 870250076469, dated 08 / 28 / 2025, p. 39 / 65 8 / 17 conductive wiring and the first inorganic layer, and the orthographic projection of the barrier layer onto the substrate covering the orthographic projection of the conductive wiring onto the substrate, the embodiments of the present application can achieve a uniform thickness of the first inorganic layer to improve the ability of the encapsulation layer to block water and oxygen. In contrast, in the related technique, when using a plasma-enhanced chemical vapor deposition method to prepare the first inorganic layer, since the metal ions in the conductive wiring are easily bombarded by the plasma and bound to the edge of the mask, the distribution of the plasma gas can be affected due to changes in the magnetic field caused by the bombarded metal ions, resulting in uneven thickness of the first inorganic layer at the edge of the mask.
[0039] The technical solutions of this application are described in combination with the following specific embodiments. Mode 1
[0040] With reference to FIG. 2, which illustrates a first schematic cross-sectional diagram of a screen panel according to an embodiment of the present application.
[0041] The present embodiment provides a screen panel 2 comprising a screen area 1000 and a frame area 2000 adjacent to the screen area 1000. It can be understood that the screen panel 2 can be a liquid crystal display panel or an active light-emitting display panel, such as an organic light-emitting diode (OLED) display panel, an active matrix organic light-emitting diode (AMOLED) display panel, a passive matrix OLED display panel or a quantum dot light-emitting diode (QLED) panel. In the present embodiment, the organic light-emitting diode display panel is used as an example to illustrate a technical solution of the present application.
[0042] In the present embodiment, the structure area 2000 includes a substrate 10, signaling wiring 21, planarization layer 30, conductive wiring 42, and encapsulation layer 90 sequentially stacked on the substrate 10, and the encapsulation layer 90 includes the first inorganic layer 91 arranged on the conductive wiring 42. The screen area 1000 includes the substrate 10, the planarization layer 30, and the anode 41 arranged on one side of the planarization layer 30 away from the substrate 10.
[0043] In the present embodiment, the substrate 10 includes a base 11, a blocking layer 12, and a matrix substrate (not shown in the figures) arranged in a stacked configuration. The base 11 can be a rigid base 11 or a flexible base 11. When the base 11 is a rigid base, the material of the rigid base can be metal or glass. When Petition 870250076469, dated 08 / 28 / 2025, page 40 / 65 9 / 17 The base 11 is the flexible base; a flexible base material may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane-based resin, cellulosic resin, siloxane resin, polyimide-based resin, and polyamide-based resin. Preferably, the base 11 is a flexible base and the base material 11 is polyimide. A blocking layer material 12 includes, but is not limited to, a material with water absorption performance such as silicon nitride (SiNX) and / or silicon oxide (SiOX). The matrix substrate may be a thin-film transistor (TFT) matrix substrate, and a thin-film transistor in the TFT matrix substrate may be a top-gate type transistor or a bottom-gate type transistor. The present embodiment does not create specific limitations on them.
[0044] In addition, the screen area 1000 further includes a pixel definition layer 50, a light-emitting layer 60, a common layer (not shown in the figures), and a cathode 70 sequentially stacked on the anode 41. The common layer includes at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. An anode material 41 includes, but is not limited to, indium tin oxide (ITO). The signaling wiring 21 can be either VSS wiring or VDD wiring. The conductive wiring 42 extends from one side of the anode 41 into the structure area 2000. The planarization layer 30 includes a first through hole 31, and the conductive wiring 42 is connected to the signaling wiring 21 through the first through hole 31.In screen panel 2, the VDD wiring is connected to one end of the anode of screen panel 2 to transmit an anodic voltage, and the VSS wiring is connected to one end of the cathode of screen panel 2 to transmit a cathodic voltage. In the present embodiment, signaling wiring 21 being configured as VSS wiring is used as an example for illustration.
[0045] In the present embodiment, the screen panel 2 includes a barrier portion 100 that is disposed between the planarization layer 30 and the encapsulation layer 90, and the barrier portion 100 is disposed on one side of the conductive wiring 42 away from the screen area 1000. It can be understood that the barrier portion 100, the barrier layer 80, and the encapsulation layer 90 in the present embodiment are configured to effectively encapsulate the OLED devices in the screen area 1000 and a wiring structure in the non-screen area 1000. A main structure of each of the OLED devices includes the anode 41, the cathode 70, and the light-emitting layer 60 that is disposed between the anode 41 and the cathode 70 arranged in a stacked configuration. The anode 41 and the light-emitting layer 60 of the OLED devices Petition 870250076469, dated 08 / 28 / 2025, p. 41 / 65 10 / 17 are separated from each other by the pixel definition layer 50. The cathodes 70 of the OLED devices form an integrated structure, or the cathodes 70 of a number of OLED devices are connected to form an integrated structure.
[0046] The barrier part 100 is made of an organic material, such as polyimide, or similar. The encapsulation layer 90 can be a single-layer structure or a stacked-layer structure. In the present embodiment, the stacked-layer structure—formed by alternating layers of inorganic materials and layers of organic materials—is considered an example of the encapsulation layer 90 to illustrate a technical solution of the present application. Specifically, in the present embodiment, the encapsulation layer 90 includes the first inorganic layer 91, an organic layer 92, and a second inorganic layer 93 sequentially stacked on the cathode 70. Both the first inorganic layer 91 and the second inorganic layer cover the barrier part 100, and the organic layer 92 is arranged on one side of the barrier part 100 near the screen area 1000.
[0047] Furthermore, in the present embodiment, the barrier layer 80 is in direct contact with one side of the barrier portion 100 near the conductive wiring 42 in the area of the structure 2000. Specifically, the barrier portion 100 includes a first barrier 101 and a second barrier 102 spaced apart, and the first barrier 101 is arranged on one side of the second barrier 102 near the area of the screen 1000. A height of the first barrier 101 is greater than a thickness of the conductive wiring 42, and the conductive wiring 42 extends from one side of the anode 41 to the first barrier 101. The barrier layer 80 is in direct contact with one side of the first barrier 101 near the conductive wiring 42, and an orthographic projection of the barrier layer 80 onto the substrate 10 covers an orthographic projection of the conductive wiring 42 onto the substrate 10.
[0048] It can be understood that, compared with screen panel 2 in the related technique, the present embodiment, by configuring the height of the first barrier 101 to be greater than the thickness of the conductive wiring 42, and the conductive wiring 42 extending from one side of the anode 41 to the first barrier 101, reduces an area of the conductive wiring 42, thus reducing the total amount of substances / metallic ions bombarded by the plasma, weakening the influence of the plasma-enhanced chemical vapor deposition method on the thickness of the first inorganic layer 91. In the related technique, since a first inorganic layer 91 is in direct contact with a conductive wiring 42, and the plasma-enhanced chemical vapor deposition method is used to prepare the first inorganic layer Petition 870250076469, dated 08 / 28 / 2025, page 42 / 65 11 / 17 91, a portion of the conductive wiring 42 exposed outside the mask can be bombarded by high-energy plasma, and indium and tin ions in the conductive wiring 42 are easily bombarded and bound to the edge of a mask, affecting the plasma gas distribution caused by the alteration of the magnetic field due to the bombarded metal ions, resulting in an uneven thickness of the first inorganic layer 91 at the edge of the mask. In the present embodiment, by configuring the barrier layer 80 directly in contact with one side of the first barrier 101 near the conductive wiring 42, and the orthographic projection of the barrier layer 80 onto the substrate 10 covering the orthographic projection of the conductive wiring 42 onto the substrate 10, the aforementioned phenomena can be avoided.
[0049] Furthermore, in the present embodiment, the barrier layer 80 includes a light-extracting layer 81 that is disposed between the cathode 70 and the first inorganic layer 91, and an orthographic projection of the light-extracting layer 81 onto the substrate 10 covers an orthographic projection of the light-emitting layer 60 onto the substrate 10 in the screen area 1000. In addition, the orthographic projection of the light-extracting layer 81 onto the substrate 10 covers an orthographic projection of the cathode 70 onto the substrate 10, which can prevent high-energy plasma bombardment damage to the cathode 70, a problem that occurs when a plasma-enhanced chemical vapor deposition method is used to prepare the first inorganic layer 91 in the related technique, thus preventing the presence of irregular thickness of the first inorganic layer 91.
[0050] Specifically, in the present embodiment, the light-extracting layer 81 extends from the screen area 1000 to the first barrier 101, and the light-extracting layer 81 is in direct contact with one side of the first barrier 101 near the conductive wiring 42. The orthographic projection of the light-extracting layer 81 onto the substrate 10 covers the orthographic projection of the conductive wiring 42 onto the substrate 10. It can be understood that, by configuring the orthographic projection of the light-extracting layer 81 onto the substrate 10 covering the orthographic projection of the conductive wiring 42 onto the substrate 10, the present embodiment can avoid high-energy plasma bombardment damage to the conductive wiring 42—a problem that occurs when a plasma-enhanced chemical vapor deposition method is used to prepare the first inorganic layer 91 in the related technique, thus avoiding the presence of irregular thickness of the first inorganic layer 91.At the same time, by configuring the orthographic projection of the light-extracting layer 81 onto the substrate 10 covering the orthographic projection of the light-emitting layer 60 onto the substrate 10 in the screen area 1000, the present embodiment can adjust an optical interference distance of the light-extracting layer 81 to suppress it. Petition 870250076469, dated 08 / 28 / 2025, page 43 / 65 12 / 17 reflects external light, thus improving light extraction efficiency. Mode 2
[0051] With reference to FIG. 3, which illustrates a second schematic cross-sectional diagram of a screen panel according to an embodiment of the present application.
[0052] In this embodiment, the screen panel structure is similar to or the same as the screen panel provided by Embodiment 1. See the screen panel description in Embodiment 1 for similar or identical parts, which will not be repeated here. The differences between Embodiment 2 and Embodiment 1 are shown in the description below.
[0053] In the present embodiment, the conductive wiring 42 includes an overlay portion 421 and an exposure portion 422 disposed on one side of the overlay portion 421 away from the screen area. The light-extracting layer 81 extends in a direction from the screen area 1000 towards the conductive wiring 42, and the light-extracting layer 81 is in direct contact with a conductive wiring 42. The orthographic projection of the light-extracting layer 81 onto the substrate 10 covers an orthographic projection of the overlay portion 421 on the substrate 10. The barrier layer 80 includes a barrier sublayer 82, which extends from one side of the light-extracting layer 81 to the first barrier 101. An orthographic projection of the barrier sublayer 82 covers an orthographic projection of the exposure portion 422 on the substrate 10.
[0054] Furthermore, in the present embodiment, the area of structure 2000 includes a first area of structure 2100 and a second area of structure 2200. The first area of structure 2100 is disposed between a second area of structure 2200 and the area of screen 1000. The overlay part 421 is disposed in the first area of structure 2100, and the exposure part 422 is disposed in the second area of structure 2200. Specifically, the overlay part 421 extends from one side of the anode 41 to the first area of structure 2100, the exposure part 422 extends from one side of the overlay part 421 to the second area of structure 2200, and the overlay part 421 and the exposure part 422 are disposed in the same layer and connected to each other.
[0055] The light-extracting layer 81 extends from the screen area 1000 to the first structure area 2100, and is in direct contact with the overlay part 421. The orthographic projection of the light-extracting layer 81 onto the substrate 10 covers the orthographic projection of the overlay part 421 onto the substrate 10. The barrier sublayer 82 and the light-extracting layer 81 are arranged in the same layer, the barrier sublayer 82 is in direct contact with the exposure part 422, and the orthographic projection of the barrier sublayer 82 onto the substrate 10 covers the orthographic projection of the exposure part 422 onto the substrate 10. Petition 870250076469, dated 08 / 28 / 2025, page 44 / 65 13 / 17 Specifically, one end of the barrier sublayer 82 near the light-extracting layer 81 is in direct contact with the light-extracting layer 81, and the other end of the barrier sublayer 82 near the first barrier 101 is in direct contact with the first barrier 101.
[0056] In addition, a barrier sublayer material 82 is a metal halide, which includes, but is not limited to, at least one of magnesium fluoride (MgF2), aluminum fluoride (AlF3), sodium fluoride (NaF), and lithium fluoride (LiF). Preferably, the barrier sublayer material 82 is LiF.
[0057] It can be understood that, by configuring the barrier sublayer 82 to be in the same layer as the light-extracting layer 81, the present embodiment can avoid an increase in the thickness of the screen panel 2 caused by an arrangement of the barrier sublayer 82 between the conductive wiring 42 and the first inorganic layer 91.At the same time, by configuring one side of the barrier sublayer 82 near the light-extracting layer 81 in direct contact with the light-extracting layer 81, one side of the barrier sublayer 82 near the first barrier 101 in direct contact with the first barrier 101, the orthographic projection of the light-extracting layer 81 onto the substrate 10 covering the orthographic projection of the overlay part 421 onto the substrate 10, and the orthographic projection of the barrier sublayer 82 onto the substrate 10 covering the orthographic projection of the overlay part 422 onto the substrate 10, the present embodiment can avoid high-energy plasma bombardment damage to the conductive wiring 42—a problem that occurs when a plasma-enhanced chemical vapor deposition method is used to prepare the first inorganic layer 91 in the related technique, thus avoiding the presence of an irregular thickness of the first inorganic layer 91. Mode 3
[0058] With reference to FIG. 4, which illustrates a third schematic cross-sectional diagram of a screen panel according to an embodiment of the present application.
[0059] In this embodiment, a screen panel structure is similar to or the same as the screen panel provided by Embodiment 2. See the screen panel description in Embodiment 2 for similar or identical parts, which will not be repeated here. The differences between Embodiment 3 and Embodiment 1, or between Embodiment 3 and Embodiment 2, are shown in the following description.
[0060] In the present embodiment, the barrier layer 80 includes the barrier sublayer 82 which is located between the light-extracting layer 81 and the first inorganic layer 91, the Petition 870250076469, dated 08 / 28 / 2025, pp. 45 / 65 14 / 17 barrier sublayer 82 extends from screen area 1000 to the first barrier 101, and an orthographic projection of barrier sublayer 82 onto substrate 10 covers an orthographic projection of conductive wiring 42 onto substrate 10.
[0061] Specifically, the light-extracting layer 81 extends in a direction from the screen area 1000 towards the conductive wiring 42, and the light-extracting layer 81 is in direct contact with a conductive wiring 42. An orthographic projection of the light-extracting layer 81 onto the substrate 10 covers an orthographic projection of at least part of the conductive wiring 42 onto the substrate 10. One end of the barrier sublayer 82 near the first barrier 101 is in direct contact with the first barrier 101, and an orthographic projection of the barrier sublayer 82 onto the substrate 10 covers the orthographic projection of the light-extracting layer 81 onto the substrate 10.
[0062] It can be understood that, by configuring the barrier sublayer 82 extending from the screen area 1000 to the first barrier 101, and the orthographic projection of the barrier sublayer 82 onto the substrate 10 covering the orthographic projection of the conductive wiring 42 onto the substrate 10, the present embodiment can avoid high-energy plasma bombardment damage to the conductive wiring 42—a problem that occurs when a plasma-enhanced chemical vapor deposition method is used to prepare the first inorganic layer 91 in the related technique, thus avoiding the presence of an irregular thickness of the first inorganic layer 91.At the same time, by configuring the barrier sublayer 82 as being disposed between the light-extracting layer 81 and the first inorganic layer 91, and the orthographic projection of the barrier sublayer 82 onto the substrate 10 covering the orthographic projection of the light-extracting layer 81 onto the substrate 10, the barrier sublayer 82 can protect the light-extracting layer 81 and the light-emitting layer 60, thus preventing damage to the light-extracting layer 81 and the light-emitting layer 60 during the formation of the encapsulation layer 90. Mode 4
[0063] With reference to FIG. 5 and FIG. 6, FIG. 5 is a schematic fourth cross-sectional diagram of a screen panel according to an embodiment of the present application, and FIG. 6 is a top view of a display part according to an embodiment of the present application.
[0064] In this embodiment, a screen panel structure is similar to or the same as the screen panel provided by Embodiment 3. See the screen panel description in Embodiment 3 for identical or similar parts, which will not be repeated here. The difference between Petition 870250076469, dated 08 / 28 / 2025, p. 46 / 65 15 / 17 The above modalities are detailed below.
[0065] In the present embodiment, the conductive wiring 42 includes a plurality of hollow holes 422A passing through the conductive wiring 42 in a direction perpendicular to the substrate 10. A hollow hole shape 422A includes, but is not limited to, one between rectangle, circle and triangle.
[0066] Specifically, in the present embodiment, the area of structure 2000 includes a first area of structure 2100 and a second area of structure 2200, and the first area of structure 2100 is disposed between the second area of structure 2200 and the area of screen 1000. The conductive wiring 42 includes an overlapping part 421 and an exposed part 422, the overlapping part 421 is disposed in the first area of structure 2100 and extends from one side of the anode 41 to the first area of structure 2100, the exposed part 422 is disposed in the second area of structure 2200 and extends from one side of the overlapping part 421 to the second area of structure 2200, and the overlapping part 421 and the exposed part 422 are disposed in the same layer and connected to each other.
[0067] The light-extracting layer 81 extends from screen area 1000 to the first structure area 2100, and the light-extracting layer 81 is in direct contact with the overlay part 421. An orthographic projection of the light-extracting layer 81 onto the substrate 10 covers an orthographic projection of the overlay part 421 on the substrate 10. The barrier sublayer 82 is arranged in the same layer as the light-extracting layer 81, and is in direct contact with the exposure part 422. An orthographic projection of the barrier sublayer 82 onto the substrate 10 covers an orthographic projection of the exposure part 422 on the substrate 10.
[0068] Exposure portion 422 includes a plurality of hollow holes 422A passing through exposure portion 422 in a direction perpendicular to substrate 10, and the plurality of hollow holes 422A are filled with barrier sublayer 82.
[0069] It can be understood that, in the embodiment of the present application, when configuring the exposure part 422 to include the plurality of hollow holes 422A, the plurality of hollow holes 422A passes through the exposure part 422 in the direction perpendicular to the substrate 10, and the plurality of hollow holes 422A is filled with the barrier sublayer 82. Compared to the existing screen panel 2, this structure reduces the area of the conductive wiring 42, thus reducing the total amount of metal substances / ions bombarded by the plasma, weakening the influence of the existing plasma-enhanced chemical vapor deposition method on the thickness of the first inorganic layer 91. Petition 870250076469, dated 08 / 28 / 2025, p. 47 / 65 16 / 17
[0070] It should be noted that the configuration where the exposed part 422 includes the plurality of hollow holes 422A, the plurality of hollow holes 422A passes through the exposed part 422 in the direction perpendicular to the substrate 10, and the plurality of hollow holes 422A that are filled with the barrier sublayer 82 serve only for illustrative purposes. In other embodiments, such as Embodiment 1, Embodiment 2 and Embodiment 3, the conductive wiring 42 may be fully provided with a plurality of hollow holes 422A, and the present embodiment does not impose specific limitations on this.
[0071] Some embodiments provide a display device that includes a display panel as described in any of the aforementioned embodiments.
[0072] It may be understood that the screen panel has been described in detail in the aforementioned modalities, and they will not be repeated here.
[0073] In specific applications, the screen device may be a display screen of a device, such as a smartphone, a tablet, a laptop, a smart bracelet, a smartwatch, smart glasses, a smart helmet, a desktop computer, a smart television or a digital camera, and may even be applied to an electronic device with a flexible screen.
[0074] In view of the foregoing, the present application provides the screen panel and the screen device, and the screen panel includes the screen area and the non-screen area adjacent to the screen area. The frame area includes the substrate, and the signaling wiring, the planarization layer, the conductive wiring and the encapsulation layer sequentially arranged over the substrate, and the encapsulation layer includes the first inorganic layer arranged over the conductive wiring. The screen area includes the substrate, the planarization layer and the anode arranged on the planarization layer side away from the substrate, and the conductive wiring extends from the anode side into the frame area and is connected to the signaling wiring.The present application, by configuring the barrier layer as being disposed between the conductive wiring and the first inorganic layer, and the orthographic projection of the barrier layer onto the substrate covering the orthographic projection of the conductive wiring onto the substrate, achieves a uniform thickness of the first inorganic layer to improve the encapsulation layer's ability to block water and oxygen. In contrast, when using a plasma-enhanced chemical vapor deposition method to prepare the first inorganic layer in the related technique, since the metal ions in the conductive wiring are easily bombarded by the plasma and bound to the edge of the mask, the plasma gas distribution can be affected due to changes in a magnetic field caused by the bombarded metal ions, resulting in a... Petition 870250076469, dated 08 / 28 / 2025, page 48 / 65 17 / 17 phenomenon of irregular thickness of the first inorganic layer at the edge of the mask.
[0075] Based on the above, although the present application has been disclosed with the aforementioned preferred embodiments, the preferred embodiments are not intended to limit the present application. Skilled individuals may create various modifications and improvements without departing from the spirit and scope of the present application. Therefore, the scope of protection of this application is subject to a scope defined by the claims. Petition 870250076469, dated 08 / 28 / 2025, p. 49 / 65
Claims
1 / 3 CLAIMS 1.Screen panel, characterized in that it comprises a screen area and a structure area adjacent to the screen area; wherein the structure area comprises a substrate, and a signaling wiring, a planarization layer, a conductive wiring and an encapsulation layer sequentially stacked on the substrate; and the encapsulation layer comprises a first inorganic layer disposed over the conductive wiring; and wherein the screen area comprises the substrate, the planarization layer and an anode disposed on one side of the planarization layer away from the substrate, and the conductive wiring extends from one side of the anode into the structure area and is connected to the signaling wiring; wherein the screen panel further comprises a barrier layer disposed between the conductive wiring and the first inorganic layer, and an orthographic projection of the barrier layer onto the substrate covers an orthographic projection of the conductive wiring onto the substrate.
2. Screen panel, according to claim 1, characterized in that the screen panel comprises a barrier portion disposed between a planar layer and the encapsulation layer, and the barrier portion is disposed on one side of the conductive wiring away from the screen area; and in that the barrier layer is in contact with one side of the barrier portion near the conductive wiring in the structure area.
3. Screen panel, according to claim 1, characterized in that the screen panel comprises a barrier portion disposed between the planarization layer and the encapsulation layer, and the barrier portion is disposed on one side of the conductive wiring away from the screen area, wherein the barrier portion comprises a first barrier and a second barrier spaced apart, the first barrier is disposed on one side of the second barrier close to the screen area; and wherein the height of the first barrier is greater than the thickness of the conductive wiring, the conductive wiring extends from one side of the anode of the first barrier, and the barrier layer is in contact with one side of the first barrier close to the conductive wiring.
4. Screen panel, according to claim 1, characterized in that the screen panel comprises a barrier portion disposed between the planarization layer and the encapsulation layer, and the barrier portion is disposed on one side of the conductive wiring away from the screen area, wherein the barrier portion comprises a first barrier and a second barrier spaced apart, the first barrier is disposed on one side of the second barrier close to the screen area; and wherein a distance from a surface of the first barrier away from the substrate to the substrate is greater than a distance from a surface of the conductive wiring away from the substrate to the substrate, the conductive wiring extends from one side of the anode to the first barrier, and the barrier layer is in contact with one side of the first barrier close to the conductive wiring.
5. Screen panel, according to claim 3 or claim 4, characterized in that the barrier layer is in direct contact with the side of the first barrier next to the conductive wiring.
6. Screen panel, according to claim 1, characterized in that the screen area comprises a pixel-defining layer, a light-emitting layer, a common layer, and a cathode sequentially stacked on the anode, and the first inorganic layer is disposed on one side of the cathode away from the common layer; and the barrier layer comprises a light-extracting layer disposed between the cathode and the first inorganic layer, and an orthographic projection of the light-extracting layer onto the substrate covers an orthographic projection of the light-emitting layer onto the substrate.
7. Screen panel, according to claim 6, characterized in that the orthographic projection of the light-extracting layer onto the substrate covers an orthographic projection of the cathode onto the substrate.
8. Screen panel, according to claim 6, characterized in that the screen panel comprises a barrier portion disposed between the planarization layer and the encapsulation layer, and the barrier portion is disposed on one side of the conductive wiring away from the screen area, wherein the barrier portion comprises a first barrier and a second barrier spaced apart, the first barrier being disposed on one side of the second barrier close to the screen area; wherein the light-extracting layer extends from the screen area to the first barrier and is in contact with one side of the first barrier close to the conductive wiring; and wherein the orthographic projection of the light-extracting layer onto the substrate covers the orthographic projection of the conductive wiring onto the substrate.
9. Screen panel, according to claim 8, characterized in that the light-extracting layer is in direct contact with the side of the first barrier close to the conductive wiring. Petition 870250076469, dated 08 / 28 / 2025, pp. 59 / 65 3 / 3 10. Screen panel, according to claim 6, characterized in that the conductive wiring comprises an overlay portion and an exposure portion disposed on one side of the overlay portion away from the screen area; wherein the light-extracting layer extends in a direction from the screen area towards the conductive wiring and is in contact with the overlay portion, and the orthographic projection of the light-extracting layer onto the substrate covers an orthographic projection of the overlay portion onto the substrate; and wherein the barrier layer comprises a barrier sublayer extending from one side of the light-extracting layer to the first barrier, and an orthographic projection of the barrier sublayer onto the substrate covers an orthographic projection of the exposure portion onto the substrate.
11. Screen panel, according to claim 6, characterized in that the barrier layer comprises a barrier sublayer disposed between the light-extracting layer and the first inorganic layer, the barrier sublayer extending from the screen area to the first barrier, and an orthographic projection of the barrier sublayer onto the substrate covers the orthographic projection of the conductive wiring onto the substrate.
12. Screen panel, according to claim 10 or 11, characterized in that the barrier sublayer is made of at least one material selected from magnesium fluoride, aluminum fluoride, sodium fluoride, and lithium fluoride.
13. Screen panel, according to any one of claims 1 to 12, characterized in that the conductive wiring comprises a plurality of hollow holes passing through the conductive wiring in a direction perpendicular to the substrate.
14. Screen panel, according to claim 13, characterized in that the hollow holes have a selected shape of rectangle, circle or triangle.
15. Screen device, characterized in that it comprises the screen panel, as defined in any one of claims 1 to 14. Petition 870250076469, dated 08 / 28 / 2025, pp. 60 / 65