SWITCHABLE AUTOMATIC AUDIO ATTENUATION DEVICE

Abstract

The present disclosure provides for a togglable audio ducking device preferably with a mechanically triggered pressure-sensitive floor pad that detects pressure when a user's body weight is in the proximity of the microphone. The mechanically triggered pressure-sensitive floor pad may allow the user to effectively reduce ambient noise bleed into microphones without muting the microphone (i.e. audio ducking). In other embodiments, the togglable audio ducking device may be operated using a magnetic switch attached to a microphone stand, which is triggered when the microphone stand rotates in a particular direction to a certain degree.

Description

/ 20 SWITCHABLE AUTOMATIC AUDIO ATTENUATION DEVICE Cross-reference to related requests

[001] This application claims the benefit of the filing date of United States Provisional Patent Application No. 63 / 488,285, filed March 3, 2023, entitled “Pressure-Controlled Audio Ducking Circuit,” the description of which is incorporated by reference herein. Background

[002] Microphones pick up sound waves in the air and transform them into electrical signals. To replicate the original audio, the electrical signals can be sent from the microphone output to a mixer or audio interface for recording, amplification, and / or distribution to loudspeakers. In live sound applications, unwanted sound waves can often be picked up and amplified when users move away from the microphone diaphragm, exposing the microphone to ambient sound sources in the room. This occurrence is also known as microphone "leakage".

[003] An existing solution to this problem is known as a “noise gate,” which systematically determines when levels fall below a certain threshold and subsequently reduces the microphone output level within a defined range. A limitation of noise gates is that levels must return to a point higher than the cutoff threshold for the microphone to operate at maximum volume. This processing time can cause an abrupt reintroduction of sound, cutting off the initial milliseconds of the intended sound capture. Brief Summary

[004] The present description provides a switchable automatic audio attenuation device, preferably with a mechanically actuated pressure-sensitive floor plate that detects pressure when a user's body weight is placed on the pressure-sensitive floor plate. A Petition 870250088809, dated 09 / 30 / 2025, page 6 / 57 / 20 A mechanically actuated pressure-sensitive floor plate may allow the user to effectively reduce ambient noise leakage into microphones without muting the microphones (i.e., automatic audio attenuation). In other embodiments, the switchable automatic audio attenuation device may be operated using a magnetic switch connected to a microphone stand, which is activated when the user rotates the microphone stand to a certain degree in a specific direction.

[005] In one aspect of the present description, a switchable automatic audio attenuation device comprises: an audio circuit, a power supply circuit, an automatic audio attenuation switch and an automatic audio attenuation circuit configured to reduce a level of an audio signal in the audio circuit, wherein the audio circuit, the power supply circuit, the automatic audio attenuation switch and the automatic audio attenuation circuit are in switchable electronic communication, and wherein the automatic audio attenuation switch has a first position that allows electronic communication between the audio circuit and the power supply circuit, and a second position that prevents electronic communication between the audio circuit and the power supply circuit.

[006] In some examples, the device further comprises an optimized power supply, wherein the optimized power supply is in electronic communication with the audio circuit, the power supply circuit, the automatic audio attenuation switch and the automatic audio attenuation circuit.

[007] In some examples, the audio circuit comprises an audio input, an audio output, a power connection port, an interface connection, and at least one solid-state array.

[008] In some examples, the automatic audio attenuation circuit comprises at least one solid-state array, a capacitor, and a resistor. Petition 870250088809, dated 09 / 30 / 2025, page 7 / 57 / 20

[009] In some examples, the device further comprises a plurality of solid-state relays, wherein the automatic audio attenuation circuit is configured to adjust a level of audio signal gain reduction based on switching a current path and an audio path from the audio input to one or more of the plurality of solid-state relays.

[0010] In some examples, the device additionally comprises a single solid-state relay, wherein the automatic audio attenuation circuit is configured to adjust a level of audio signal gain reduction based on one or more resistance paths.

[0011] In some examples, the plurality of solid-state relays is configured to provide a parallel resistance between the automatic audio attenuation switch and the audio output to provide the gain reduction level relative to an accumulated resistance of the audio circuit.

[0012] In some examples, the device further comprises a network of switchable resistors, wherein the network of switchable resistors is configured to create one or more paths from the audio signal from the automatic audio attenuation switch to the audio output to provide one or more levels of gain reduction selectable by use of the audio signal.

[0013] In some examples, the network of switchable resistors includes at least two or more resistors with variable resistances.

[0014] In some examples, the device additionally comprises an indicator light, wherein the indicator light is configured to turn on in response to activation of the automatic audio attenuation switch.

[0015] In some examples, the automatic dimming switch of Petition 870250088809, dated 09 / 30 / 2025, page 8 / 57 / 20 audio is a pressure-sensitive switch.

[0016] In some examples, the power supply circuit comprises a DC protection circuit, a DC ripple protection circuit, a plurality of status LEDs, a pressure-sensitive plate, and a holding capacitor, wherein the holding capacitor is configured to provide extended switchable bypass of the automatic audio attenuation switch, preventing electronic communication between the audio circuit and the power supply circuit.

[0017] In some examples, the pressure-sensitive board comprises a connecting cable, a first conductive layer, a first non-conductive layer, a second conductive layer, a second non-conductive layer and a third non-conductive layer, wherein the third non-conductive layer is configured to have at least one perforation, wherein the first conductive layer has at least one protrusion that interfaces with the at least one perforation, and wherein the at least one protrusion is configured to provide switchable electronic communication between the first conductive layer and the second conductive layer.

[0018] In some examples, the first conductive layer and the second conductive layer are configured to provide switchable electronic communication between them by applying pressure to the pressure-sensitive plate.

[0019] In some examples, the automatic audio attenuation switch is a magnetic switch.

[0020] In some examples, the power supply circuit comprises a DC protection circuit, a DC ripple protection circuit, a plurality of status LEDs, a magnetic sensor and a holding capacitor, wherein the holding capacitor is configured to provide extended switchable bypass of the magnetic switch, preventing electronic communication through the automatic audio attenuation circuit. Petition 870250088809, dated 09 / 30 / 2025, page 9 / 57 / 20

[0021] In some examples, the magnetic switch comprises a magnetic sensor and a magnetic actuator, wherein the magnetic sensor includes a metal blade arm connected to at least two conductive wires.

[0022] In some examples, the magnetic switch is connected to the automatic audio attenuation circuit and the magnetic switch is attached to a microphone stand.

[0023] In some examples, the two lead wires are configured to come into contact in response to a rotation of the microphone stand with the magnetic switch connected to the automatic audio attenuation circuit, and wherein the automatic audio attenuation circuit is configured to be deactivated in response to the two lead wires coming into contact.

[0024] In some examples, the two lead wires are configured to move away from each other in response to a second rotation of the microphone stand with the magnetic switch connected to the automatic audio attenuation circuit, and wherein the automatic audio attenuation circuit is configured to be activated in response to the two lead wires being moved away from each other. Brief Description of the Drawings

[0025] Figure 1 is a schematic diagram of the pressure-controlled automatic audio attenuation circuit according to one aspect of the description.

[0026] Figure 2 is a diagram of a switch inside the pressure-sensitive plate according to one aspect of the description.

[0027] Figure 3 is a diagram of a TRS connector according to one aspect of the description.

[0028] Figure 4 illustrates a schematic view of the layers within the pressure-sensitive plate according to one aspect of the description.

[0029] Figure 5 is a diagram of a balanced audio circuit. Petition 870250088809, dated 09 / 30 / 2025, p. 10 / 57 / 20 according to one aspect of the description.

[0030] Figure 6 is a diagram illustrating the pin connections of the audio circuit according to one aspect of the description.

[0031] Figure 7A is a diagram that illustrates the construction of the automatic audio attenuation circuit according to one aspect of the description.

[0032] Figure 7B is a diagram showing a 2P2T key according to one aspect of the description.

[0033] Figure 7C is a diagram showing the audio and power supply circuit paths using multiple solid-state relays according to one aspect of the description.

[0034] Figure 7D is a diagram showing the audio circuit paths using a single solid-state relay and a resistor network according to one aspect of the description.

[0035] Figure 8A is a schematic diagram of the pressure-controlled automatic audio attenuation circuit according to one aspect of the description.

[0036] Figure 8B is a schematic diagram of the pressure-controlled automatic audio attenuation circuit according to one aspect of the description.

[0037] Figure 8C is a schematic diagram of the pressure-controlled automatic audio attenuation circuit according to one aspect of the description.

[0038] Figure 9A is a schematic diagram of a magnetic microphone switch according to an aspect of the description.

[0039] Figure 9B is a schematic diagram of a magnetic microphone switch according to an aspect of the description. Detailed Description

[0040] The preferred embodiments of the present invention will now be Petition 870250088809, dated 09 / 30 / 2025, p. 11 / 57 / 20 described with reference to the drawings. Identical elements in the various Figures are identified with the same reference numerals.

[0041] Detailed reference will now be made to each embodiment of the present invention. Such embodiments are provided by way of explanation of the present invention, which is not intended to be limited to it in any way. In fact, those skilled in the art may realize, upon reading this descriptive report and viewing the present drawings, that various modifications and variations can be made thereto.

[0042] For the purposes of this description of the invention, unless specifically exempted, the singular includes the plural and vice versa, the words “and” and “or” will be conjunctive and disjunctive, the words “any” and “all” will mean both “any and all”.

[0043] The present description provides a switchable automatic audio attenuation device that can reduce the audio levels of an audio source, which can be bypassed by activating a pressure-sensitive switch or a magnetic switch. The switchable automatic microphone attenuation device can be composed of two parts: (1) a power supply circuit; and (2) an audio circuit. These two parts can be isolated from each other, although they can interact with each other through various components.

[0044] Figure 1 illustrates a power supply system for a switchable automatic audio attenuation system using a pressure-sensitive plate. Power can be supplied by an optimized power supply 8 that connects via a power connection jack 8c mounted on the device interface (I / F) 19 (not shown in Figure 1). The power supplied by the optimized power supply 8 can be configured to pass through a power protection circuit 9 comprising reverse polarity protection and current smoothing capacitors. The optimized power supply 8 can be optimized for light Petition 870250088809, dated 09 / 30 / 2025, page 12 / 57 / 20 of power supply indicator 10, activation light of the automatic audio attenuation circuit 11 and for a solid-state relay array 14 that are included in the automatic audio attenuation circuit (“ADC”). The ADC components are described in more detail below in connection with Figures 6, 7, 7a and 7b. It is noted that any power consumption minimization process can be used to optimize the power supply 8. Any solid-state relay array 14 with suitable switching, such as the 2P3T switch 7b, can be configured to provide users with different magnitudes of gain reduction based on the parallel resistance design of the arrays. In other embodiments, the parallel resistance design can be implemented using a switchable resistor network.

[0045] The holding capacitor 12 can be configured to optimize the sustained retention of the ADC bypass when a user steps on or applies pressure to the pressure-sensitive plate 1. The capacitance of the holding capacitor 12 can be pre-configured to retain the ADC bypass state for approximately one (1) to two (2) seconds. In other embodiments, the capacitance value can be changed to any value within a range of microseconds to a few seconds to increase or decrease the retention time. The duration of the retention time can be delayed by the time the capacitance allows. The holding capacitor 12 can also be designed to have lower capacitance to provide a short retention time. In other embodiments, the holding capacitor 12 can be omitted to provide the shortest possible retention time.

[0046] The DC ripple protection circuit set 13 can be configured to smooth the current to protect the solid-state relays 14. The ripple value of the DC ripple protection circuit set 13 can be pre-configured to meet the technical specifications of any type of solid-state relay. In some embodiments, the Petition 870250088809, dated 09 / 30 / 2025, page 13 / 57 / 20 DC ripple protection circuit set 13 may be omitted.

[0047] In one embodiment, at least two user-activated switches may be configured to connect via I / F device 19 (not shown in Figure 1). For example, a 2P2T switch 7a may be configured to control the indication of whether the ADC is being activated or ignored using indicator light 11. The 2P3T switch 7b may be configured to switch between power and audio signals for three (3) stages of the ADC (described in more detail below). The number of stages need not be limited to three. For example, the number may be four, five or six, etc. The type and / or mechanism of the switching may include a computer-controlled digital switch, or any other known switching system or switchable network of switches capable of isolating the power and audio signals.

[0048] The pressure-sensitive plate 1 can be configured to connect to the I / F device 19 via the stereo jack (Tip Ring Sleeve) (TRS) connector 5. In other embodiments, any other type of connector can be used to connect the pressure-sensitive plate 1 to the I / F device 19, provided that the pressure-sensitive plate is mechanically compatible with the adjacent connectors via a minimum 2-conductor connection.

[0049] The anti-bounce switch 17 may comprise a standard RC circuit containing a resistor connected to ground and a capacitor connected to the pressure-sensitive plate 1. The design and / or configuration of the anti-bounce switch 17 may be adjusted based on a desired smoothing time of the electrical properties of the pressure-sensitive plate 1.

[0050] Indicator light 18 can be set to signal activation of pressure-sensitive plate 1. In other modes, indicator light 18 can be omitted.

[0051] In other embodiments, a single solid-state relay may be connected between the DC ripple protection circuitry. Petition 870250088809, dated 09 / 30 / 2025, page 14 / 57 / 20 and switch 2P3T 7b. If the single solid-state relay is connected between the DC ripple protection circuit assembly 13 and switch 2P3T 7b, a resistor network can replace the solid-state relay matrix 14. In this case, the resistor network can be connected between switch 2P3T 7b and pressure-sensitive plate 1.

[0052] Figures 2 to 4 illustrate each component of the pressure-sensitive plate 1 according to the present description.

[0053] Figure 2 illustrates a switch within the pressure-sensitive plate 1. The pressure-sensitive plate switch illustrated in Figure 2 can disconnect or connect circuit A 2 and circuit B 4. Circuit A 2 and circuit B 4 may include conductive matrices printed on a flexible plastic non-conductive medium. The components of each matrix can be any conductive medium and attachable to cable 6 described below. The matrix design can be of any design that can be effectively activated by a user. The properties of the materials used in the pressure-sensitive plate switch can be selected to allow the user to have a desired result without unnecessary activation delay when the user uses any automatic attenuation device containing the apparatus described in this document.The size of the pressure-sensitive area of ​​the pressure-sensitive plate switch may vary depending on the compatibility of the electrical design of the pressure-sensitive plate with the electrical design of the automatic dimming device.

[0054] Figure 3 is a diagram of a TRS connector 5. A 0.635 cm (á”) TRS connector may have three terminals. In some embodiments, terminal A is intended for transmission of circuit A 2 and terminal B is intended for transmission of circuit B 4. The ground terminal may be connected to a ground wire that serves as an electromagnetic interface shield for cable 6. The ground wire may be used as a reinforcement element for cable 6 without being connected to any circuit. Any Petition 870250088809, dated 09 / 30 / 2025, page 15 / 57 / 20: The length or type of cable and connector may be used, provided that the connector can transmit to at least two circuits and is suitable for any type of electrical design of any automatic audio attenuation device.

[0055] Figure 4 illustrates a schematic view of the layers within the pressure-sensitive board. The enclosures of pressure-sensitive boards 1a and 1b may consist of a heat-sealable vinyl material that is non-conductive, moisture-resistant, and may enclose layers 2 and 4. The material for the enclosures of pressure-sensitive boards 1a and 1b may be any non-conductive material. To increase durability, foldability, and functionality, a medium-thickness vinyl with center and side stitching in contrasting colors may be selected. The attributes mentioned above may be adjusted based on color, size, stitching / seamlessness, or durability. In other examples, materials such as carpet or open and closed-cell foams may be used. Layer 2 may be connected to circuit A 2 and layer 4 may be connected to circuit B 4.As described in connection with Figure 2, circuit A2 and circuit B4 may comprise two (2) independent conductive matrices printed on a flexible non-conductive plastic medium. The design of these matrices may be altered to ensure that a portion of a user's body weight, when placed on the surface area of ​​a footprint, forces conductivity between layers 2 and 4. Layer 3 may consist of closed-cell foam with precise perforations to serve as a non-conductive layer between circuit A2 and circuit B4. Layer 3 may be placed between circuit A2 and circuit B4. When the user's body weight is not compressing layer 3, the switch described in Figure 2 may be in an open state to prevent current flow between circuit A2 and circuit B4. The thickness and density of the foam may be designed to accommodate the user's weight. Any non-conductive medium capable of keeping circuits A2 and B4 separate. Petition 870250088809, dated 09 / 30 / 2025, page 16 / 57 / 20 when no weight is applied and allowing circuits A2 and B4 to connect when the appropriate weight is applied can be used.

[0056] Figure 5 illustrates a balanced audio circuit of the switchable automatic audio attenuation device. One male end of the microphone cable 20 can be connected to an “input” XLR female jack connector 21 which can be configured to be mounted on the I / F device 19. The connection using the aforementioned XLR connector can be a balanced audio signal connection with positive, negative and ground signals. Although the industry standard balanced XLR audio connector can be used, any three (3) conductor balanced audio connector can work with the switchable automatic audio attenuation device described in this document. The signals transmitted to the “input” XLR female jack connector 21 can be sent directly to the “output” XLR male jack connector 22, which is also mounted on the I / F device 19.A user can connect the male XLR “output” jack connector 22 to a standard microphone cable female end (23) for the next desired stage of sound processing. The power connection jack 8c and the pressure-sensitive plate jack 5c can be mounted on the I / F device 19. The power connection jack 8c can be connected to the optimized power supply 8, as illustrated in Figure 1, and the pressure-sensitive plate jack 5c can be connected to the TRS connector 5, as illustrated in Figure 3, respectively.

[0057] Figure 6 illustrates the wiring of the pins of the balanced audio connections and the automatic audio attenuation circuit (ADC). The male end of the microphone cable 20, the female XLR “input” jack connector 21, the male XLR “output” jack connector 22 and the female end of the microphone cable 23 can comprise three (3) pins: ground, positive and negative pins. Each pin of each end of the cable can be Petition 870250088809, dated 09 / 30 / 2025, page 17 / 57 / 20 connected to the corresponding pin of the jack connectors. For example, pin 1 of the male end of the microphone cable 20 can be connected to pin 1 of the female XLR jack connector “input” 21 and pin 1 of the female XLR jack connector “input” 21 can be connected to pin 1 of the male XLR jack connector “output”, etc. The ADC components (solid-state relays 14, resistor 15, and capacitor 16 described in connection with Figure 7A below) can be connected between pin 2 of the female XLR jack connector “input” 21 and pin 3 of the male XLR jack connector “output” 22. In other embodiments, the ADC components can be connected between pin 3 of the female XLR jack connector “input” 21 and pin 2 of the male XLR jack connector “output” 22.

[0058] Figure 7A illustrates the details of the automatic audio attenuation circuit (ADC). Balanced audio can be transmitted from the audio source and connectors via the “input” XLR female jack 21 mounted on the I / F device 19. Although audio signals can be connected directly to the respective pins of the “output” XLR female jack 22, an alternative path between pin (p2) of the “input” XLR female jack connector 21 and pin (p3) of the “output” XLR male jack connector 22 can be connected. The aforementioned path can be connected using the 2P2T switch 7a, the 2P3T switch 7b, and solid-state relays 14. In addition, the 47kΩ resistor 15 and the 470uF capacitor 16 can be connected between the p2-p2 path and the p3-p3 path.When the pressure-sensitive plate 1 is deactivated by the user (i.e., the weight is removed), the control pins of the solid-state relay 14 are deactivated, and the signal terminal becomes a closed circuit by closing pin 2, which, in turn, shortens the path between p2 of the "input" XLR female jack connector 21 and p3 of the "output" XLR male jack connector 22. When the path is shortened, capacitor 16 can discharge through resistor 15. Due to the inherent on-resistance of the solid-state relays 14, the parallel resistance can reduce the total resistance. Petition 870250088809, dated 09 / 30 / 2025, page 18 / 57 / 20, thus causing a reduction in gain at the audio input level relative to the cumulative resistance. By switching the current path and the audio path to 14 solid-state relays with different resistances in the on-state, users can choose an appropriate gain reduction level for the ADC. It should be noted that any type of solid-state relay can be used to achieve an automatic attenuation or muting effect on the audio circuitry, with the resulting gain reduction relative to the parallel resistance above. In other embodiments, the parallel resistance path can be designed using only one solid-state relay connected to a network of switchable resistor paths to create multiple user-selectable gain reduction levels within the ADC.

[0059] Figure 7B is a diagram showing a 2P2T switch in more detail. Pole 26 of the 2P2T switch 7a can connect pin 2 of the XLR female jack 21 to the 2P3T switch 7b or to an open wire “No connection” (“NC”). Pole 25 of the 2P2T switch can close the power circuit via the ADC indicator light 11 to indicate ADC activation or bypass.

[0060] Figure 7C is a diagram showing a 2P3T 7b switch connected to a network of solid-state relays 14. A power supply circuit and an audio circuit can transmit to the switch 7b as separate paths. The optimized power supply 8 can be connected via the power input jack 8c mounted on the I / F device 19. When power reaches the 2P3T 7b switch, the current can be switched to one of three paths: power supply paths - Solid State Relay 1 (SSR 1), Solid State Relay 2 (SSR 2), and Solid State Relay 3 (SSR 3). The negative terminals of these relays can be joined into a common negative path and can be connected to the pressure-sensitive plate 1, the switch anti-bounce circuit assembly 17, and the ADC indicator light 18. The 2P3T 7b switch can be connected to the negative or positive side of the relay. Petition 870250088809, dated 09 / 30 / 2025, page 19 / 57 / 20 of solid state 14.

[0061] Figure 7C also illustrates an audio circuit path. The audio signal can pass from switch 2P2T 7 and can be routed to the “switch” side of SSR 1, SSR 2 and SSR 3. After the audio signals are transmitted to one of the three relays, the audio signals are summed with the audio outputs of the other relays before being sent to the “output” XLR male jack connector 22.

[0062] Figure 7D is a diagram showing a 1P3T 7c switch connected to the ADC between p2 of the female XLR jack connector “input” 21, resistor network 14A and p3 of the male XLR jack connector “output” 22. The resistance in resistor path 1 can be set to 0 ohms, the resistance in resistor path 2 can be set to have a value greater than 0 ohms, and the resistance in resistor path 3 can be set to have a value in ohms greater than that of the resistance in resistor path 2.

[0063] Figure 8A is a schematic diagram of the circuit board comprising the power connection jack J1 corresponding to the power connection jack 8c illustrated in Figure 1, power protection circuit 9 including a reverse polarity protection diode D4 and current smoothing capacitors C1 to C3.

[0064] Figure 8B is a schematic diagram of the circuit board comprising a group of circuit routings for power indicator light 10, automatic audio attenuation circuit (ADC) activation light 11 and indicator light 18 illustrated as D3.

[0065] Figure 8C is a schematic diagram of the automatic audio attenuation circuit board using a 1P3T 7c switch to route the audio signal between p2 of the “input” XLR female jack connector 21, a network of resistors 14 and p3 of the output XLR male jack connector 22. The J4 section of the circuit board corresponds to the TRS jack 5c illustrated in Figure 5. Diode D2 indicates the location of the holding capacitor 12. The Petition 870250088809, dated 09 / 30 / 2025, page 20 / 57 / 20 resistors R4, R5, R6, R10 and capacitors C4 and C6 can be configured to reduce switch bounce and smooth the current when pressure-sensitive plate 1 is activated by the user's body weight. Switch SW2 can correspond to the routing of switch 1P3T 7 c for the three resistor options for users to select heavy, medium, or light gain reduction at the microphone level. Resistor R11 corresponds to resistor 15 of 47 kΩ and capacitor C5 corresponds to capacitor 16 of 470 uF illustrated in Figure 1 and can be placed between the XLR connectors XLR_P2 and XLR_P3. The SW1 switch can correspond to a user bypass switch equipped with a 2P2T 7a switch that can be configured to control the ADC 11 indicator light showing ADC activation or bypass.

[0066] Figures 9A to B are schematic diagrams of a magnetic microphone switch. Figure 9A illustrates components of a magnetic blade switch that can be used to switch the automatic audio attenuation circuit instead of the pressure-sensitive plate. The magnetic switch can be attached to a microphone stand. The magnetic switch may comprise magnetic sensor 31 and magnetic actuator 33. The magnetic sensor 31 may include a magnetic blade acting as a mechanical switch between two circuit wires 32 and 34 within it. The magnetic actuator 33 may be any type of configurable magnet to generate a magnetic field that can move the connecting wires of the metal blade arm 32 and 34 so that they come into contact with each other or move away from each other within the magnetic sensor 31. The first wire 32 may be connected to circuit A 2 and the second wire 34 may be connected to circuit B 4, or vice versa.If two wires 32 and 34 are connected, circuit A2 and circuit B4 can be connected to activate the ADC bypass.

[0067] The proximity of magnetic sensor 31 and the actuator Petition 870250088809, dated 09 / 30 / 2025, page 21 / 57 / 20 magnetic 33 can be pre-configured to define a threshold force to activate the metal blade arm to connect wires 32 and 34. Each magnet can have varying intensities; thus, the proximity determined by a degree of rotation can vary according to the designs of a magnetic switch and a microphone stand. In other embodiments, the direction and degree of rotation can be manually adjusted according to the user's preference.

[0068] Figure 9B illustrates a microphone stand extender containing a magnetic switch on the exterior. The magnetic switch described above can be attached to a vertical post of a microphone stand. The microphone stand extender 37 can be screwed onto the top of any type of microphone stand 39. The magnetic actuator 33 can be attached to the exterior of the microphone stand extender 37. A snap-in magnetic sensor 38 includes a magnetic sensor 31 and can be attached to the lower post of the microphone stand 39 using any known snap-in mechanism, so that when the microphone stand extender 37 is rotated to a certain point in a specific direction, the proximity of the magnetic sensor 31 to the position of the magnetic actuator 33 changes.When the distance between the magnetic sensor 31 and the magnetic actuator 33 becomes less than a pre-configured threshold distance, the metal blade arm inside the magnetic sensor 31 can connect wires 32 and 34 in Figure 9A. When the user rotates the microphone support extender 37 in an opposite direction or rotates it further in the same direction, the distance between the magnetic sensor 31 and the magnetic actuator 33 exceeds the pre-configured threshold distance and thus moves the metal blade arm away from the connecting wires 32 and 34 in Figure 9A, thereby activating the ADC. The plug-in magnetic sensor 38 may include connector 35. Connector 35 may be a TRS connector connected to the I / F device 19. Any other type of connector with necessary circuit conductors may also be used. Petition 870250088809, dated 09 / 30 / 2025, page 22 / 57 / 20 used to connect the 38-pin magnetic sensor to the I / F 19 device.

[0069] In other embodiments, a different type of magnetic switch, such as a Hall effect switch, may be used. The microphone stand extender 37 may be replaced by a second microphone stand fitting that can be connected to another portion of a factory microphone stand.

[0070] It is further understood that, although ordinal terms such as “first”, “second”, and “third” are used in this document to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, and / or section from another element, component, region, layer, and / or section. Thus, a “first element”, “component”, “region”, “layer”, and / or “section” discussed below could be called a second element, component, region, layer, and / or section without departing from the precepts in this document.

[0071] The features illustrated or described as part of one embodiment may be used with another embodiment and such variations are within the scope of the appended claims and their equivalents.

[0072] Spatially relative terms, such as “under,” “below,” “lower,” “above,” “upper,” and the like, are used in this document to facilitate the description of the relationship of one element or feature to another element(s) or feature(s), as illustrated in the Figures. It is understood that spatially relative terms are intended to encompass different orientations of the device in use or operation, in addition to the orientation represented in the Figures. For example, if the device in the Figures is flipped, the elements described as “under” or “below” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “under” can encompass both a Petition 870250088809, dated 09 / 30 / 2025, page 23 / 57 / 20 orientation above as well as below. The device may be oriented in another way (rotated 90 degrees or in other orientations) and the spatially relative descriptors used in this document may be interpreted accordingly.

[0073] Examples of embodiments are described in this document with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Therefore, variations in the shapes of the illustrations, for example, from manufacturing techniques and / or tolerances, are expected. Therefore, example embodiments described in this document should not be interpreted as limited to the particular shapes of regions illustrated in this document, but should include deviations in shapes resulting, for example, from manufacturing. For example, a region illustrated or described as flat may, normally, have rough and / or non-linear features. Furthermore, acute angles that are illustrated may be rounded. Thus, the regions illustrated in the Figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the present claims.

[0074] As the invention has been described in connection with what are now considered to be the most practical and varied embodiments, it should be understood that the invention is not to be limited to the embodiments described, but rather is intended to cover various equivalent modifications and arrangements included within the scope of the appended claims. Although specific terms are employed in this document, they are used only in a generic and descriptive sense and not for purposes of limitation.

[0075] This written description uses examples to describe the invention, including the best mode, and also to enable anyone skilled in the art to practice the invention, including manufacturing and using any devices or systems and carrying out any methods incorporated. The patentable scope of the invention is defined in the claims. Petition 870250088809, dated 09 / 30 / 2025, page 24 / 57 / 20 and may include other examples that occur to those skilled in the art. These other examples must be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims. Petition 870250088809, dated 09 / 30 / 2025, page 25 / 57

Claims

1 / 5 CLAIMS 1. Switchable automatic audio attenuation device, characterized in that it comprises: an audio circuit; a power supply circuit; an automatic audio attenuation switch; and an automatic audio attenuation circuit configured to reduce the level of an audio signal in the audio circuit, wherein the audio circuit, the power supply circuit, the automatic audio attenuation switch and the automatic audio attenuation circuit are in switchable electronic communication, and wherein the automatic audio attenuation switch has a first position that allows electronic communication between the audio circuit and the power supply circuit, and a second position that prevents electronic communication between the audio circuit and the power supply circuit.

2. Device according to claim 1, characterized in that it further comprises an optimized power supply, wherein the optimized power supply is in electronic communication with the audio circuit, the power supply circuit, the automatic audio attenuation switch and the automatic audio attenuation circuit.

3. Device according to claim 2, characterized in that the audio circuit comprises an audio input, an audio output, a power connection port, an interface connection and at least one solid-state array.

4. Device according to claim 3, characterized in that the automatic audio attenuation circuit comprises at least one solid-state array, a capacitor, and a resistor.

5. Device according to claim 4, characterized in that it further comprises a plurality of solid-state relays, wherein the automatic audio attenuation circuit is configured to adjust a gain reduction level of the audio signal based on switching between a current path and an audio path from the audio input to the plurality of solid-state relays.

6. Device according to claim 4, characterized in that it further comprises a single solid-state relay, wherein the automatic audio attenuation circuit is configured to adjust a level of audio signal gain reduction based on one or more resistance paths.

7. Device according to claim 5, characterized in that the plurality of solid-state relays is configured to provide a parallel resistance between the automatic audio attenuation switch and the audio output to provide the gain reduction level with respect to an accumulated resistance of the audio circuit.

8. Device according to claim 4, characterized in that it further comprises a network of switchable resistors, wherein the network of switchable resistors is configured to create one or more paths from the audio signal from the automatic audio attenuation switch to the audio output to provide one or more levels of gain reduction selectable by use of the audio signal.

9. Device according to claim 8, characterized in that the network of switchable resistors includes at least two or more resistors with variable resistances.

10. Device according to claim 1, characterized in that it further comprises an indicator light, wherein the indicator light is configured to turn on in response to activation of the automatic audio attenuation switch. Petition 870250088809, dated 09 / 30 / 2025, page 27 / 57 3 / 5 11. Device according to claim 1, characterized in that the automatic audio attenuation switch is a pressure-sensitive switch.

12. Device according to claim 11, characterized in that the power supply circuit comprises a DC protection circuit, a DC ripple protection circuit, a plurality of status LEDs, a pressure-sensitive plate and a holding capacitor, wherein the holding capacitor is configured to provide extended switchable bypass of the automatic audio attenuation switch, preventing audio communication through the automatic audio attenuation circuit.

13. Device according to claim 12, characterized in that the pressure-sensitive plate comprises a connecting cable, a first conductive layer, a first non-conductive layer, a second conductive layer, a second non-conductive layer, and a third non-conductive layer, wherein the third non-conductive layer is configured to have at least one perforation, wherein the first conductive layer has at least one protrusion that interfaces with the at least one perforation, and wherein the at least one protrusion is configured to provide switchable electronic communication between the first conductive layer and the second conductive layer.

14. Device according to claim 13, characterized in that the first conductive layer and the second conductive layer are configured to provide switchable electronic communication between them by applying pressure to the pressure-sensitive plate. Petition 870250088809, dated 09 / 30 / 2025, page 28 / 57 4 / 5 15. Device according to claim 1, characterized in that the automatic audio attenuation switch is a magnetic switch.

16. Device according to claim 15, characterized in that the power supply circuit comprises a DC protection circuit, a DC ripple protection circuit, a plurality of status LEDs, a magnetic sensor and a holding capacitor, wherein the holding capacitor is configured to provide extended switchable bypass of the magnetic switch, preventing electronic communication through the automatic audio attenuation circuit.

17. Device according to claim 16, characterized in that the magnetic switch comprises a magnetic sensor and a magnetic actuator, wherein the magnetic sensor includes a metallic blade arm connected to at least two conductive wires.

18. Device according to claim 17, characterized in that the magnetic switch is connected to the automatic audio attenuation circuit, wherein the magnetic switch is fixed to a microphone stand.

19. Device according to claim 18, characterized in that the two conducting wires are configured to make contact in response to a first rotation of the microphone holder with the magnetic switch connected to the automatic audio attenuation circuit, and wherein the automatic audio attenuation circuit is configured to be deactivated in response to the two conducting wires making contact.

20. Device according to claim 19, characterized in that the two conducting wires are configured to move away from each other in response to a second rotation of the microphone holder with the magnetic switch connected to the automatic audio attenuation circuit, and wherein the automatic audio attenuation circuit is configured to be activated in response to the two conducting wires being moved away from each other.

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