ANTENNA APPARATUS, METHOD FOR MANUFACTURING AN ANTENNA APPARATUS, AND ELECTRICAL DEVICE

Description

1 / 51 “ANTENNA APPARATUS, METHOD FOR MANUFACTURING ANTENNA APPARATUS, AND ELECTRICAL DEVICE” CROSS-REFERENCE TO RELATED DEPOSIT REQUESTS

[0001] This patent application claims the benefit of US Provisional Patent Application No. 63 / 490,172, entitled ANTENNA ON GLASS WITH THROUGH GLASS VIA SIDEWALL ELECTROMAGNETIC INTERFERENCE SHIELDING, filed March 14, 2023, assigned to the assignee of the present invention and expressly incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] This disclosure refers generally to an antenna apparatus and, more particularly, to a glass antenna pad with a through-glass sidewall shielding structure (TGV). BACKGROUND

[0003] Integrated circuit technology has made great strides in advancing computing power through the miniaturization of active components. Packaged devices can be found in many electronic components, including processors, servers, radio frequency (RF) integrated circuits, etc. Packaged technology offers a good cost / benefit ratio in devices with high pin counts and / or components with high production volumes.

[0004] Additionally, an antenna-on-glass (AOG) chip can be used to form an antenna in front-end circuitry assembly. Petition 870250078524, dated 03 / 09 / 2025, page 8 / 140 2 / 51 radio frequency (RF) (e.g., used in millimeter wave (mmWave)), where the RF front-end circuitry can be additionally mounted on a package substrate along with other electrical components. However, without a suitable shielding structure (e.g., for shielding against electromagnetic interference (EMI)), an antenna based on an AOG chip can still be affected by EMI from adjacent components, which can cause degraded antenna gain, throughput, and / or bandwidth.

[0005] Consequently, there is a need for an improved AOG pad and a method for making such an AOG pad that can provide a shielding structure in order to address the aforementioned problems. SUMMARY

[0006] A simplified summary relating to one or more aspects disclosed in the present invention is presented below. Therefore, the following summary should not be considered an extensive overview relating to all aspects contemplated, nor should the following summary be considered to identify key or critically important elements relating to all aspects contemplated, or to delineate the scope associated with any particular aspect. Consequently, the following summary has the sole purpose of presenting certain concepts relating to one or more aspects related to the mechanisms disclosed in the present invention in a simplified form to precede the detailed description presented below.

[0007] In one aspect, an antenna apparatus includes a glass substrate having an upper surface, a Petition 870250078524, dated 03 / 09 / 2025, p. 9 / 140 3 / 51 lower surface and a lateral portion surrounding the vitreous substrate and connecting the upper surface and the lower surface; a first conductive structure on the upper surface of the vitreous substrate; a second conductive structure on the lower surface of the vitreous substrate;and a through-glass (TGV) structure including a first conductive film on a side wall of a first TGV hole, the first TGV hole being defined in the glass substrate and extending from the upper surface of the glass substrate to the lower surface of the glass substrate, and the first conductive film being configured to couple the first conductive structure to the second conductive structure, wherein the side portion includes a plurality of metallized recess structures, the plurality of metallized recess structures having recess side walls connecting the upper surface and the lower surface and a plurality of second conductive films respectively on the recess side walls of the plurality of metallized recess structures, each recess side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole.

[0008] In one aspect, a method for manufacturing an antenna apparatus includes forming a first conductive structure on an upper surface of a glass substrate, the glass substrate having an upper surface, a lower surface, and a lateral portion encircling the glass substrate and connecting the upper and lower surfaces; forming a second conductive structure on the lower surface of the glass substrate; and forming Petition 870250078524, dated 03 / 09 / 2025, page 10 / 140 4 / 51 a through-glass (TGV) structure including a first conductive film on a side wall of a first TGV hole, the first TGV hole being defined in the glass substrate and extending from the upper surface of the glass substrate to the lower surface of the glass substrate, and the first conductive film being configured to couple the first conductive structure to the second conductive structure, wherein the side portion includes a plurality of metallized recess structures, the plurality of metallized recess structures having recess side walls connecting the upper surface and the lower surface and a plurality of second conductive films respectively on the recess side walls of the plurality of metallized recess structures, each recess side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole.

[0009] In one aspect, an electrical device includes one or more processors; and an antenna apparatus coupled to the one or more processors, wherein the antenna apparatus comprises: a glass substrate having an upper surface, a lower surface and a lateral portion encircling the glass substrate and connecting the upper surface and the lower surface; a first conductive structure on the upper surface of the glass substrate; a second conductive structure on the lower surface of the glass substrate; and a through-glass (TGV) structure including a first conductive film on a lateral wall of a first TGV hole, the first TGV hole being defined in the glass substrate and extending from Petition 870250078524, dated 03 / 09 / 2025, page 11 / 140 5 / 51 upper surface of the glass substrate to the lower surface of the glass substrate, and the first conductive film being configured to couple the first conductive structure to the second conductive structure, wherein the lateral portion includes a plurality of metallized recess structures, the plurality of metallized recess structures having recess side walls connecting the upper surface and the lower surface and a plurality of second conductive films respectively on the recess side walls of the plurality of metallized recess structures, each recess side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole.

[0010] Other objectives and advantages associated with the aspects disclosed in the present invention will become apparent to those skilled in the art based on the accompanying drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] A fuller understanding of aspects of the disclosure and of many of the advantages associated therewith will be readily obtained as these are better understood by reference to the detailed description that follows, when considered in connection with the accompanying drawings, which are presented for illustration purposes only and not for limitation of the disclosure.

[0012] Figure 1A is a simplified perspective view of an example of an antenna glass (AOG) chip, according to aspects of the disclosure. Petition 870250078524, dated 03 / 09 / 2025, page 12 / 140 6 / 51

[0013] Figure 1B is a simplified cross-sectional view of a portion of the example AOG insert from Figure 1A, in accordance with aspects of the disclosure.

[0014] Figure 1C shows an enlarged view of a track structure through the glass (TGV), according to aspects of the disclosure.

[0015] Figure 1D shows an enlarged view of a metallized recess structure, according to aspects of the disclosure.

[0016] Figure 1E shows an enlarged view of a metallized TGV hole structure, according to aspects of the disclosure.

[0017] Figure 2A shows a top view of a glass substrate wafer, according to aspects of the disclosure.

[0018] Figure 2B shows a top view of a glass substrate panel, according to aspects of the disclosure.

[0019] Figure 3A is a top view of a portion of a glass-based substrate, according to aspects of the disclosure.

[0020] Figure 3B is an enlarged top view of a portion of the glass base substrate of Figure 3A, in accordance with aspects of the disclosure.

[0021] Figure 3C is an enlarged top view of a portion of an AOG wafer separated from the glass base substrate, in accordance with aspects of the disclosure.

[0022] Figure 4 is a simplified top view of an AOG pad showing another example configuration of connecting the conductive films to the walls. Petition 870250078524, dated 03 / 09 / 2025, p. 13 / 140 7 / 51 lateral recesses at a ground reference level, according to disclosure aspects.

[0023] Figures 5A to 5N illustrate simplified cross-sectional views of structures at various stages of manufacturing one or more AOG inserts, according to aspects of the disclosure.

[0024] Figure 6 illustrates a method for manufacturing an antenna apparatus, according to aspects of the disclosure.

[0025] Figure 7 illustrates a mobile device, according to aspects of the disclosure.

[0026] Figure 8 illustrates various electrical devices that may incorporate an antenna apparatus as described in the present invention, according to aspects of the disclosure.

[0027] According to common practice, the attributes depicted by the drawings may not be drawn to scale. Consequently, the dimensions of the depicted attributes may be arbitrarily expanded or reduced for clarity. According to common practice, some of the drawings are simplified for clarity. Thus, the drawings may not depict all the components of a particular apparatus or method. Additionally, similar reference numbers denote similar attributes throughout the descriptive report and figures. DETAILED DESCRIPTION

[0028] The following description provides aspects of the disclosure, and related drawings are provided for various illustrative purposes. Alternative aspects may be conceived without departing from the scope of the disclosure. Additionally, well-known elements of Petition 870250078524, dated 03 / 09 / 2025, p. 14 / 140 8 / 51 disclosures will not be described in detail or will be omitted so as not to obscure the relevant details of the disclosure.

[0029] Several aspects refer generically to an antenna apparatus (for example, a glass antenna pellet (AOG)) that includes a plurality of metallized recess structures formed in a lateral portion of the glass substrate of the antenna apparatus, as well as a method for forming the antenna apparatus with the metallized recess structures.

[0030] Particular aspects of the matter described in this disclosure can be implemented to achieve one or more of the following potential advantages. In some examples, the process of forming the metallized recess structures can be integrated into the process of forming the TGV structures and thus may not significantly increase the complexity of the manufacturing process. Meanwhile, the EMI shielding provided by the metallized recess structure can improve antenna performance (e.g., antenna gain, transfer rate, and / or bandwidth).

[0031] The words exemplifying and / or exemplary are used in the present invention to mean serving as an example, instance, or illustration. Any aspect described in the present invention as exemplifying and / or exemplary should not necessarily be interpreted as preferential or advantageous in relation to other aspects. Similarly, the term aspects of the disclosure does not require that all aspects of the disclosure include the attribute, advantage, or mode of operation discussed. Petition 870250078524, dated 03 / 09 / 2025, p. 15 / 140 9 / 51

[0032] Those skilled in the art will recognize that the information and signals described below can be represented using any one of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the description below can be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof, depending in part on the particular application, in part on the desired design, in part on the corresponding technology, etc.

[0033] Additionally, many aspects are described in terms of sequences of actions to be performed, for example, by elements of a computing device. It will be recognized that several actions described in the present invention can be performed by specific circuits (for example, by application-specific integrated circuits (ASICs)), by program instructions that are executed by one or more processors, or by a combination of both. Furthermore, the sequence(s) of actions described in the present invention can be considered as fully incorporated in any form of non-transient, computer-readable storage medium that stores a corresponding set of computer instructions which, upon execution, would cause, or instruct, an associated processor of a device to perform the functionalities described in the present invention.Thus, the various aspects of dissemination can be incorporated in many different ways, all of them. Petition 870250078524, dated 03 / 09 / 2025, page 16 / 140 10 / 51 which were considered to be within the scope of the claimed subject matter. Furthermore, for each of the aspects described in the present invention, the corresponding form of any of these aspects can be described in the present invention as, for example, logic configured to perform the described action.

[0034] Figure 1A is a simplified perspective view of an example of an antenna glass (AOG) 100 wafer, according to aspects of the disclosure. As a simplified perspective view to illustrate a non-limiting example, various attributes of the AOG 100 wafer may be simplified or not depicted in Figure 1A. In some aspects, the AOG 100 wafer may be incorporated into an electrical device such as a music player, a video player, an entertainment unit; a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, a device in a motor vehicle, or other applicable apparatus.

[0035] As shown in Figure 1A, the AOG 100 chip may include one or more antenna components, such as antenna components 101, 103, 105, 107, and 109 (with dashed lines indicating the boundaries between them in Figure 1). In some respects, each of the antenna components 101, 103, 105, 107 and 109 may share a similar configuration.

[0036] In some respects, the AOG 100 pellet may include a vitreous substrate 110 and a structure of Petition 870250078524, dated 03 / 09 / 2025, page 17 / 140 11 / 51 metallization 120 under the glassy substrate 110. The glassy substrate 110 may have an upper surface 112, a lower surface 114, and a lateral portion 116 encircling the glassy substrate 110 and connecting the upper surface 112 with the lower surface 114. In some respects, a first conductive layer may be disposed on the upper surface 112 and may include various conductive structures, such as a conductive structure 132 configured as an antenna element (e.g., a patch antenna in this example) and a conductive structure 134 configured as a conductive path of the antenna component 101.

[0037] In some respects, a second conductive layer may be arranged on the lower surface 114 as part of the metallization structure 120 and may include several conductive structures (e.g., conductive structures 122 and 124 in Figure 1B, not shown in Figure 1A). In some respects, there may be a first insulating layer (for example, insulating layer 162 in Figure 1B, not shown in Figure 1A) disposed on the upper surface 112 of the glass substrate 110 and covering at least a portion of the conductive structures on the upper surface 112 of the glass substrate 110. In some respects, there may be a second insulating layer (for example, insulating layer 164 in Figure 1B, not shown in Figure 1A) disposed on the lower surface 114 of the glass substrate 110 and covering at least a portion of the conductive structures on the lower surface 114 of the glass substrate 110. In some respects, the second insulating layer 164 may be part of the metallization structure 120.In some respects, the 120 metallization structure may include one or more additional insulating layers, conductive tracks, conductive pathways, etc. Petition 870250078524, dated 03 / 09 / 2025, p. 18 / 140 12 / 51 conductive terminal structures or any combination thereof. In some respects, the first insulating layer 162 and the second insulating layer 164 may be interlayer dielectric layers (ILDs).

[0038] In some aspects, the AOG 100 wafer may include through-glass (TGV) structures (e.g., TGV structures 142 and 144 of antenna component 101) that electrically couple one or more conductive structures on the upper surface 112 to one or more conductive structures on the lower surface 114. In some aspects, each TGV structure (e.g., TGV structure 142 or TGV structure 144) may include a TGV hole and at least one first conductive film (e.g., conductive film 172 in Figure 1B and Figure 1C) on the side wall of the TGV hole.

[0039] The lateral portion 116 may include a plurality of metallized recess structures 152. In some respects, the plurality of metallized recess structures 152 may have recess side walls connecting the upper surface 112 and the lower surface 114, and each recess of the plurality of metallized recess structures 152 may have a shape corresponding to a partial TGV hole. In some respects, a plurality of second conductive films (e.g., conductive film 174 in Figure 1B, depicted as a shaded layer in Figure 1A) may be respectively arranged on the recess side walls of the plurality of metallized recess structures 152.

[0040] In addition, the AOG 100 insert may include one or more metallized TGV hole structures. Petition 870250078524, dated 03 / 09 / 2025, page 19 / 140 13 / 51 154 through the glassy substrate 110. In some respects, at least a portion of the one or more metallized TGV hole structures 154 can be defined along the boundaries between the antenna components 101, 103, 105, 107 and 109. In some respects, each of the one or more metallized TGV hole structures 154 can correspond to a TGV hole having a second conductive film (e.g., conductive film 176 in Figure 1B), similar to those of the metallized recess structures 152, arranged on the side wall of the TGV hole.

[0041] Figure 1B is a simplified cross-sectional view of a portion of the example AOG 100 chip from Figure 1A (e.g., corresponding to antenna component 101 and a portion of antenna component 103), in accordance with aspects of the disclosure. In Figure 1B, components that are the same or similar to those in Figure 1A are given the same reference numbers, and detailed descriptions thereof may be omitted.

[0042] In Figure 1B, the first insulating layer 162 is shown in dashed line indicating that the first insulating layer 162 is not depicted in Figure 1A. Furthermore, as a simplified cross-sectional view, various conductive tracks, vias, and / or conductive terminal structures embedded in or arranged within the metallization structure 120 can be simplified in Figure 1B. In some respects, the first insulating layer 162 or the second insulating layer 164 may include silicon dioxide, an organic polymeric dielectric, polyimide, polynorbornene, benzocyclobutene, polytetrafluoroethylene, a silicone-based polymeric dielectric, or any combination thereof. Petition 870250078524, dated 03 / 09 / 2025, p. 20 / 140 14 / 51

[0043] As shown in Figure 1B, the metallization structure 120 may additionally include conductive terminal structures 182 and 184. In some respects, the conductive terminal structure 182 may be electrically coupled to the conductive structure 124 through an opening in the second insulating layer 164. In some respects, the conductive terminal structure 184 may be electrically coupled to the conductive structure 122 through another opening in the second insulating layer 164. In some respects, as non-limiting examples, each of the conductive terminal structures 182 and 184 may correspond to a solder protrusion, a copper pillar protrusion, or a microsphere protrusion.

[0044] As shown in Figure 1B, the second conductive layer may include a conductive structure 122 that is electrically coupled to the conductive structure 132 via the TGV structure 142. The second conductive layer may additionally include a conductive structure 124 which is a ground conductive structure electrically coupled to a ground reference level and may be configured as a ground panel of the antenna element formed by the conductive structure 132.

[0045] Figure 1C shows an enlarged view of a through-glass (TGV) structure 142, according to aspects of the disclosure. As shown in Figures 1B and 1C, in some aspects, the first conductive film 172 of each TGV structure 142 may include a first part 172a and a second part 172b, wherein the first part 172a is between the side wall of the TGV hole and the second part 172b. In some aspects, a dry film dielectric Petition 870250078524, dated 03 / 09 / 2025, p. 21 / 140 15 / 51 173 can fill a space in the TGV structure 142 surrounded by the first conductive film 172.

[0046] Figure 1D shows an enlarged view of a metallized recess structure 152, according to aspects of the disclosure. As shown in Figures 1B and 1D, in some aspects, the metallized recess structures 152 may include second conductive films 174 arranged on the respective recess side walls of the metallized recess structures 152. Figure 1E shows an enlarged view of a TGV hole structure 154, according to aspects of the disclosure. As shown in Figures 1B and 1E, in some respects, the metallized TGV hole structures 154 may include second conductive films 176 arranged on the respective TGV hole side walls of the metallized TGV hole structures 154. In some respects, the second conductive films 174 and 176 may be electrically coupled to a grounding conductive structure, such as the conductive structure 124.

[0047] In some respects, the first part 172a of the first conductive film 172 and of the second conductive film 174 and 176 of each metallized recess structure 152 or metallized TGV hole structure 154 may correspond to a seed conductive film and may be made of a first material, such as titanium, copper, or a combination thereof. In some respects, the second part 172b of the first conductive film 172 may correspond to an additional conductive film (e.g., by deposition or electroplating) in the seed layer and may be made of a second material, such as copper. Consequently, in some respects, a thickness of the first conductive film 172 may be greater than a Petition 870250078524, dated 03 / 09 / 2025, page 22 / 140 16 / 51 thickness of the second conductive films 174 and 176. In some respects, each of the conductive structures on the upper surface 112 and the conductive structures on the lower surface 114 may also include a first part made of the first material and corresponding to the seed layer and a second part made of the second material and corresponding to the additional conductive film.

[0048] In some respects, the second conductive films 174 on the recessed sidewalls of the plurality of metallized recess structures 152 can be electrically coupled to the ground reference level, so that the second conductive films 174 on the recessed sidewalls of the plurality of metallized recess structures 152 can be configured as a shielding structure to shield the antenna elements of the AOG 100 wafer from other components outside the AOG wafer. In some respects, the second conductive films 176 on the sidewalls of the metallized TGV hole structure 154 can be electrically coupled to the ground reference level, so that the second conductive films 174 on the sidewalls of the metallized TGV hole structure 154 can be configured as a shielding structure to shield individual antenna elements of the AOG 100 wafer from each other.

[0049] In some non-limiting examples, the conductive structure 132 can be configured as a patch antenna operating in a mmWave frequency range. In these examples, the thickness of the glass substrate 110 can vary from 0.7 millimeter (mm) to 1.0 mm. In these examples, the diameter of the TGV holes used to form the structures of Petition 870250078524, dated 03 / 09 / 2025, page 23 / 140 17 / 51 Metallized recesses 152 can vary from 80 micrometers (pm) to 150 pm. In these examples, the spacing between two adjacent metallized recess structures can vary from 80 pm to 150 pm. In some respects, the spacing between two adjacent metallized recess structures can be adjusted to be approximately the same (e.g., within 5% tolerance) as the diameter of the TGV holes used to form the metallized recess structures.

[0050] In some respects, the EMI shielding provided by the metallized re-entrant structure and / or the metallized TGV hole structures can improve antenna performance (e.g., antenna gain, transfer rate, and / or bandwidth). In some respects, EMI shielding can effectively confine electromagnetic energy within the antenna components and / or reduce electromagnetic interference from adjacent components outside the antenna components. Consequently, any degradation in the directivity and gain of each antenna component caused by EMI can be reduced, and therefore the antenna transfer rate and / or bandwidth can be improved.In some examples, the shielding structure as discussed in Figures 1A to 1E can improve antenna gain by at least 1 dB, increase the data transfer rate by at least 5%, and / or increase the bandwidth by 10%, compared to a similar AOG chip configuration without the metallized recess structures 152 on the side portion thereof.

[0051] Figure 2A shows a top view of a glass substrate wafer 210, according to aspects of the disclosure. In some respects, the glass substrate 110 of Petition 870250078524, dated 03 / 09 / 2025, p. 24 / 140 The 18 / 51 AOG 100 wafer can be based on a glass-based substrate in the form of the glass substrate wafer 210. In some respects, the glass substrate wafer 210 can be used to form a plurality of antenna components, where the five antenna components 212 can correspond to the AOG 100 wafer.

[0052] Figure 2B shows a top view of a glass substrate panel 220, according to aspects of the disclosure. In some aspects, the glass substrate 110 of the AOG 100 wafer can be based on a glass base substrate in the form of the glass substrate panel 220. In some aspects, the glass substrate panel 220 can be used to form a plurality of antenna components, where the five antenna components 222 can correspond to the AOG 100 wafer.

[0053] Figure 3A is a top view of a 300 portion of a glass-based substrate (e.g., the glass substrate wafer 210 in Figure 2A or the glass substrate panel 220 in Figure 2B), according to aspects of the disclosure. Each antenna component (unlabeled) in the 300 portion defined by dashed contour lines may correspond to an antenna component formed on the glass-based substrate. In some aspects, an AOG wafer (e.g., AOG wafer 100) may be formed by performing a singularization process to separate the AOG wafer (e.g., including five contiguous antenna components) from the glass-based substrate.

[0054] Figure 3B is an enlarged top view of a portion 310 of the glass base substrate, which is part of portion 300 in Figure 3A, according to aspects of Petition 870250078524, dated 03 / 09 / 2025, p. 25 / 140 19 / 51 disclosure. In some respects, portion 310 shows an AOG wafer (e.g., AOG wafer 100) that is still part of the glass base substrate, with dashed lines 312, 314, and 316 defining three contours of the AOG wafer and dashed line 318 defining a contour between two antenna components (e.g., antenna components 101 and 103) of the AOG wafer. A plurality of metallized TGV hole structures 322 can be formed along contour line 312; a plurality of metallized TGV hole structures 324 can be formed along contour line 314; a plurality of metallized TGV hole structures 326 can be formed along contour line 316; and a plurality of metallized TGV hole structures 328 can be formed along contour line 318.

[0055] Figure 3C is an enlarged top view of a portion of an AOG wafer (e.g., AOG 100 wafer) separated from the glass base substrate, such as the glass substrate wafer or glass substrate panel shown in Figures 3A and 3B, according to aspects of the disclosure. In some aspects, to form the AOG 100 wafer, a singularization process can be performed on the glass base substrate shown in Figure 3B to cut along contour lines 312, 314, and 316 depicted in Figure 3B. In some respects, with the singularization process performed by cutting through the metallized TGV hole structures 322, 324 and 326 to separate the AOG 100 pellet from the glass base substrate, a remaining portion (remaining with the AOG pellet) of the metallized TGV hole structures 322, 324 and 326 become the recess structures. Petition 870250078524, dated 03 / 09 / 2025, page 26 / 140 20 / 51 metallized 152 of the lateral portion of the vitreous substrate of the AOG 100 pellet. In some respects, the metallized TGV hole structures 328 remain intact and become the metallized TGV hole structures 154.

[0056] As shown in Figures 3A to 3C, the plurality of metallized recess structures 152 of the AOG 100 wafer with conductive films 174 arranged therein may originally have a form similar to the metallized TGV hole structure 154 with conductive films 176 on the side walls when the AOG 100 wafer is still part of the glass base substrate. The metallized TGV hole structure on the edge (e.g., side portion) of the AOG 100 wafer (with the conductive film on the side walls) may become the metallized recess structures 152 (with the conductive film on the recess side walls) after the singularization process to separate the AOG 100 wafer from the rest of the glass base substrate.

[0057] In some respects, the conductive grounding structure may be formed based on a second conductive layer on a lower surface of the glass substrate (for example, the example shown in Figure 1B), or based on a first conductive layer on an upper surface of the glass substrate, or any combination thereof. Figure 4 is a simplified top view of an AOG 400 wafer showing another example configuration of connecting the conductive films 422 to the recessed side walls of the side portion of the AOG 400 wafer to a ground reference level, based on having a conductive grounding structure 430 on the surface. Petition 870250078524, dated 03 / 09 / 2025, p. 27 / 140 21 / 51 superior of the vitreous substrate 410 of the AOG 400 pellet, according to aspects of the disclosure.

[0058] As shown in Figure 4, the AOG 400 wafer may correspond to an example where the AOG wafer includes only a single antenna element. In Figure 4, several conductive structures on the upper surface of the glass substrate 410 are not depicted for clarity, except for the grounding conductive structure 430. In some respects, the AOG 400 wafer may be implemented based on the AOG structure illustrated by the example AOG 100 wafer, and the detailed description of various components may be simplified or omitted.

[0059] As shown in Figure 4, the pellet of AOG 400 may include a side portion in which a plurality of metallized recess structures are formed. The metallized recess structures include the respective conductive films 422 on the recess side walls. The AOG 400 wafer additionally includes TGV structures. 442, 444, 446, 448, 452 and 454 as a non-limiting example. In some respects, the structures of TGV 442, 444, 446, 448, 452 and 454 may be electrically coupled to one or more conductive structures on the upper surface (not shown) of the glass substrate 410 and may be configured to carry power sources or signals. In some respects, the TGV structures 452 and 454 may be configured to carry a ground reference level via one or more conductive terminals formed under the glass substrate.

[0060] In this example, the conductive grounding structure 430 formed on the upper surface of the glass substrate 410 may include a conductive ring structure 432 Petition 870250078524, dated 03 / 09 / 2025, page 28 / 140 22 / 51 electrically coupling the conductive films 422 of the metallized recess structures to each other. The grounding conductive structure 430 may additionally include a conductive structure 434 connecting the conductive ring structure 432 to the TGV structure 452; and a conductive structure 436 connecting the conductive ring structure 432 to the TGV structure 454.

[0061] In some respects, as another example and similar to that illustrated in Figures 1A to 1E, a conductive grounding structure can be formed under the glass substrate as a ground reference panel electrically connecting all the conductive films 422 of the metallized recess structures. In some respects, as yet another example, a conductive grounding structure can be formed under the glass substrate taking a form similar to the conductive grounding structure 430 electrically connecting all the conductive films 422 of the metallized recess structures based on a conductive ring structure.

[0062] Figures 5A to 5N illustrate simplified cross-sectional views of structures at various stages of manufacturing of one or more AOG inserts (e.g., with a structure based on the AOG 100 insert), according to aspects of the disclosure. Components illustrated in Figures 5A to 5N that are the same as or similar to those in Figures 1A to 1E are given the same reference numbers, and detailed descriptions of them may be omitted.

[0063] As shown in Figure 5A, a 500A structure can be provided, which may correspond to a glass-based substrate 510. In some respects, the Petition 870250078524, dated 03 / 09 / 2025, p. 29 / 140 23 / 51 glass base substrate 510 may correspond to glass substrate wafer 210 or glass substrate panel 220 illustrated in Figures 2A and 2B.

[0064] As shown in Figure 5B, a structure 500B can be formed based on the formation of a plurality of TGV holes 512 in the glass base substrate 510. In some aspects, the TGV holes 512 can take the form of hollow columns or cylinders between an upper surface 514 and a lower surface 516 of the glass base substrate 510. In some aspects, the TGV holes 512 can be formed based on mechanical drilling or laser drilling.

[0065] As shown in Figure 5C, a structure 500C can be formed based on structure 500B by forming a conductive seed film 522 (depicted as thick line segments) on the upper surface 514 and lower surface 516 of the glass base substrate 510 and on a side wall of each of the plurality of TGV holes 512. In some respects, the conductive seed film 522 can be made of a first conductive material which may include titanium, copper or a combination thereof. In some respects, the conductive seed film 522 can be formed based on a physical vapor disposition (PVD) process.

[0066] As shown in Figure 5D, a 500D structure can be formed based on the 500C structure with the formation of photoresistance patterns 524 on the upper surface 514 of the glass base substrate 510 and with the formation of photoresistance patterns 526 on the lower surface 516 of the glass base substrate 510. In some respects, the Petition 870250078524, dated 03 / 09 / 2025, page 30 / 140 Photoresistance patterns 524 and photoresistance patterns 526 can cover a portion of the conductive seed film 522 where an additional conductive film will not be formed. In some respects, photoresistance patterns 524 and photoresistance patterns 526 can cover the TGV holes (e.g., TGV holes 512a and 512b) corresponding to the contours of AOG wafers and / or the edges of the glass base substrate 510 corresponding to the contours of AOG wafers. Consequently, a first seed pattern can be defined based on a first portion of the conductive seed film 522 on the upper surface of the glass base substrate 510 (e.g., not covered or exposed by the conductive seed film 522).Furthermore, a second seed pattern can be defined based on a second portion of the conductive seed film 522 on the lower surface of the glass base substrate 510 (e.g., not covered or exposed by the conductive seed film 522).

[0067] As shown in Figure 5E, a 500E structure can be formed based on the 500D structure with the formation of an additional conductive film 532 in the first seed pattern, in the second seed pattern, and in a third portion of the conductive seed film on the side wall of the TGV holes 512c. In some aspects, the additional conductive film 532 can be formed by deposition or electroplating. In some aspects, the additional conductive film 532 can be made of a second material that includes copper. In some aspects, the TGV holes 512c together with the corresponding conductive seed film 522 and the film Petition 870250078524, dated 03 / 09 / 2025, page 31 / 140 25 / 51 additional conductive 532 formed on its side walls may correspond to the TGV 142 structures in Figure 1B.

[0068] In some respects, the first seed pattern and a first portion of the additional conductive film 532 in the first seed pattern may correspond to conductive structure 132 in Figure 1B. In some respects, conductive structure 132 may be configured as a patch antenna.

[0069] In some respects, the second seed pattern and a second portion of the additional conductive film 532 in the second seed pattern may correspond to conductive structures 122 and 124 in Figure 1B. In some respects, the third portion of the conductive seed film on the sidewalls of the TGV holes 512c may correspond to the first part 172a of the first conductive film 172 in Figure 1B, and a third portion of the additional conductive film in the third portion of the conductive seed film on the sidewall of the TGV holes 512c may correspond to the second part 172b of the first conductive film 172 in Figure 1B. Furthermore, a fourth portion of the conductive seed film on the side wall of each of the TGV holes 512a and 512b may correspond to the second conductive films 714 on the recess side walls of the plurality of metallized recess structures 152 in Figure 1B.

[0070] As shown in Figure 5F, a 500F structure can be formed based on the 500E structure by removing the 524 and 526 photoresistance patterns.

[0071] As shown in Figure 5G, a 500G structure can be formed based on the 500F structure with the formation of photoresistance patterns 534 on the upper surface 514 of the glass base substrate 510 and with the formation Petition 870250078524, dated 03 / 09 / 2025, page 32 / 140 26 / 51 of photoresistance patterns 536 on the lower surface 516 of the glass base substrate 510. In some respects, the photoresistance patterns 534 and photoresistance patterns 536 may cover the TGV holes (e.g., TGV holes 512a and 512b) corresponding to the contours of AOG wafers and / or the edges (e.g., edges 538) of the glass base substrate 510 corresponding to the contours of AOG wafers. In some respects, the portion of the seed conductive film 522, where the additional conductive film is not formed, will be exposed at this stage.

[0072] As shown in Figure 5H, a 500H structure can be formed based on the 500G structure by removing the exposed parts of the conductive seed film 522, using the photoresistance patterns 534 and photoresistance patterns 536 as masks. Although the additional conductive film 532 can be partially removed by removing the exposed parts of the conductive seed film 522, since the additional conductive film 532 is much thicker than the conductive seed film 522, the desired conductive structures based on the additional conductive film 532 can only be slightly removed without affecting the functionality of the desired conductive structures. That is, the additional conductive film 532, based on its thickness, can also function as a mask that resists the removal of the exposed parts of the conductive seed film 522.

[0073] As shown in Figure 5I, a 500I structure can be formed based on the 500H structure by removing the 534 and 536 photoresistance patterns.

[0074] As shown in Figure 5J, a 500J structure can be formed based on the 500I structure. Petition 870250078524, dated 03 / 09 / 2025, page 33 / 140 27 / 51 with filling the remaining portion of the TGV holes 512c, which may correspond to the space in the TGV structures formed based on the TGV holes 512c and surrounded by the first conductive films on the side walls of the TGV structures, with a dry film dielectric 542. In some respects, the dry film dielectric 542 may correspond to the dry film dielectric 173 in Figure 1B.

[0075] As shown in Figure 5K, a 500K structure can be formed based on the 500J structure by forming a first insulating layer 552 on the upper surface of the glass base substrate 510 and covering at least a portion of the first conductive structure on the upper surface. In some respects, the first insulating layer 552 may correspond to the first insulating layer 162 in Figure 1B.

[0076] As shown in Figure 5L, a 500L structure can be formed based on the 500K structure by forming a second insulating layer 554 on the lower surface of the glass base substrate 510 and covering at least a portion of the second conductive structure on the lower surface. In some respects, the second insulating layer 554 may correspond to the second insulating layer 164 in Figure 1B.

[0077] In some respects, the first insulating layer 552(162) or the second insulating layer 554(164) may include silicon dioxide, an organic polymeric dielectric, polyimide, polynorbornene, benzocyclobutene, polytetrafluoroethylene, a silicone-based polymeric dielectric or any combination thereof.

[0078] As shown in Figure 5M, a 500M structure can be formed based on the 500L structure with the formation of conductive terminal structures 562 and / or others. Petition 870250078524, dated 03 / 09 / 2025, page 34 / 140 28 / 51 conductive tracks or conductive pathways in order to electrically couple the conductive structures on the lower surface of the glass base substrate 510 through the respective opening of the second insulating layer 554. In some respects, each of the conductive terminal structures may correspond to a solder protrusion, a copper pillar protrusion, or a microsphere protrusion. In some respects, the conductive terminal structures 562 may correspond to the conductive terminal structures 182 or 184 in Figure 1B.

[0079] As shown in Figure 5N, a plurality of AOG 500Na, 500Nb, 500Nc wafers can be formed based on the 500M structure by performing a singularization process on the 500M structure. Each of the AOG 500Na, 500Nb, 500Nc wafers can correspond to the AOG 100 wafer and can include corresponding components as illustrated in Figures 1A to 1E. In some respects, the singularization process can be performed by cutting along the contours of several AOG wafers depicted as dashed lines 572 and 574 based on laser ablation cutting, saw blade cutting, or scoring and breaking. As illustrated in Figure 5N and in Figures 3B and 3C, after singularization, a portion of the conductive seed film 522 remains on the side walls of the split TGV holes 512a and 512b and on the edges 538. These remaining portions of the conductive seed film 522 can form the metallized recess structures (e.g., the metallized recess structures 152) configured to provide EMI shielding.

[0080] Figure 6 illustrates a method 600 for manufacturing an antenna apparatus (such as the AOG 100 chip) Petition 870250078524, dated 03 / 09 / 2025, page 35 / 140 29 / 51 in Figures 1A and 1B, the AOG 400 wafer in Figure 4 and / or the AOG 500Na, 500Nb and 500Nc wafers in Figure 5N), according to aspects of the disclosure. In some respects, Figures 5A to 5N may depict the structures at various stages of fabrication of an antenna apparatus (e.g., an AOG wafer) according to method 600.

[0081] In operation 610, a first conductive structure (e.g., conductive structure 132) can be formed on an upper surface of a glassy substrate (e.g., glassy substrate 110). In some aspects, the glassy substrate having an upper surface (e.g., upper surface 112), a lower surface (e.g., lower surface 114), and a lateral portion (e.g., lateral portion 116) encircling the glassy substrate and connecting the upper and lower surfaces. In some aspects, the lateral portion may include a plurality of metallized recess structures (e.g., metallized recess structures 152).In some respects, the plurality of metallized recess structures having recess side walls connecting the upper and lower surfaces and a plurality of second conductive films, respectively, on the recess side walls of the plurality of metallized recess structures. In some respects, each recess side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole.

[0082] In operation 620, a second conductive structure (e.g., conductive structure 122) can be formed on the lower surface of the glass substrate. In some Petition 870250078524, dated 03 / 09 / 2025, page 36 / 140 In aspects 30 / 51, a conductive grounding structure (e.g., conductive structure 124 and / or conductive grounding structure 430) is formed on the upper surface of the glass substrate, on the lower surface of the glass substrate, or in any combination thereof. In some aspects, the plurality of second conductive films is electrically coupled to the conductive grounding structure.

[0083] In operation 630, a TGV structure (e.g., TGV structure 142) can be formed, where the TGV structure can include a first conductive film (e.g., conductive film 172) on a side wall of a first TGV hole. In some aspects, the first TGV hole can be defined in the glass substrate and extending from the upper surface of the glass substrate to the lower surface of the glass substrate. In some aspects, the first conductive film can be configured to couple the first conductive structure to the second conductive structure.

[0084] In some respects, method 600 may include forming a plurality of TGV holes in a glass-based substrate corresponding to a glass substrate wafer or a glass substrate panel, the plurality of TGV holes including the first TGV hole and a plurality of second TGV holes, the glass substrate of the antenna apparatus being based on the glass-based substrate; forming a plurality of metallized TGV hole structures based on the plurality of second TGV holes; and performing a singularization process by cutting through the plurality of metallized TGV hole structures to separate the antenna apparatus from the glass-based substrate, a remaining portion of the plurality of Petition 870250078524, dated 03 / 09 / 2025, page 37 / 140 31 / 51 metallized TGV hole structures becoming the plurality of metallized recess structures of the lateral portion of the vitreous substrate of the antenna apparatus.

[0085] In some respects, method 600 may additionally include forming a conductive seed film on an upper surface of the glass-based substrate, on a lower surface of the glass-based substrate, and on a side wall of each of the plurality of TGV holes; defining a first seed pattern based on a first portion of the conductive seed film on the upper surface of the glass-based substrate; defining a second seed pattern based on a second portion of the conductive seed film on the lower surface of the glass-based substrate; and forming an additional conductive film on the first seed pattern, on the second seed pattern, and on a third portion of the conductive seed film on the side wall of the first TGV hole.

[0086] In some respects, the first seed pattern and a first portion of the additional conductive film in the first seed pattern correspond to the first conductive structure. In some respects, the second seed pattern and a second portion of the additional conductive film in the second seed pattern correspond to the second conductive structure. In some respects, the first conductive film includes a first part based on the third portion of the conductive seed film on the sidewall of the first TGV hole and a second part based on a third portion of the additional conductive film in the third portion of the conductive seed film on the sidewall of the first TGV hole. In some respects, a fourth portion of the conductive seed film in Petition 870250078524, dated 03 / 09 / 2025, page 38 / 140 32 / 51 The side wall of each of the plurality of TGV holes corresponds to the plurality of second conductive films, respectively, on the recessed side walls of the plurality of metallized recess structures.

[0087] In some aspects, the seed conductive film may be made of a first material comprising titanium, copper, or a combination thereof. In some aspects, the additional conductive film is made of a second material comprising copper. In some aspects, method 600 may additionally include the formation of a dry film dielectric filling a space in the TGV structure surrounded by the first conductive film.

[0088] In some aspects, method 600 may additionally include forming a first insulating layer on the upper surface covering at least a portion of the first conductive structure; and forming a second insulating layer on the lower surface covering at least a portion of the second conductive structure. In some aspects, the first insulating layer or the second insulating layer may include silicon dioxide, an organic polymeric dielectric, polyimide, polynorbornene, benzocyclobutene, polytetrafluoroethylene, a silicone-based polymeric dielectric, or any combination thereof.

[0089] In some aspects, method 600 may additionally include the formation of a metallization structure under the glass substrate, the metallization structure including at least the second insulating layer and the second conductive structure. In some aspects, the metallization structure may additionally include an electrically coupled conductive terminal structure. Petition 870250078524, dated 03 / 09 / 2025, p. 39 / 140 33 / 51 second conductive structure through an opening in the second insulating layer. In some respects, the conductive terminal structure corresponds to a solder protrusion, a copper pillar protrusion, or a microsphere protrusion.

[0090] A technical advantage of method 600 may correspond to the fabrication of an antenna apparatus (e.g., an AOG wafer) that includes a plurality of metallized recess structures formed on a lateral portion of the glass substrate of the apparatus. The process of forming the metallized recess structures can be integrated into the process of forming the TGV structures and thus may not significantly increase the complexity of the fabrication process. Meanwhile, the EMI shielding provided by the metallized recess structure can improve antenna performance (e.g., antenna gain, transfer rate, and / or bandwidth).

[0091] Figure 7 illustrates a mobile device 700, according to aspects of the disclosure. In some aspects, the mobile device 700 can be implemented with the inclusion of one or more antenna devices (e.g., AOG chips) as disclosed in the present invention.

[0092] In some respects, the mobile device 700 can be configured as a wireless communication device. As shown, the mobile device 700 includes the processor 701. The processor 701 can be communicatively coupled to the memory 732 by means of a link, which can be a chip-to-chip or a chip-to-chip link. The mobile device 700 also includes a display 728 and a display controller 726, with the display controller 726 coupled to the processor 701 and the display 728. The device Petition 870250078524, dated 03 / 09 / 2025, p. 40 / 140 34 / 51 mobile 700 may include input device 730 (e.g., physical or virtual keyboard), power supply 744 (e.g., battery), loudspeaker 736, microphone 738, and wireless antenna 742 (which may incorporate an antenna device (e.g., an AOG chip) according to various aspects described in this disclosure). In some aspects, the power supply 744 may directly or indirectly provide the supply voltage to operate some or all of the components of the mobile device 700.

[0093] In some respects, Figure 7 may include a 734 encoder / decoder (CODEC) (for example, an audio and / or voice CODEC) coupled to the processor. 701; loudspeaker 736 and microphone 738 coupled to CODEC 734; and wireless circuits 740 (which may include a modem, RF circuitry, filters, etc.) coupled to the wireless antenna 742 and processor 701. In some respects, one or more of the processor 701 (e.g., SoCs, application processor (AP)), the display controller 726, the memory 732, the CODEC 734, and wireless circuits 740 (e.g., baseband interface) including IC devices that are packaged as IC packages.

[0094] It should be noted that although Figure 7 depicts a mobile device 700, it is possible to use a similar architecture to implement an appliance including a set-top box, a music player, a video player, an entertainment unit, a navigation device, a personal digital assistant (PDA), a fixed location data unit, a computer, a laptop, a tablet, a communications device, a mobile phone or other similar devices. Petition 870250078524, dated 03 / 09 / 2025, page 41 / 140 35 / 51

[0095] Figure 8 illustrates various electrical devices that may incorporate an antenna apparatus as described in the present invention, according to aspects of the disclosure. For example, a mobile phone device 810, a laptop-type computer device 820, a fixed-location terminal device 830, a wearable device 840, or an electrical device on board a motor vehicle 850 may respectively include an antenna apparatus 812, 822, 832, 842, and 852 (for example, corresponding to an AOG chip based on the examples described above with reference to Figures 1 to 7). Devices 810, 820, The devices 830 and 840 and the vehicle 850 illustrated in Figure 8 are merely examples. Other apparatus or devices that may feature the antenna apparatus as described in the present invention may include, but are not limited to, a group of devices that includes mobile devices, handheld personal communication system (PCS) units, portable data units such as personal digital assistants, global positioning system (GPS) enabled devices, navigation devices, signal decoders, music players, video players, entertainment units, fixed location data units such as meter reading equipment, communication devices, smartphones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers,electrical devices implemented in motor vehicles (e.g., autonomous vehicles) or any, Petition 870250078524, dated 03 / 09 / 2025, page 42 / 140 36 / 51 other device that stores or retrieves computer data or instructions, or any combination thereof.

[0096] In the detailed description above, it can be noted that different attributes are grouped into examples. This disclosure method should not be understood as an intention for the example clauses to have more attributes than are explicitly mentioned in each clause. Instead, the various aspects of the disclosure may include fewer than the totality of the attributes of an individual disclosed example clause. Therefore, the following clauses should be considered incorporated into the description, where each clause by itself can serve as a separate example. Although each dependent clause may refer in the clauses to a specific combination with one of the other clauses, the aspect(s) of that dependent clause are not limited to the specific combination.It will be recognized that other example clauses may also include a combination of the aspect(s) of the dependent clause with the subject matter of any other dependent or independent clause, or a combination of any attribute with other dependent and independent clauses. The various aspects disclosed in the present invention expressly include such combinations, unless it is explicitly stated or can be easily inferred that a specific combination is not intended (for example, contradictory aspects, such as defining an element as an electrical insulator and an electrical conductor). Furthermore, it is also intended that aspects of one clause may be included in any other clause. Petition 870250078524, dated 03 / 09 / 2025, p. 43 / 140 37 / 51 independent, even if the clause is not directly dependent on the independent clause.

[0097] Implementation examples are described in the following numbered clauses:

[0098] Clause 1. An antenna apparatus comprising: a glass substrate having an upper surface, a lower surface and a lateral portion encircling the glass substrate and connecting the upper surface and the lower surface; a first conductive structure on the upper surface of the glass substrate; a second conductive structure on the lower surface of the glass substrate;and a through-glass (TGV) structure including a first conductive film on a side wall of a first TGV hole, the first TGV hole being defined in the glass substrate and extending from the upper surface of the glass substrate to the lower surface of the glass substrate, and the first conductive film being configured to couple the first conductive structure to the second conductive structure, wherein the side portion includes a plurality of metallized recess structures, the plurality of metallized recess structures having recess side walls connecting the upper surface and the lower surface and a plurality of second conductive films respectively on the recess side walls of the plurality of metallized recess structures, each recess side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole.

[0099] Clause 2. The antenna apparatus of clause 1, where a thickness of the first conductive film Petition 870250078524, dated 03 / 09 / 2025, p. 44 / 140 38 / 51 is greater than the thickness of a plurality of second conductive films.

[0100] Clause 3. The antenna apparatus of any of clauses 1 to 2, which additionally comprises: a conductive grounding structure on the upper surface of the glass substrate, on the lower surface of the glass substrate or any combination thereof, wherein the plurality of second conductive films is electrically coupled to the conductive grounding structure.

[0101] Clause 4. The antenna apparatus of any of clauses 1 to 3, wherein: the plurality of second conductive films is made of a first material, the first conductive film comprises a first part and a second part, the first part being between the side wall of the first TGV hole and the second part, the first part is made of the first material and the second part is made of a second material.

[0102] Clause 5. The antenna apparatus of clause 4, wherein: the first material comprises titanium, copper or a combination thereof, and the second material comprises copper.

[0103] Clause 6. The antenna apparatus of any of clauses 4 to 5, wherein the first conductive structure or the second conductive structure comprises at least one third part made of the first material and one fourth part made of the second material.

[0104] Clause 7. The antenna apparatus of any of clauses 1 to 6 additionally comprising: a first insulating layer disposed on the upper surface and covering at least a portion of the first Petition 870250078524, dated 03 / 09 / 2025, p. 45 / 140 39 / 51 conductive structure; and a second insulating layer arranged on the lower surface and covering at least a portion of the second conductive structure.

[0105] Clause 8. The antenna apparatus of clause 7, wherein the first insulating layer or the second insulating layer comprises silicon dioxide, an organic polymeric dielectric, polyimide, polynorbornene, benzocyclobutene, polytetrafluoroethylene, a silicone-based polymeric dielectric or any combination thereof.

[0106] Clause 9. The antenna apparatus of either of clauses 7 and 8, which further comprises: a metallization structure under the glass substrate, the metallization structure including at least the second insulating layer and the second conductive structure, wherein the metallization structure further includes a conductive terminal structure electrically coupled to the second conductive structure through an opening in the second insulating layer.

[0107] Clause 10. The antenna apparatus of clause 9, in which the conductive terminal structure corresponds to a solder protrusion, a copper pillar protrusion or a microsphere protrusion.

[0108] Clause 11. The antenna apparatus of any of clauses 1 to 10, which additionally comprises a dry film dielectric filling a space in the TGV structure surrounded by the first conductive film.

[0109] Clause 12. The antenna apparatus of any of clauses 1 to 11, wherein the first conductive structure is configured as a patch antenna. Petition 870250078524, dated 03 / 09 / 2025, p. 46 / 140 40 / 51

[0110] Clause 13. A method for manufacturing an antenna apparatus comprising: forming a first conductive structure on an upper surface of a glass substrate, the glass substrate having an upper surface, a lower surface and a lateral portion encircling the glass substrate and connecting the upper surface and the lower surface; forming a second conductive structure on the lower surface of the glass substrate;and forming a through-glass (TGV) structure including a first conductive film on a side wall of a first TGV hole, the first TGV hole being defined in the glass substrate and extending from the upper surface of the glass substrate to the lower surface of the glass substrate, and the first conductive film being configured to couple the first conductive structure to the second conductive structure, wherein the side portion includes a plurality of metallized recess structures, the plurality of metallized recess structures having recess side walls connecting the upper surface and the lower surface and a plurality of second conductive films respectively on the recess side walls of the plurality of metallized recess structures, each recess side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole.

[0111] Clause 14. The method of clause 13, which further comprises: forming a conductive grounding structure on the upper surface of the glass substrate, on the lower surface of the glass substrate or any combination thereof. Petition 870250078524, dated 03 / 09 / 2025, page 47 / 140 41 / 51 of the same, in which the plurality of second conductive films is electrically coupled to the conductive grounding structure.

[0112] Clause 15. The method of any of clauses 13 to 14, which further comprises: forming a plurality of TGV holes in a glass-based substrate corresponding to a glass substrate wafer or a glass substrate panel, the plurality of TGV holes including the first TGV hole and a plurality of second TGV holes, the glass substrate of the antenna apparatus being based on the glass-based substrate; forming a plurality of metallized TGV hole structures based on the plurality of second TGV holes; and performing a singularization process by cutting through the plurality of metallized TGV hole structures to separate the antenna apparatus from the glass-based substrate, a remaining portion of the plurality of metallized TGV hole structures becoming the plurality of metallized recess structures of the lateral portion of the glass substrate of the antenna apparatus.

[0113] Clause 16. The method of clause 15, which further comprises: forming a conductive seed film on an upper surface of the glass-based substrate, on a lower surface of the glass-based substrate, and on a side wall of each of the plurality of TGV holes; defining a first seed pattern based on a first portion of the conductive seed film on the upper surface of the glass-based substrate; defining a second seed pattern based on a second portion of the conductive seed film on the lower surface of the glass-based substrate; and forming a conductive film Petition 870250078524, dated 03 / 09 / 2025, page 48 / 140 42 / 51 additional in the first seed pattern, in the second seed pattern and in a third portion of the conductive seed film on the sidewall of the first TGV hole, wherein: the first seed pattern and a first portion of the additional conductive film in the first seed pattern correspond to the first conductive structure, the second seed pattern and a second portion of the additional conductive film in the second seed pattern correspond to the second conductive structure, the first conductive film includes a first part based on the third portion of the conductive seed film on the sidewall of the first TGV hole and a second part based on a third portion of the additional conductive film in the third portion of the conductive seed film on the sidewall of the first TGV hole and a fourth portion of the conductive seed film on the sidewall of each of the plurality of TGV holes corresponds to the plurality of second conductive films,respectively, on the recessed side walls of the plurality of metalized recessed structures.

[0114] Clause 17. The method of clause 16, wherein: the conductive seed film is made of a first material comprising titanium, copper or a combination thereof, and the additional conductive film is made of a second material comprising copper.

[0115] Clause 18. The method of any of clauses 13 to 17, which further comprises: forming a first insulating layer on the upper surface and covering at least a portion of the first conductive structure; and forming a second insulating layer on the lower surface and covering at least a portion of the second conductive structure. Petition 870250078524, dated 03 / 09 / 2025, p. 49 / 140 43 / 51

[0116] Clause 19. The method of clause 18, wherein the first insulating layer or the second insulating layer comprises silicon dioxide, an organic polymeric dielectric, polyimide, polynorbornene, benzocyclobutene, polytetrafluoroethylene, a silicone-based polymeric dielectric or any combination thereof.

[0117] Clause 20. The method of any of clauses 18 to 19, which further comprises: forming a metallization structure under the glass substrate, the metallization structure including at least the second insulating layer and the second conductive structure, wherein the metallization structure further includes a conductive terminal structure electrically coupled to the second conductive structure through an opening in the second insulating layer.

[0118] Clause 21. The method of clause 20, wherein the conductive terminal structure corresponds to a solder protrusion, a copper pillar protrusion or a microsphere protrusion.

[0119] Clause 22. The method of any of clauses 13 to 21, which further comprises the formation of a dry film dielectric filling a space in the TGV structure surrounded by the first conductive film.

[0120] Clause 23. The method of any of clauses 13 to 22, wherein the first conductive structure is configured as a patch antenna.

[0121] Clause 24. An electrical device comprising: one or more processors; and an antenna apparatus coupled to the one or more processors, wherein the antenna apparatus comprises: a glass substrate having an upper surface, a lower surface and a lateral portion. Petition 870250078524, dated 03 / 09 / 2025, p. 50 / 140 44 / 51 surrounding the vitreous substrate and connecting the upper and lower surfaces; a first conductive structure on the upper surface of the vitreous substrate; a second conductive structure on the lower surface of the vitreous substrate;and a through-glass (TGV) structure including a first conductive film on a side wall of a first TGV hole, the first TGV hole being defined in the glass substrate and extending from the upper surface of the glass substrate to the lower surface of the glass substrate, and the first conductive film being configured to couple the first conductive structure to the second conductive structure, wherein the side portion includes a plurality of metallized recess structures, the plurality of metallized recess structures having recess side walls connecting the upper surface and the lower surface and a plurality of second conductive films respectively on the recess side walls of the plurality of metallized recess structures, each recess side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole.

[0122] Clause 25. The electrical device of clause 24, in which the thickness of the first conductive film is greater than the thickness of the plurality of second conductive films.

[0123] Clause 26. The electrical device of any of clauses 24 and 25, wherein the antenna apparatus additionally comprises: a conductive grounding structure on the upper surface of the glass substrate, on the lower surface of the glass substrate or any combination thereof. Petition 870250078524, dated 03 / 09 / 2025, p. 51 / 140 45 / 51 of them, in which the plurality of second conductive films is electrically coupled to the conductive grounding structure.

[0124] Clause 27. The electrical device of any of clauses 24 to 26, wherein: the plurality of second conductive films is made of a first material, the first conductive film comprises a first part and a second part, the first part being between the side wall of the first TGV hole and the second part, the first part is made of the first material and the second part is made of a second material.

[0125] Clause 28. The electrical device of clause 27, wherein: the first material comprises titanium, copper or a combination thereof, and the second material comprises copper.

[0126] Clause 29. The electrical device of any of clauses 27 to 28, wherein the first conductive structure or the second conductive structure comprises at least a first part made of the first material and a second part made of the second material.

[0127] Clause 30. The electrical device of any of clauses 24 to 29, wherein the antenna apparatus additionally comprises: a first insulating layer disposed on the upper surface and covering at least a portion of the first conductive structure; and a second insulating layer disposed on the lower surface and covering at least a portion of the second conductive structure.

[0128] Clause 31. The electrical device of clause 30, wherein the first insulating layer or the second insulating layer comprises silicon dioxide, an organic polymeric dielectric, polyimide, polynorbornene, Petition 870250078524, dated 03 / 09 / 2025, p. 52 / 140 46 / 51 benzocyclobutene, polytetrafluoroethylene, a silicone-based polymeric dielectric, or any combination thereof.

[0129] Clause 32. The electrical device of any of clauses 30 to 31, wherein the antenna apparatus further comprises: a metallization structure under the glass substrate, the metallization structure including at least the second insulating layer and the second conductive structure, wherein the metallization structure further includes a conductive terminal structure electrically coupled to the second conductive structure through an opening in the second insulating layer.

[0130] Clause 33. The electrical device of clause 32, in which the conductive terminal structure corresponds to a solder protrusion, a copper pillar protrusion or a microsphere protrusion.

[0131] Clause 34. The electrical device of any of clauses 24 to 33, wherein the antenna apparatus additionally comprises a dry film dielectric filling a space in the TGV structure surrounded by the first conductive film.

[0132] Clause 35. The electrical device of any of clauses 24 to 34, in which the first conductive structure is configured as a patch antenna.

[0133] Clause 36. The electrical device of any of clauses 24 to 35, wherein the electrical device comprises at least one of: a music player, a video player, an entertainment unit; a navigation device, a communications device, a mobile device, a mobile phone, a Petition 870250078524, dated 03 / 09 / 2025, page 53 / 140 47 / 51 smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, or a device in a motor vehicle.

[0134] Those skilled in the art will recognize that information and signals can be represented using any of several different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the description above can be represented by voltages, currents, electromagnetic waves, magnetic particles or fields, optical particles or fields, or any combination thereof.

[0135] Additionally, those skilled in the art will recognize that the various illustrative logic blocks, modules, circuits, and algorithm steps described in connection with the aspects disclosed in the present invention can be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above in terms of their functionality. The possibility of such functionality being implemented as hardware or software depends on the particular application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in various ways for each particular application, but such implementation decisions Petition 870250078524, dated 03 / 09 / 2025, page 54 / 140 48 / 51 should not be interpreted as causing a deviation from the scope of this disclosure.

[0136] The various illustrative logic blocks, modules, and circuits described in connection with the aspects disclosed in the present invention may be implemented or realized with a general-purpose processor, a DSP, an ASIC, an FPGA or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described in the present invention. A general-purpose processor may be a microprocessor, but alternatively, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, for example, a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other similar configuration.

[0137] The methods, sequences and / or algorithms described in connection with the aspects disclosed in the present invention may be directly incorporated into hardware, in a software module executed by a processor, or in a combination of both. A software module may reside in random access memory (RAM), flash memory, read-only memory (ROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), registers, hard disk, a disk Petition 870250078524, dated 03 / 09 / 2025, page 55 / 140 49 / 51 removable, a CD-ROM, or any other form of storage medium known in the art. An example storage medium is coupled to the processor so that the processor can read information from, and write information to, the storage medium. Alternatively, the storage medium may be an integral part of the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal (e.g., UE). Alternatively, the processor and the storage medium may reside as distinct components in a user terminal.

[0138] In one or more example aspects, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored or transmitted in the form of one or more instructions or code on a computer-readable medium. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. A storage medium may be any available medium that can be accessed by a computer.By way of example, and not limitation, such computer-readable media may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and that can be accessed by a computer. Furthermore, any connection is properly termed a readable medium. Petition 870250078524, dated 03 / 09 / 2025, page 56 / 140 50 / 51 per computer. For example, if the software is transmitted from a website, a server, or another remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless communication technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless communication technologies such as infrared, radio, and microwave are included in the definition of media. As used in the present invention, disks (disk and disc) include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk, and Blu-ray disc, where disks generally reproduce data magnetically, while discs reproduce data optically by means of lasers. Combinations of the above items should also be included in the scope of computer-readable media.

[0139] Although the aforementioned disclosure shows illustrative aspects of the disclosure, it should be noted that various changes and modifications can be made to the present invention without departing from the scope of the disclosure as defined by the appended claims. For example, the functions, steps, and / or actions of the method claims according to the disclosure aspects described in the present invention need not be performed in any particular order. Additionally, no component, function, action, or instruction described or claimed in the present invention should be interpreted as critical or essential except when explicitly described as such. Furthermore, as used in the present invention, the Petition 870250078524, dated 03 / 09 / 2025, page 57 / 140 51 / 51 The terms set, group and the like are intended to include one or more of the indicated elements. Furthermore, as used in the present invention, the terms has, have, having, comprises, includes, including and the like do not preclude the presence of one or more additional elements (for example, an element having A may also have B). Additionally, the phrase based on is intended to mean based, at least in part, on, except where specifically indicated otherwise. Moreover, as used in the present invention, the term or is intended to be inclusive when used in a series and may be used interchangeably with and / or, unless explicitly stated otherwise (for example, if used in combination with one or the other or only one of) or the alternatives are mutually exclusive (for example, one or more should not be interpreted as one and more).Furthermore, although the components, functions, actions, and instructions may be described or claimed in the singular, the plural form is contemplated unless a limitation to the singular is explicitly stated. Consequently, as used in the present invention, the articles "a," "an," "the" are intended to include one or more of the indicated elements. Additionally, as used in the present invention, the terms "at least one" and "one or more" encompass one component, function, action, or instruction that performs or is capable of performing a described or claimed functionality, and also two or more components, functions, actions, or instructions that perform or are capable of performing a described or claimed functionality in combination. Petition 870250078524, dated 03 / 09 / 2025, p. 58 / 140

Claims

1 / 9 CLAIMS 1. Antenna apparatus characterized by comprising: a glass substrate having an upper surface, a lower surface and a lateral portion encircling the glass substrate and connecting the upper surface and the lower surface; a first conductive structure on the upper surface of the glass substrate; a second conductive structure on the lower surface of the glass substrate; and a through-glass (TGV) structure including a first conductive film on a lateral wall of a first TGV hole, the first TGV hole being defined in the glass substrate and extending from the upper surface of the glass substrate to the lower surface of the glass substrate and the first conductive film being configured to couple the first conductive structure to the second conductive structure, wherein the lateral portion includes a plurality of metallized recess structures,a plurality of metallized recess structures having recess side walls connecting the upper and lower surfaces and a plurality of second conductive films respectively on the recess side walls of the plurality of metallized recess structures, each recess side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole. Petition 870250078524, dated 03 / 09 / 2025, p. 111 / 140 2 / 9, 2. Antenna apparatus, according to claim 1, characterized in that the thickness of the first conductive film is greater than the thickness of a plurality of second conductive films.

3. Antenna apparatus, according to claim 1, characterized by further comprising: a conductive grounding structure on the upper surface of the glass substrate, on the lower surface of the glass substrate or any combination thereof, wherein the plurality of second conductive films is electrically coupled to the conductive grounding structure.

4. Antenna apparatus, according to claim 1, characterized in that: the plurality of second conductive films being made of a first material, the first conductive film comprising a first part and a second part, the first part being between the side wall of the first TGV hole and the second part, the first part being made of the first material and the second part being made of a second material.

5. Antenna apparatus according to claim 4, characterized in that: the first material comprises titanium, copper or a combination thereof and the second material comprises copper.

6. Antenna apparatus, according to claim 4, characterized in that the first conductive structure or the second conductive structure comprises at least a third part made of the first material and a fourth part made of the second material.

7. Antenna apparatus, according to claim 1, characterized by further comprising: a first insulating layer disposed on the upper surface and covering at least a portion of the first conductive structure; and a second insulating layer disposed on the lower surface and covering at least a portion of the second conductive structure.

8. Antenna apparatus, according to claim 7, characterized in that the first insulating layer or the second insulating layer comprises silicon dioxide, an organic polymeric dielectric, polyimide, polynorbornene, benzocyclobutene, polytetrafluoroethylene, a silicone-based polymeric dielectric or any combination thereof.

9. Antenna apparatus, according to claim 7, characterized by further comprising: a metallization structure under the glass substrate, the metallization structure including at least a second insulating layer and a second conductive structure, wherein the metallization structure further includes a conductive terminal structure electrically coupled to the second conductive structure through an opening in the second insulating layer.

10. Antenna apparatus, according to claim 9, characterized in that the conductive terminal structure corresponds to a solder protrusion, a copper pillar protrusion or a microsphere protrusion. Petition 870250078524, dated 03 / 09 / 2025, pp. 113 / 140 4 / 9 11. Antenna apparatus, according to claim 1, characterized by further comprising a dry film dielectric filling a space in the TGV structure surrounded by the first conductive film.

12. Antenna apparatus, according to claim 1, characterized in that the first conductive structure is configured as a patch antenna.

13. Method for manufacturing an antenna apparatus characterized by comprising: forming a first conductive structure on an upper surface of a glass substrate, the glass substrate having an upper surface, a lower surface and a lateral portion encircling the glass substrate and connecting the upper surface and the lower surface; forming a second conductive structure on the lower surface of the glass substrate; and forming a through-glass (TGV) structure including a first conductive film on a lateral wall of a first TGV hole, the first TGV hole being defined in the glass substrate and extending from the upper surface of the glass substrate to the lower surface of the glass substrate and the first conductive film being configured to couple the first conductive structure to the second conductive structure, wherein the lateral portion includes a plurality of metallized recess structures,a plurality of metallized recess structures having recessed side walls connecting the upper and lower surfaces and a plurality of second conductive films respectively on the recessed side walls of the plurality of metallized recess structures, each recessed side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole.

14. Method according to claim 13, characterized by further comprising: forming a conductive grounding structure on the upper surface of the glass substrate, on the lower surface of the glass substrate or any combination thereof, wherein the plurality of second conductive films is electrically coupled to the conductive grounding structure.

15. Method according to claim 13, characterized by further comprising: forming a plurality of TGV holes in a glass-based substrate corresponding to a glass substrate wafer or a glass substrate panel, the plurality of TGV holes including the first TGV hole and a plurality of second TGV holes, the glass substrate of the antenna apparatus being based on the glass-based substrate; forming a plurality of metallized TGV hole structures based on the plurality of second TGV holes; and performing a singularization process by cutting through the plurality of metallized TGV hole structures to separate the antenna apparatus from the glass-based substrate, a remaining portion of the plurality of Petition 870250078524, dated 03 / 09 / 2025, p.115 / 140 6 / 9 metallized TGV hole structures becoming the plurality of metallized recess structures of the lateral portion of the vitreous substrate of the antenna apparatus.

16. Method according to claim 15, characterized by further comprising: forming a conductive seed film on an upper surface of the glass base substrate, on a lower surface of the glass base substrate, and on a side wall of each of the plurality of TGV holes; defining a first seed pattern based on a first portion of the conductive seed film on the upper surface of the glass base substrate; defining a second seed pattern based on a second portion of the conductive seed film on the lower surface of the glass base substrate; and forming an additional conductive film on the first seed pattern, on the second seed pattern, and on a third portion of the conductive seed film on the side wall of the first TGV hole, wherein: the first seed pattern and a first portion of the additional conductive film on the first seed pattern correspond to the first conductive structure,The second seed pattern and a second portion of the additional conductive film in the second seed pattern correspond to the second conductive structure. The first conductive film includes a first part based on the third portion of the conductive seed film on the sidewall of the first TGV hole and a second part based on a third portion of the additional conductive film in the third portion of the conductive seed film on the sidewall of the first TGV hole, and a fourth portion of the conductive seed film on the sidewall of each of the plurality of TGV holes corresponds to the plurality of second conductive films, respectively, on the re-entrant sidewalls of the plurality of metallized re-entrant structures.

17. Electrical device characterized by comprising: one or more processors; and an antenna apparatus coupled to the one or more processors, wherein the antenna apparatus comprises: a glass substrate having an upper surface, a lower surface and a lateral portion encircling the glass substrate and connecting the upper surface and the lower surface; a first conductive structure on the upper surface of the glass substrate; a second conductive structure on the lower surface of the glass substrate; and a through-glass (TGV) structure including a first conductive film on a lateral wall of a first TGV hole, the first TGV hole being defined in the glass substrate and extending from the upper surface of the glass substrate to the lower surface of the glass substrate and Petition 870250078524, dated 03 / 09 / 2025, page.117 / 140 8 / 9 the first conductive film being configured to couple the first conductive structure to the second conductive structure, wherein the lateral portion includes a plurality of metallized recess structures, the plurality of metallized recess structures having recess side walls connecting the upper surface and the lower surface and a plurality of second conductive films respectively on the recess side walls of the plurality of metallized recess structures, each recess side wall of the plurality of metallized recess structures having a shape corresponding to a partial TGV hole.

18. Electrical device, according to claim 17, characterized in that the thickness of the first conductive film is greater than the thickness of a plurality of second conductive films.

19. Electrical device, according to claim 17, characterized in that the antenna apparatus further comprises: a conductive grounding structure on the upper surface of the glass substrate, on the lower surface of the glass substrate or any combination thereof, wherein the plurality of second conductive films is electrically coupled to the conductive grounding structure.

20. Electrical device, according to claim 17, characterized by comprising at least one of: a music player, a video player, an entertainment unit; a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device or a device in a motor vehicle.

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