Optical module and optical communication system

Description

1 / 26 OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM TECHNICAL FIELD

[0001] This application relates to the field of communication technologies and, in particular, to an optical module and an optical communication system. BACKGROUND

[0002] An optical module is one of the most essential components in the field of optical networking technologies, and its function is to convert an optical signal into an electrical signal, and vice versa, within the module. In recent years, as the performance of an optical module becomes increasingly powerful, the power consumption of the optical module becomes increasingly high. As a result, heat dissipation from the optical module becomes increasingly difficult, and there is a huge heat dissipation challenge.

[0003] Currently, heat dissipation from the optical module is implemented by providing a heat sink outside the optical module. In this heat dissipation method, due to incomplete contact between the surfaces of the optical module and the heat sink, heat can only be transferred by dry contact, resulting in a relatively large thermal contact resistance and leading to low heat dissipation efficiency of the optical module. SUMMARY

[0004] The embodiments of this application provide an optical module and an optical communication system to solve a technical problem of low heat dissipation efficiency of an optical module.

[0005] To achieve the previous objective, the following technical solutions are used in the modalities of this application.

[0006] According to a first aspect, an optical module is provided. The optical module includes a housing body and a housing cover that are arranged opposite each other, a first device and a second device. The body of Petition 870250094663, dated 10 / 16 / 2025, page 8 / 44 2 / 26 The housing includes a first surface close to the housing cover, and an accommodation groove extending in a direction away from the housing cover is provided on the first surface. The first device and the second device are arranged in the accommodation groove. A first cavity and a second cavity are formed in the housing cover, a working medium is provided in the first cavity and the second cavity, and the first cavity and the second cavity are arranged in a direction parallel to the housing cover. The first device and the first cavity are arranged opposite each other, and the second device and the second cavity are arranged opposite each other.

[0007] Based on the preceding description of the optical module structure provided in this embodiment of this application, it can be learned that the optical module includes the first device, the second device, and the housing cover configured to dissipate heat from the first device and the second device. The housing cover includes a first cavity and a second cavity. A working medium in the first cavity is used to dissipate heat from the first device, and a working medium in the second cavity is used to remove heat from the second device. For example, heat from the first device is transferred by means of heat transfer to a surface of the housing cover near the first device.Since the first device and the first cavity are arranged in opposite positions to each other, heat enters the first cavity through the surface; the working medium in the first cavity transfers the heat to a cavity surface of the first cavity facing away from the first device; and then the heat is transferred to the exterior of the optical module through the housing cover surface facing away from the first device. Similarly, heat from the second device is transferred through... Petition 870250094663, dated 10 / 16 / 2025, page 9 / 44 3 / 26 Heat transfer to a housing cover surface near the second device. Since the second device and the second cavity are arranged in opposite positions to each other, heat enters the second cavity through the surface, the working medium in the second cavity transfers the heat to a cavity surface of the second cavity facing away from the second device, and then the heat is transferred to the outside of the optical module through the housing cover surface facing away from the second device. Compared with a method of arranging only a heat sink outside an optical module, the optical module provided in this embodiment of this application uses the housing cover structure to implement separate heat dissipation of the first and second devices, thus increasing the ways of heat dissipation and effectively improving the heat dissipation efficiency of the optical module.Furthermore, the housing cover provided in this embodiment of this application, as a structural part of the optical module, can also achieve a heat dissipation effect, allowing for the efficient use of the structural part.

[0008] Furthermore, in this embodiment of this application, the supply of the first cavity and the second cavity allows a reduction in power density (power consumption per unit area) on the surface of the housing cover, thus improving the heat dissipation efficiency of the optical module.

[0009] In a feasible implementation of the first aspect, the housing cover includes a first cover plate and a second cover plate that are arranged opposite each other, and the first cover plate is arranged on one side of the second cover plate that is away from the first device. The second cover plate includes a second surface adjacent to the first cover plate, and a first Petition 870250094663, dated 10 / 16 / 2025, page 10 / 44 A 4 / 26 groove, which is recessed in a direction away from the first cover plate, is provided on the second surface. The first cover plate and the second cover plate are connected in a sealed manner, so that the first groove of the second cover plate and the first cover plate jointly enclose the first cavity.

[0010] In a feasible implementation of the first aspect, the housing cover further includes a first capillary layer, and the first capillary layer is provided on a surface of the first groove.

[0011] Providing the first capillary layer allows the working medium to circulate in the cavity, so that a better heat dissipation effect can be achieved.

[0012] In a feasible implementation of the first aspect, the housing cover further includes a second capillary layer and a third capillary layer. The first cover plate includes a third surface that is adjacent to the second cover plate and opposite the second surface, and the second capillary layer is formed on the third surface. The third capillary layer is formed on the second surface of the second cover plate.

[0013] The provision of the second capillary layer and the third capillary layer allows the circulation of the working medium in the housing cover, so that a better heat dissipation effect can be achieved.

[0014] In a feasible implementation of the first aspect, a support pillar is provided in the first groove, and the support pillar extends from a lower surface of the first groove to the first cover plate.

[0015] In a feasible implementation of the first aspect, the housing cover also includes a fourth capillary layer, and the fourth capillary layer is formed on a lateral surface of the support pillar. Petition 870250094663, dated 10 / 16 / 2025, page 11 / 44 5 / 26

[0016] The provision of the fourth capillary layer allows the working medium to circulate in the cavity, so that a better heat dissipation effect can be achieved.

[0017] In a feasible implementation of the first aspect, the housing cover also includes a thermal insulation structure provided between the first cavity and the second cavity. The thermal insulation structure is configured to block heat exchange between the first cavity and the second cavity.

[0018] Heat exchange between the first cavity and the second cavity is blocked by the provision of the thermal insulation structure. The heat from the electrical chip does not cause thermal heating in the optical devices, which helps protect the devices and improve the performance of the optical module.

[0019] In a feasible implementation of the first aspect, the thermal insulation structure includes a thermal insulation hole or a thermal insulation member made of a thermal insulation device.

[0020] In a feasible implementation of the first aspect, the thermal insulation hole goes through the housing cover.

[0021] The provision of the thermal insulation hole that passes through the housing cover causes the first cavity and the second cavity not to communicate with each other, which helps to block heat exchange between the first cavity and the second cavity, thus protecting the devices and improving the performance of the optical module.

[0022] In a feasible implementation of the first aspect, the optical module further includes a circuit board. The circuit board is disposed at the bottom of the accommodation groove. Both the first device and the second device are disposed on the circuit board, and the first device and the second device are located on the same side of the board. Petition 870250094663, dated 10 / 16 / 2025, page 12 / 44 6 / 26 circuit.

[0023] In a feasible implementation of the first aspect, the optical module also includes a thermally conductive layer. The thermally conductive layer is disposed between the first device and the housing cover; and / or the thermally conductive layer is disposed between the second device and the housing cover.

[0024] Providing a thermally conductive layer allows for better heat transfer to the housing cover.

[0025] In a feasible implementation of the first aspect, a cross-section of the support pillar gradually decreases from the lower surface of the first groove to the first cover plate.

[0026] This helps to increase the contact area with the work medium, thereby improving the efficiency of heat dissipation.

[0027] According to a second aspect, an optical communication system is provided. The optical communication system includes the optical module provided in the first aspect.

[0028] In the optical communication system, the optical module provided in the first aspect is arranged. The optical module has good heat dissipation performance and can meet the requirements of various high power consumption scenarios of the optical communication system. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG. 1 is a diagram of a structure of an optical communication system according to an embodiment of this application; FIG. 2 is a diagram of the structure of an optical module and a heat sink according to one embodiment of this application; FIG. 3 is a diagram of the structure of an optical module and a heat sink according to one embodiment of this application; FIG. 4 is a dry contact diagram; FIG. 5 is a diagram of the structure of an optical module. Petition 870250094663, dated 10 / 16 / 2025, p. 13 / 44 7 / 26 in accordance with one of the terms of this request; FIG. 6 is a diagram of a housing body structure for an optical module according to one embodiment of this application; FIG. 7 is a diagram of a housing structure for an optical module according to one embodiment of this application; FIG. 8 is an exploded diagram of the optical module housing cover shown in FIG. 7; FIG. 9 is a schematic cross-sectional view, along AA, of the housing cover of the optical module shown in FIG. 7; FIG. 10 is a diagram of a housing structure for an optical module according to one embodiment of this application; FIG. 11 is a diagram of a housing structure for an optical module according to one embodiment of this application; FIG. 12 is an exploded diagram of the optical module housing cover shown in FIG. 11; FIG. 13 is a schematic cross-sectional view, along BB, of the housing cover of the optical module shown in FIG. 11; FIG. 14 is a diagram of the structure of an optical module according to an embodiment of this application; and FIG. 15 is a diagram of the structure of an optical module according to an embodiment of this application.

[0030] Reference numbers: 1: optical communication system, 100: optical switch, 111: light-emitting component, 112: modulator, 113: photoelectric detector, 120: Fiber array unit, 121: Output fiber, Petition 870250094663, dated 10 / 16 / 2025, page 14 / 44 8 / 26 122: Fiber inlet, 130: converter, 131: optical digital signal processing module, 132: controller module, 133: photoelectric detector, 200: optical module, 200a: interface, 200a1: first port, 200a2: second port, 210: housing body, 210a: accommodation groove, 210b: fixing pillar, 211: first surface, 220: housing cover, 221: first cavity, 222: second cavity, 223: support pillar, 224: first capillary layer, 225: third capillary layer, 226: second capillary layer, 227: fourth capillary layer, 228: thermal insulation structure, 220a: first cover plate, 220a1: third surface, 220b: second cover plate, 220b0: bottom surface, 220b1: first groove, 220b2: second groove, 220b3: second surface, 220b4: surface, 220c: mounting hole, 230: circuit board, 240: first device, 250: second device, 260: thermally conductive layer, 270: fastener, 280: solder ball, 300: sliding rail, 400: heat sink, 500: support. DESCRIPTION OF THE MODALITIES

[0031] The following describes the technical solutions in the embodiments of this application with reference to the drawings attached in the embodiments of this application. In the descriptions of this application, unless otherwise specified, / indicates that the associated objects are in an OR relationship. For example, A / B may represent A or B. In this application, / and / or describes only one Petition 870250094663, dated 10 / 16 / 2025, p. 15 / 44 9 / 26 Association relationship between associated objects and represents that three relationships can exist. For example, A and / or B can indicate: Only A exists, both A and B exist, and only B exists, where A and B can be singular or plural. Furthermore, in the descriptions of this application, a plurality of means two or more of two, unless otherwise specified. At least one of the following items (pieces) or a similar expression refers to any combination of these items, including any combination of singular items (pieces) or plural items (pieces). For example, at least one item (piece) of a, b, or c can indicate: a, b, c, aeb, aec, bec, or a, bec, where a, b, ec can be singular or plural.Furthermore, to clearly describe the technical solutions in the embodiments of this application, terms such as first and second are used in the embodiments of this application to distinguish between the same or similar items that provide essentially the same functions or purposes. Persons skilled in the art can understand that terms such as first and second do not limit a quantity or sequence of execution, and terms such as first and second do not indicate a definite difference. Additionally, in some embodiments of this application, terms such as example or for example are used to represent an example, an illustration, or a description. Any embodiment or design scheme described as an example or for example in the embodiments of this application should not be explained as being more preferred or possessing advantages over another embodiment or design scheme.Exactly, the use of terms like "example" or "for example" is intended to present a related concept in a specific way to facilitate understanding.

[0032] The embodiments of this application provide an optical communication device capable of converting between optical and electrical signals and conducting optical signals. For example, the Petition 870250094663, dated 10 / 16 / 2025, p. 16 / 44 10 / 26 optical communication device may be an optical module. The optical module may be a long-range communication module, a short-range communication module, or similar. The long-range communication module includes a coherent communication module, and the short-range communication module includes a constant-amplitude communication module. A specific form of optical communication device is not particularly limited in embodiments of this application.

[0033] The optical communication device can be used in an optical communication system. For example, short-range communication modules can be used in a data center to cooperatively complete data exchange between servers at different layers of the data center. FIG. 1 is a diagram of a structure of an optical communication system according to an embodiment of this application.

[0034] As shown in FIG. 1, in some embodiments, an optical communication system 1 includes an optical switch 100. The optical switch 100 can be used for data exchange between servers at different layers in a large-scale data center, to increase bandwidth and significantly reduce the extra power consumption caused by network cabling switching. The optical switch 100 includes an optical module 200, a converter 130, and a fiber array unit (FAU) 120 to protect a fiber array.

[0035] Optical module 200 is a functional module for mutual conversion between an optical signal and an electrical signal in a network device. In one aspect, optical module 200 and the fiber array can be connected to each other via interface 200a. In some embodiments, the fiber array unit 120 includes an output fiber 121 to receive an optical signal emitted by optical module 200 and an input fiber 122 to insert an optical signal into optical module 200. The fiber of Petition 870250094663, dated 10 / 16 / 2025, p. 17 / 44 Output fiber 121 and input fiber 122 can be connected to optical module 200 via different ports, respectively. As shown in FIG. 1 and FIG. 3, for example, output fiber 121 is connected to optical module 200 via a first port 200a1, and input fiber 122 is connected to optical module 200 via a second port 200a2. Furthermore, optical module 200 is connected to converter 130. Converter 130 is configured for processing and generating an electrical signal.

[0036] In this way, the cooperation of optical module 200, converter 130 and fiber array allows optical switch 100 to implement signal processing and conduction, to adapt to various communication scenarios.

[0037] For a scenario such as high transmission rate communication integrating transmission and reception, in some modes, the optical module 200 may include a modulator 112 and a photoelectric detector 113. The converter 130 may include an optical digital signal processing (oDSP) module 131, a driver module 132 and a trans-impedance amplifier (TIA) 133.

[0038] In one aspect, the photoelectric detector 113 can be connected to the input fiber 122. After receiving an optical signal from the input fiber 122, the photoelectric detector 113 can generate a corresponding current signal based on the optical signal, so as to process the current signal. The transimpedance amplifier 133 is connected to the photoelectric detector 113 and configured to perform transimpedance amplification on the current signal generated by the photoelectric detector 113, so as to obtain a voltage signal. The oDSP module 131 can be connected to the transimpedance amplifier 133 and configured to control the transimpedance amplifier 133 to amplify the electrical signal and process the amplified electrical signal.

[0039] In another aspect, the oDSP 131 module is connected to Petition 870250094663, dated 10 / 16 / 2025, page 18 / 44 The 12 / 26 controller module 132 is configured to control the controller module 132 to generate a modulation signal. The controller module 132 is connected to the modulator 112 and configured to provide the modulation signal, so that the modulator 112 uses the modulation signal to modulate an optical signal to be modulated and carries the modulation signal as an electrical signal in the optical signal to be modulated. The modulator 112 can be connected to the output fiber 121. After modulating the optical signal to be modulated, the modulator 112 can send a modulated optical signal through the output fiber 121. The optical signal to be modulated can be provided by a light-emitting component 111.

[0040] It can be understood that FIG. 1 schematically shows only some possible components included in the optical communication system, and the actual shapes, sizes, positions, and construction of these components are not limited by FIG. 1.

[0041] An optical module is one of the most essential components in the field of optical networking technologies. A device in the optical module has relatively high power consumption during operation, resulting in an increase in the component's temperature. When the component's temperature is too high, the component's performance can be affected or even damaged.

[0042] To solve a heat dissipation problem of the optical module, as shown in FIG. 2, in some embodiments, a heat sink 400 is provided outside the optical module 200. The heat sink 400 can be made of various materials, for example, metal, such as die-cast aluminum, die-cast zinc, machined aluminum or machined copper, with a thermal conductivity between 95 w / mk and 385 w / mk.

[0043] In this way, the heat from optical module 200 can be transferred to heat sink 400, and heat sink 400 can quickly transfer the heat to the air for heat dissipation from optical module 200, thus ensuring the Petition 870250094663, dated 10 / 16 / 2025, page 19 / 44 13 / 26 Normal operation of optical module 200.

[0044] For greater heat dissipation efficiency of the heat sink 400, as shown in FIG. 2, in some embodiments, the heat sink 400 may include a plurality of heat sink fins. These heat sink fins increase the heat dissipation area, resulting in an improvement in the heat dissipation efficiency of the heat sink.

[0045] The optical module 200 and the heat sink 400 have a plurality of connection methods.

[0046] For example, in some embodiments, as shown in FIG. 2, for ease of use and maintenance, the optical module 200 has a connectable design, meaning that the optical module 200 can be connected to a sliding rail 300 in a connectable manner. The heat sink 400 can be attached to the sliding rail 300. When the optical module 200 is inserted into the sliding rail 300, the optical module 200 comes into contact with the heat sink 400. When the optical module 200 is removed from the sliding rail 300, the optical module 200 is separated from the heat sink 400.

[0047] For another example, as shown in FIG. 3, in some other embodiments, the optical module 200 can also be detachable; that is, the optical module 200 can be fixed to a support 500. The heat sink 400 is arranged in front of the optical module 200, and the heat sink 400 is also fixed to the support 500. It can be understood that, during the fixing of the heat sink 400 and the optical module 200, to ensure that the heat from the optical module 200 can be transferred to the heat sink 400 as quickly as possible, a larger contact surface between the heat sink 400 and the optical module 200 is better. It can be understood that, for better heat conduction between the heat sink 400 and the optical module 200, in some embodiments, a thermally conductive material can be used. Petition 870250094663, dated 10 / 16 / 2025, p. 20 / 44 14 / 26 to be used between optical module 200 and heat sink 400. One side of a film layer formed by thermally conductive material can be fully attached to optical module 200, and the other side can be fully attached to heat sink 400. In this way, the heat from optical module 200 can be completely transferred to heat sink 400 through the thermally conductive material, without causing hot spots, thus ensuring heat dissipation performance.

[0048] For the optical module 200 and the heat sink 400 shown in FIG. 2, due to the insertion and removal actions of the optical module 200, it is not suitable to dispose of a thermally conductive material between the heat sink 400 and the optical module 200. In this case, the optical module 200 is in direct contact with the heat sink 400. As shown in FIG. 4, heat can only be transferred by means of dry contact between the optical module 200 and the heat sink 400, which causes a thermal contact resistance. The causes of heat transfer by dry contact include the following: when the optical module 200 is in direct contact with the heat sink 400, there is a gap between the optical module 200 and the heat sink 400; Furthermore, since the contact surface between the optical module 200 and the heat sink 400 is not perfectly flat, the contact surface has surface roughness, that is, the contact surface is irregular.Therefore, there is no complete contact microscopically, causing a relatively large thermal contact resistance, which is not conducive to heat dissipation.

[0049] As the performance of an optical module becomes increasingly powerful, the power consumption of the optical module becomes increasingly high. As a result, heat dissipation from the optical module becomes increasingly difficult. The problem of heat dissipation from the optical module cannot be solved simply by using a heat sink. Petition 870250094663, dated 10 / 16 / 2025, page 21 / 44 15 / 26

[0050] To ensure the heat dissipation efficiency of an optical module, one embodiment of this application provides an optical module. Providing a heat dissipation cavity in a housing cover of the optical module allows for a further improvement in the heat dissipation efficiency of the optical module.

[0051] The following is a description with reference to the attached drawings.

[0052] FIG. 5 is a diagram of a structure of an optical module according to an embodiment of this application. As shown in FIG. 5, in some embodiments, the optical module 200 includes a housing body 210 and a housing cover 220 that are arranged opposite each other, a first device 240 and a second device 250.

[0053] The housing body 210 is configured to provide space for disposing of electronic devices and to protect the electronic devices, such as the first device 240 and the second device 250, disposed within the housing body 210. The housing body 210 includes a first surface 211 adjacent to the housing cover, and a housing groove 210a extending in a direction away from the housing cover 220 is provided on the first surface 211. The housing body 210 may have a plurality of shapes. For example, in one implementation, the housing body 210 may be an uncovered cubic box structure shown in FIG. 6. The shape of the housing body 210 is not limited in this application.

[0054] The first device 240 and the second device 250 are arranged in the accommodation groove 210a. The first device 240 and the second device 250 are arranged in the accommodation groove 210a in a plurality of ways. For example, in some embodiments, the first device 240 and the second device 250 may be fixed directly to the bottom of the accommodation groove 210a. For another example, in some other embodiments, as shown in FIG. 5 and FIG. Petition 870250094663, dated 10 / 16 / 2025, page 22 / 44 16 / 26 6. The optical module 200 further includes a circuit board 230. A fixing pillar 210b is provided at the bottom of the accommodation groove 210a. The circuit board 230 can be fixed to the fixing pillar 210b in the accommodation groove 210a using a fastener. The first device 240 and the second device 250 are arranged on the circuit board 230. In one implementation, the first device 240 and the second device 250 can be fixed to the circuit board 230 by a soldering method. For example, the second device 250 is fixed to the circuit board 230 by a soldering method, to form a solder ball 280. In one implementation, the first device 240 and the second device 250 are arranged on the same side of the circuit board 230. In a direction parallel to the first surface 211, the first device 240 and the second device 250 can be fixed side by side in the accommodation groove 210a.It can be understood that, in a direction perpendicular to the first surface 211, a height H1 of the first device 240 and a height H2 of the second device 250 may be equal or different. This is not limited in this application.

[0055] The first device 240 may be an optical device, which can convert an electrical signal into an optical signal or convert an optical signal into an electrical signal, for example, the modulator 112 shown in FIG. 1 or the photoelectric detector 113 shown in FIG. 1. The second device 250 may be a silicon photonic chip, for example, a DR4 silicon photonic chip or a DR8 silicon photonic chip. Specific implementations of the first device 240 and the second device 250 are not limited in this application.

[0056] In one aspect, the housing cover 220 is configured to cover the housing groove 210a of the housing body 210 to form a closed cavity. In this way, it is ensured that dust and similar particles do not enter the optical module 200, and it is ensured that the electronic devices disposed in the body Petition 870250094663, dated 10 / 16 / 2025, page 23 / 44 17 / 26 of housing 210 are not damaged by an external environment. In another aspect, the housing cover is configured to dissipate heat from the electronic devices arranged in the housing body 210, for example, to dissipate heat from the first device 240 and the second device 250.

[0057] The housing cover 220 and the housing body 210 are fixed in a plurality of ways. For example, as shown in FIG. 5, they can be connected using a fastener 270. The fastener 270 can be a screw. A through mounting hole 220c is provided in the housing cover 220, and the screw passes through the mounting hole 220c to connect the housing cover 220 and the housing body 210. Another example is the use of an adhesive for connection.

[0058] The housing cover 220 includes a first cavity 221 and a second cavity 222. A working medium is provided in both the first cavity 221 and the second cavity 222. In the first cavity 221, the working medium can transfer energy through vapor-liquid phase change, so as to achieve a temperature equalization and heat dissipation objective. The working medium can be a coolant. There can be a plurality of materials for the coolant, which, for example, can include a fluorinated liquid or can include water, methanol, alcohol, or acetone. In one implementation, after a sample restoration process of the optical module, a liquid can be injected into the first cavity 221 and the second cavity 222, followed by vacuum extraction and sealing.

[0059] The first cavity 221 and the second cavity 222 are arranged in a direction parallel to the housing cover 220. The first device 240 and the first cavity 221 are arranged opposite each other, and the working medium in the first cavity 221 is used to dissipate heat from the first device 240. The second device 250 and the second cavity 222 are arranged opposite each other, and the working medium in the second Petition 870250094663, dated 10 / 16 / 2025, page 24 / 44 The 18 / 26 cavity 222 is used to remove heat from the second device 250.

[0060] Thus, when the first device 240 operates, the heat from the first device 240 is transferred by means of heat transfer to a surface of the housing cover 220 near the first device 240. Since the first device 240 and the first cavity 221 are arranged opposite each other, heat enters the first cavity 221 through the surface, the working medium in the first cavity 221 transfers the heat to a cavity surface of the first cavity 221 facing away from the first device 240, and then the heat is transferred to the outside of the optical module 200 through the surface of the housing cover 220 facing away from the first device 240, so as to complete the heat dissipation of the first device 240.

[0061] Similarly, when the second device 250 operates, the heat from the second device 250 is transferred by means of heat transfer to a housing cover surface 220 near the second device 250. Since the second device 250 and the second cavity 222 are arranged opposite each other, heat enters the second cavity 222 through the surface, the working medium in the second cavity 222 transfers the heat to a cavity surface of the second cavity 222 facing away from the second device 250, and then the heat is transferred to the outside of the optical module 200 through the housing cover surface 220 facing away from the second device 250, so as to complete the heat dissipation of the second device 250.

[0062] In this way, the optical module housing cover provided in this embodiment of this application not only exists as a structural part, but also implements heat dissipation by providing the first cavity and the second cavity. Petition 870250094663, dated 10 / 16 / 2025, page 25 / 44 19 / 26 Compared to a method of disposing of only one heat sink outside an optical module, this increases the ways of dissipating heat and effectively improves the heat dissipation efficiency of the optical module. Furthermore, providing both the first and second cavities allows for a reduction in power density (power consumption per unit area) on the housing cover surface, thus reducing the dry contact temperature difference, which favors heat dissipation.

[0063] It can be understood that when a heat sink is placed outside the optical module, the heat sink should be placed on a side close to the housing cover, and a larger contact area between the heat sink and the housing cover is more conducive to heat dissipation. Furthermore, to improve heat dissipation efficiency, it is ensured that the contact surface between the housing cover and the heat sink meets the surface flatness and roughness requirements, so that the heat sink and the housing cover are better secured to each other.

[0064] The structure of the accommodation roof is described in detail below with reference to the attached drawings.

[0065] FIG. 7 is a diagram of a housing cover structure for an optical module according to an embodiment of this application. As shown in FIG. 5 and FIG. 7, in some embodiments, the housing cover 220 includes a first cover plate 220a and a second cover plate 220b which are arranged opposite each other. The first cover plate 220a is arranged on one side of the second cover plate 220b facing away from the first device 240.

[0066] To obtain a better heat dissipation effect, the material of the first cover plate 220a can be copper. The material of the second cover plate 220b can be copper.

[0067] As shown in FIG. 8, the second cover plate Petition 870250094663, dated 10 / 16 / 2025, page 26 / 44 20 / 26 220b includes a second surface 220b3 adjacent to the first cover plate 220a. A first groove 220b1, which is recessed in a direction away from the first cover plate 220a, is provided on the second surface 220b3. The first cover plate 220a and the second cover plate 220b are connected in a sealed manner, such that the first groove 220b1 of the second cover plate 220b and the first cover plate 220a jointly enclose the first cavity 221. Similarly, as shown in FIG. 8, in some embodiments, a second groove 220b2, which is recessed in a direction away from the first cover plate 220a, is provided on the second surface 220b3 of the second cover plate 220b. The first cover plate 220a and the second cover plate 220b are connected in a sealed manner, so that the second groove 220b2 of the second cover plate 220b and the first cover plate 220a jointly enclose the second cavity 222.In a direction perpendicular to the second surface 220b3, a depth W1 of the first groove 220b1 and a depth W2 of the second groove 220b2 may be equal or different. This is not limited in this application.

[0068] The first groove 220b1 can have a plurality of shapes, for example, it can have a square shape or a circular shape. This is not limited in this application. In addition, the first groove 220b1 can also be a stepped groove as shown in FIG. 9.

[0069] The first cover plate 220a and the second cover plate 220b can be connected in a plurality of ways. For example, the connection can be soldered.

[0070] A feasible implementation of the first cover plate is described below.

[0071] In one implementation, the first cover plate 220a may be a straight plate structure; that is, no recessed structure is provided in the first cover plate. Petition 870250094663, dated 10 / 16 / 2025, page 27 / 44 21 / 26 220a. This first 220a roofing sheet has a simple structure, is easy to manufacture, and contributes to cost reduction.

[0072] In another implementation, the first cover plate 220a can be provided with a recessed structure opposite the first groove 220b1, and the recessed structure can be recessed in a direction opposite to the second cover plate 220b. In this way, the first cavity 221 has a larger space.

[0073] The first cover plate 220a and the second cover plate 220b can have a plurality of shapes, for example, they can be square or circular.

[0074] It may be understood that the first cover plate and the second cover plate provided in this embodiment of this application are merely examples to describe feasible implementations of first cavity and second cavity formation in the housing cover, and do not constitute a limitation on the implementations of first cavity and second cavity formation. For example, in another implementation, the second cover plate may be a straight plate, and a recessed structure is formed in the first cover plate to form the first cavity.

[0075] Furthermore, compared to the first cover plate, the second cover plate is positioned closer to the first device and is relatively close to another device positioned in the first groove. Therefore, a surface of the second cover plate close to the first device must avoid interference with the device in the first groove.

[0076] To ensure that the first cover plate and the second cover plate do not collapse, in some embodiments, as shown in FIG. 9, a support pillar 223 is provided in the first groove 220b1, and the support pillar 223 extends from a lower surface 220b0 of the first groove 220b1 to the first cover plate 220a. In a Petition 870250094663, dated 10 / 16 / 2025, page 28 / 44 22 / 26 implementation, a cross-section of the support pillar 223 gradually decreases from the lower surface of the first groove 220b1 to the first cover plate 220a. That is, the support pillar 223 is a conical pillar.

[0077] To obtain a better heat dissipation effect, a support pillar material 223 can be copper.

[0078] To implement the circulation of the working medium in the cavity and obtain a better heat dissipation effect, a capillary structure is formed in the housing cover provided in this embodiment of this application, to implement the reflux of the working medium. The capillary structure can also be called a wick structure or microstructure. The wick structure can be a mesh of metal wires, a microgroove, a fiber filament or similar, or it can be a sintered metal powder wick or a combination of several structures. Compared with the mesh of metal wires, the microgroove and the fiber filament, the sintered metal powder wick has several advantages, for example, low thermal resistance. In addition, since the sintered powder wick generally has a porosity of more than 60%, it has a relatively large evaporation surface area.

[0079] The capillary structure formed in the housing cover is described below with reference to the attached drawings.

[0080] FIG. 10 is a diagram of a housing cover structure for an optical module according to an embodiment of this application. As shown in FIG. 10, in some embodiments, the housing cover 220 further includes a first capillary layer 224, and the first capillary layer 224 is provided on a surface 220b4 of the first groove 220b1.

[0081] A material for the first capillary layer 224 can be copper powder, and the copper powder is obtained by high-temperature sintering. A material for the second covering plate 220b can also be copper. In this way, the first capillary layer and the second covering plate are well matched. Petition 870250094663, dated 10 / 16 / 2025, page 29 / 44 23 / 26

[0082] The capillary structure can not only be provided in the first groove 220b1, but can also be provided in another position on the housing cover 220.

[0083] For example, as shown in FIG. 10, in some embodiments, the housing cover 220 further includes a second capillary layer 226 and a third capillary layer 225. The first cover plate 220a includes a third surface 220a1 adjacent to the second cover plate 220b and opposite the second surface 220b3. The second capillary layer 226 is formed on the third surface 220a1. A material for the second capillary layer 226 can be copper powder, and the copper powder is obtained by high-temperature sintering. A material for the first cover plate 220a can also be copper. In this way, the second capillary layer 226 and the first cover plate 220a are well matched.

[0084] The third capillary layer 225 is formed on the second surface 220b3 of the second cover plate 220b. A material for the third capillary layer 225 can be copper powder, and the copper powder is obtained by high-temperature sintering. A material for the second cover plate 220b can also be copper. In this way, the third capillary layer 225 and the second cover plate 220b are well combined.

[0085] For another example, as shown in FIG. 10, in some embodiments, the housing cover 220 further includes a fourth capillary layer 227, and the fourth capillary layer 227 is formed on a lateral surface of the support pillar 223.

[0086] In one implementation, when the fourth capillary layer 227 is formed, the copper powder can be sintered into a powder ring structure and coated onto the support pillar 223 using a clamp.

[0087] In this way, heat can be transferred to the heat sink or dissipated into the air through a series of heat exchanges, in order to implement heat dissipation. Petition 870250094663, dated 10 / 16 / 2025, pp. 30 / 44 24 / 26 The optical module supplied in this embodiment of this application is characterized by a small size and rapid heat dissipation, and can meet a relatively high heat dissipation requirement.

[0088] When the first device 240 is an optical device and the second device 250 is an electrical chip, the power consumption of the electrical chip can account for at least 70% of the total power consumption of the entire optical module. Compared to an optical device, an electrical chip has a relatively high temperature specification. For example, an electrical chip housing temperature specification may be 95°C or higher. However, the optical device has low power consumption and is not temperature resistant. The temperature specification for the optical device housing can be 65°C or less. In other words, when the optical device and the electrical chip operate, the power consumption is different, and the heat emitted by the optical device and the electrical chip is different. As a result, after the heat from the optical device and the electrical chip is transferred to the housing cover, the heat can be diffused. Since the heat from the electrical chip is greater than the heat from the optical device, the heat from the electrical chip can be transferred towards the optical device, and the optical device is heated by this heat. Consequently, the temperature of the optical device increases, which is unfavorable for the heat dissipation of the optical module.

[0089] To solve this problem, a thermal insulation structure is provided between the first cavity and the second cavity in the optical module provided in this embodiment of this application, to block heat exchange between the first cavity and the second cavity. The heat from the electrical chip does not cause thermal heating in the optical device. The thermal insulation structure is described below with reference to the drawings. Petition 870250094663, dated 10 / 16 / 2025, pp. 31 / 44 25 / 26 attachments.

[0090] FIG. 11 is a diagram of a housing cover structure for an optical module according to an embodiment of this application. FIG. 12 is an exploded diagram of the optical module housing cover shown in FIG. 11. As shown in FIG. 11 and FIG. 12, in some embodiments, the housing cover 220 further includes a thermal insulation structure 228 provided between the first cavity 221 and the second cavity 222 and configured to block heat exchange between the first cavity 221 and the second cavity 222.

[0091] The thermal insulation structure can be implemented in a plurality of forms.

[0092] For example, the thermal insulation structure may be a thermal insulation hole. As shown in FIG. 13, the thermal insulation hole passes through the housing cover 220, causing the first cavity 221 and the second cavity 222 not to communicate with each other. The thermal insulation hole may be formed by machining.

[0093] As another example, the thermal insulation structure can also be a thermal insulation member made from a thermal insulation device.

[0094] In this way, a device in the optical module is protected and it is ensured that the device's performance is not interfered with by another device.

[0095] For improved heat transfer to the housing cover, as shown in FIG. 14, in some embodiments, the optical module 200 also includes a thermally conductive layer 260. In one implementation, the thermally conductive layer 260 is disposed between the second device 250 and the housing cover 220. In another implementation, the thermally conductive layer 260 may be disposed only between the first device 240 and the housing cover 220. Petition 870250094663, dated 10 / 16 / 2025, pp. 32-44 26 / 26

[0096] As shown in FIG. 15, in another implementation, the thermally conductive layer 260 is disposed between the first device 240 and the housing cover 220, and the thermally conductive layer 260 is disposed between the second device 250 and the housing cover 220.

[0097] The optical module provided in this embodiment of this application uses the housing cover structure to dissipate heat from the first device and the second device, thereby increasing the ways of heat dissipation and effectively improving the heat dissipation efficiency of the optical module.

[0098] It can be understood that more than two devices can be arranged in the optical module, and more than two cavities can be arranged correspondingly in the housing cover, in order to improve the heat dissipation efficiency of the optical module.

[0099] To meet process requirements, such as rust protection and waterproofing, surface processing can be performed on the housing body and housing cover of the optical module.

[00100] Finally, it should be noted that the foregoing embodiments are intended only to describe the technical solutions of this application, but not to limit this application. Although this application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they may still make modifications to the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features thereof, without departing from the spirit and scope of the technical solutions of the embodiments of this application. Petition 870250094663, dated 10 / 16 / 2025, pp. 33 / 44

Claims

1 / 3 CLAIMS 1. Optical module, CHARACTERIZED in that it comprises: a housing body and a housing cover that are arranged opposite each other, wherein the housing body comprises a first surface close to the housing cover, and an accommodation groove extending in a direction away from the housing cover is provided on the first surface; and a first device and a second device, which are arranged in the accommodation groove, wherein a first cavity and a second cavity are formed in the housing cover, a working medium is provided in the first cavity and the second cavity, and the first cavity and the second cavity are arranged in a direction parallel to the housing cover, wherein the first device and the first cavity are arranged opposite each other, and the second device and the second cavity are arranged opposite each other.

2. Optical module, according to claim 1, CHARACTERIZED in that the housing cover comprises a first cover plate and a second cover plate that are arranged opposite each other, and the first cover plate is arranged on one side of the second cover plate that is away from the first device; the second cover plate comprises a second surface adjacent to the first cover plate, and a first groove that is recessed in a direction away from the first cover plate is provided on the second surface; and the first cover plate and the second cover plate are connected in a sealed manner, so that the first groove of the second cover plate and the first cover plate jointly enclose the first cavity.

3. Optical module, according to claim 2, Petition 870250084609, dated 09 / 19 / 2025, page 17 / 22 2 / 3 CHARACTERIZED in that the housing cover further comprises a first capillary layer, and the first capillary layer is provided on a surface of the first groove.

4. Optical module, according to claim 2 or 3, CHARACTERIZED in that the housing cover further comprises a second capillary layer and a third capillary layer; the first cover plate comprises a third surface that is adjacent to the second cover plate and opposite to the second surface, and the second capillary layer is formed on the third surface; and the third capillary layer is formed on the second surface of the second cover plate.

5. Optical module, according to any one of claims 2 to 4, CHARACTERIZED in that a support pillar is provided in the first groove, and the support pillar extends from a lower surface of the first groove to the first cover plate.

6. Optical module, according to claim 5, CHARACTERIZED in that the housing cover further comprises a fourth capillary layer, and the fourth capillary layer is formed on a lateral surface of the support pillar.

7. Optical module, according to any one of claims 1 to 6, CHARACTERIZED in that the housing cover further comprises a thermal insulation structure provided between the first cavity and the second cavity; and the thermal insulation structure is configured to block heat exchange between the first cavity and the second cavity.

8. Optical module, according to claim 7, CHARACTERIZED in that the thermal insulation structure comprises a thermal insulation hole or a thermal insulation member made of a thermal insulation device. Petition 870250084609, dated 09 / 19 / 2025, page 18 / 22 3 / 3 9. Optical module, according to claim 8, CHARACTERIZED in that the thermal insulation hole passes through the housing cover.

10. Optical module, according to any one of claims 1 to 9, CHARACTERIZED in that the optical module further comprises a circuit board; the circuit board is disposed at the bottom of the accommodation groove; and both the first device and the second device are disposed on the circuit board, and the first device and the second device are located on the same side of the circuit board.

11. Optical module, according to any one of claims 1 to 10, CHARACTERIZED in that the optical module further comprises a thermally conductive layer; the thermally conductive layer is disposed between the first device and the housing cover; and / or the thermally conductive layer is disposed between the second device and the housing cover.

12. Optical communication system, CHARACTERIZED in that it comprises the optical module as defined in any one of claims 1 to 11 and a heat sink, wherein the heat sink is disposed outside the optical module, and the heat sink is disposed on a side close to the housing cover of the optical module. Petition 870250084609, dated 09 / 19 / 2025, p. 19 / 22

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