Screen panel and screen device

Description

1 / 22 SCREEN PANEL AND SCREEN DEVICE TECHNICAL FIELD

[0001] The present invention relates to the field of design and manufacturing technologies for screen panels and, in particular, to a screen panel and a screen device. BACKGROUND

[0002] With the continuous development of screen panel manufacturing technology, people have placed higher demands on the performance of screen panels and devices.

[0003] In the fabrication process of screen panels, a plurality of functional layers needs to be formed, which corresponds to different fabrication processes, such as photomasking and etching processes. Encapsulation for the functional layers is performed after the formation of the functional layers, for example, forming an encapsulation layer to effectively prevent external water vapor from entering the screen panel and preventing the screen panel from being damaged. A plurality of metallic wires, such as metallic touch wires, are required in the screen panel. The metallic touch wires are generally arranged over the encapsulation layer. In the prior art, the encapsulation layer generally has a large tilt angle at the position between the screen area and the bonding area. The large tilt angle causes the encapsulation layer to make a sharp transition in this area.When performing the etching process to form the metal wires in the accentuated encapsulation layer, metal residues will likely occur in the position corresponding to the angle of inclination, and the flatness of the formed layer is weak, resulting in short circuit problems between different metal wires, causing the screen panel to malfunction, reducing the reliability and overall performance of the screen panel. Petition 870250088005, dated 09 / 29 / 2025, page 13 / 58 2 / 22

[0004] Therefore, solutions are needed for the problems of the prior technique. SUMMARY OF THE INVENTION

[0005] In summary, in the prior art, during the process of manufacturing a screen panel, there is a sharp angle of inclination in the encapsulation layer in the screen panel. When forming and etching the metal wires at the angle of inclination, there will be metallic residues, which result in internal short circuits in the screen panel, thereby reducing the reliability and overall performance of the screen panel.

[0006] To solve the above problems, embodiments of the present invention provide a screen panel and a screen device to effectively improve the problem in the prior art that the screen panel fails to function normally due to the existence of a sharp angle of inclination within the encapsulation layer of the screen panel, which results in etched residual metal.

[0007] To solve the above technical problems, the present application provides a screen panel comprising a screen area and a non-screen area disposed on one side of the screen area, wherein the screen panel comprises: a substrate; an inorganic insulation layer disposed on a substrate surface, the inorganic insulation layer comprising a first groove disposed in the area without screen; an organic insulation layer disposed on a surface of the inorganic insulation layer away from the substrate, the organic insulation layer comprising a barrier disposed between the first groove and the screen area, a portion of organic insulation disposed on one side of the barrier away from the screen area, a second groove disposed between the barrier and the portion of organic insulation, and a first wiring hole disposed between the portion of organic insulation and the first Petition 870250088005, dated 09 / 29 / 2025, page 14 / 58 3 / 22 groove; a light-emitting layer arranged on a surface of the organic insulation layer away from the substrate and correspondingly arranged on the screen area; an encapsulation layer arranged on a surface of the light-emitting layer away from the substrate, the encapsulation layer being arranged in the screen area and extending to the non-screen area, the encapsulation layer covering at least part of the organic insulation portion and not extending to the first wiring hole, a thickness of the encapsulation layer corresponding to the second groove being greater than a thickness of the encapsulation layer corresponding to the organic insulation portion; wherein the encapsulation layer comprises a first encapsulation portion and a second encapsulation portion, the first encapsulation portion is disposed on a side close to the screen area, the second encapsulation portion is connected to the first encapsulation portion, and a thickness of the first encapsulation portion is greater than or equal to a thickness of the second encapsulation portion.

[0008] According to one embodiment of the present application, the organic isolation portion comprises a first lateral surface close to the screen area and an upper surface away from the substrate, the first lateral surface being connected to the upper surface; The thickness of the encapsulation layer corresponding to the second groove is greater than the thickness of the encapsulation layer corresponding to the top surface.

[0009] According to one embodiment of the present application, the encapsulation layer comprises a first engraved surface arranged and corresponding to the first lateral surface, a thickness of a portion of the encapsulation layer located on one side of the first engraved surface close to Petition 870250088005, dated 09 / 29 / 2025, page 15 / 58 4 / 22 screen area is greater than the thickness of a portion of the encapsulation layer located on one side of the first engraved surface away from the screen area.

[0010] According to an embodiment of the present application, a first angle between the top surface and a substrate on one side of the top surface away from the screen area is less than 90 degrees; A second angle between the first etched surface and a substrate on one side of the first etched surface near the screen area is less than 90 degrees.

[0011] According to one embodiment of the present application, the second angle is less than or equal to 60 degrees.

[0012] According to one embodiment of this application, it additionally includes: a touch layer disposed on a surface of the encapsulation layer away from the substrate, wherein the touch layer comprises: an insulating sublayer arranged on a surface of the encapsulation layer away from the substrate, the insulating sublayer covering the screen area and extending into the non-screen area, a boundary of the insulating sublayer in the non-screen area that does not exceed the first etched surface; a metallic touch sublayer disposed on a surface of the insulation sublayer away from the substrate, the metallic touch sublayer comprising a touch conductor wire disposed from the screen area to the non-screen area, and a passage through the first etched surface and extending to the first wiring hole.

[0013] According to one embodiment of the present application, the organic insulation layer comprises: a first organic insulation sublayer arranged on a surface of the inorganic insulation layer away from the substrate, the first organic insulation sublayer Petition 870250088005, dated 09 / 29 / 2025, page 16 / 58 5 / 22 comprising a first organic insulation sub-portion disposed in the second slot away from the screen area, the first organic insulation sub-portion filling the first slot; a second organic insulation sublayer arranged on a surface of the first organic insulation sublayer away from the substrate, the second organic insulation sublayer comprising a second organic insulation subportion arranged in the second groove away from the screen area, the second organic insulation subportion arranged on a surface of the first organic insulation subportion away from the substrate; where the first wiring hole penetrates through the second sub-portion of organic insulation; Or, the first wiring hole penetrates through both the second organic insulation sub-portion and the first organic insulation sub-portion.

[0014] According to an embodiment of the present application, the first organic isolation subportion comprises a first lateral subsurface on a side adjacent to the screen area; The second organic isolation sub-portion comprises a second lateral subsurface on a side adjacent to the screen area; The first engraved surface is arranged to correspond to the first lateral subsurface or the second lateral subsurface.

[0015] According to one embodiment of the present application, a surface roughness of the upper surface between the encapsulation layer and the first wiring hole is greater than a surface roughness on the upper surface enclosed by the encapsulation layer.

[0016] According to a second aspect of the embodiments of the present application, the present application also provides a screen panel comprising a screen area and a non-screen area arranged on one side of the screen area, wherein the screen panel comprises: a substrate; Petition 870250088005, dated 09 / 29 / 2025, page 17 / 58 6 / 22 an inorganic insulation layer disposed on a substrate surface, the inorganic insulation layer comprising a first groove disposed in the area without screen; an organic insulation layer disposed on a surface of the inorganic insulation layer away from the substrate, the organic insulation layer comprising a barrier disposed between the first groove and the screen area, a portion of organic insulation disposed on one side of the barrier away from the screen area, a second groove disposed between the barrier and the portion of organic insulation, and a first wiring hole disposed between the portion of organic insulation and the first groove; a light-emitting layer arranged on a surface of the organic insulation layer away from the substrate and correspondingly arranged on the screen area; an encapsulation layer arranged on a surface of the light-emitting layer away from the substrate, the encapsulation layer being arranged in the screen area and extending to the non-screen area, the encapsulation layer covering at least part of the organic insulation portion and not extending to the first wiring hole, a thickness of the encapsulation layer corresponding to the second groove being greater than a thickness of the encapsulation layer corresponding to the organic insulation portion.

[0017] According to one embodiment of the present application, the organic isolation portion comprises a first lateral surface close to the screen area and an upper surface away from the substrate, the first lateral surface being connected to the upper surface; The thickness of the encapsulation layer corresponding to the second groove is greater than the thickness of the encapsulation layer corresponding to the top surface.

[0018] According to a modality of the present application, the Petition 870250088005, dated 09 / 29 / 2025, page 18 / 58 7 / 22 The encapsulation layer comprises a first engraved surface arranged and corresponding to the first lateral surface; the thickness of a portion of the encapsulation layer located on one side of the first engraved surface near the screen area is greater than the thickness of a portion of the encapsulation layer located on one side of the first engraved surface away from the screen area.

[0019] According to an embodiment of the present application, a first angle between the top surface and a substrate on one side of the top surface away from the screen area is less than 90 degrees; A second angle between the first etched surface and a substrate on one side of the first etched surface near the screen area is less than 90 degrees.

[0020] According to one embodiment of the present application, the second angle is less than or equal to 60 degrees.

[0021] According to a modality of the present application, it additionally includes: a touch layer disposed on a surface of the encapsulation layer away from the substrate, wherein the touch layer comprises: an insulating sublayer arranged on a surface of the encapsulation layer away from the substrate, the insulating sublayer covering the screen area and extending into the non-screen area, a boundary of the insulating sublayer in the non-screen area that does not exceed the first etched surface; a metallic touch sublayer disposed on a surface of the insulation sublayer away from the substrate, the metallic touch sublayer comprising a touch conductor wire disposed from the screen area to the non-screen area, and a passage through the first etched surface and extending to the first wiring hole.

[0022] According to a modality of the present application, the Petition 870250088005, dated 09 / 29 / 2025, page 19 / 58 The 8 / 22 organic insulation layer comprises: a first organic insulation sublayer arranged on a surface of the inorganic insulation layer away from the substrate, the first organic insulation sublayer comprising a first organic insulation subportion arranged in the second groove away from the screen area, the first organic insulation subportion filling the first groove; a second organic insulation sublayer arranged on a surface of the first organic insulation sublayer away from the substrate, the second organic insulation sublayer comprising a second organic insulation subportion arranged in the second groove away from the screen area, the second organic insulation subportion arranged on a surface of the first organic insulation subportion away from the substrate; where the first wiring hole penetrates through the second sub-portion of organic insulation; Or, the first wiring hole penetrates through both the second organic insulation sub-portion and the first organic insulation sub-portion.

[0023] According to an embodiment of the present application, the first organic isolation subportion comprises a first lateral subsurface on a side close to the screen area; The second organic isolation sub-portion comprises a second lateral subsurface on a side adjacent to the screen area; The first engraved surface is arranged to correspond to the first lateral subsurface or the second lateral subsurface.

[0024] According to one embodiment of the present application, a surface roughness of the upper surface between the encapsulation layer and the first wiring hole is greater than a surface roughness on the upper surface enclosed by the encapsulation layer.

[0025] According to a modality of the present application, the Petition 870250088005, dated 09 / 29 / 2025, page 20 / 58 The 9 / 22 encapsulation layer spans the second groove and comes into direct contact with a surface of the inorganic insulation layer that is away from the substrate in the second groove.

[0026] According to a third aspect of the embodiments of this application, this application also provides a display device comprising a display panel provided in the embodiments of this application. ADVANTAGEOUS EFFECTS

[0027] In summary, embodiments of the present invention include the following advantageous effects:

[0028] A screen panel and a screen device are provided in embodiments of the present invention, the screen panel includes a screen area and a non-screen area disposed on one side of the screen area, the screen panel further includes a substrate, an inorganic insulation layer, an organic insulation layer, a light-emitting layer, and an encapsulation layer, wherein the organic insulation layer includes an organic insulation portion, the encapsulation layer covers at least part of the organic insulation portion and does not extend to the first wiring hole, the encapsulation layer also covers the second groove of the organic insulation layer and comes into direct contact with the surface of the inorganic insulation layer, and the thickness of the encapsulation layer portion located in the second groove is greater than the thickness of the encapsulation layer portion located in the organic insulation portion.In the embodiments of the present application, different thicknesses of the encapsulation layer are formed with a plurality of different engraving processes, and the engraved groove of the encapsulation layer is formed on the lateral surface or on the upper surface of the screen panel film layers, thus effectively improving the engraving effect of the encapsulation layer in the engraving process, ensuring the sealing effect on the layer. Petition 870250088005, dated 09 / 29 / 2025, page 21 / 58 10 / 22 encapsulation, effectively improving the reliability and overall performance of the screen panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG. 1 is a schematic diagram of a planar structure of a screen panel provided in the prior art; FIG. 2A is a schematic diagram of a film layer structure of a screen panel provided in the embodiments of the present application; FIG. 2B is a schematic diagram of a film layer structure of another screen panel provided in the embodiments of the present application; FIG. 3 is a schematic diagram of a film layer structure of another screen panel provided in the embodiments of the present application. DETAILED DESCRIPTION OF THE MODALITIES

[0030] The description of the embodiments below refers to the attached drawings, which illustrate the specific embodiments that can be implemented in this application.

[0031] With the continuous development of panel and display device manufacturing technology, higher requirements have been placed on the performance and display effect of display devices.

[0032] Compared to conventional screen panels shown in FIG. 1, FIG. 1 is a schematic diagram of a planar structure of a screen panel provided in the prior art. Functional layers of the screen panel need to be encapsulated after the formation of the functional layers of the screen panel. The screen panel includes a screen area 101 and a non-screen area 102. The non-screen area 102 can be a bonding area at the edge of the screen panel. In the embodiments of the present application, a wiring area 39 and a bending area 40 are provided in the non-screen area. A plurality of first wiring holes is provided in the wiring area 39, and the wiring area 39 is Petition 870250088005, dated 09 / 29 / 2025, page 22 / 58 11 / 22 is arranged on one side near the screen area, and the bending area 40 is arranged on one side near the edge of the screen panel. In addition, an encapsulation layer is also provided on the screen panel. Specifically, the encapsulation layer is arranged at least in the screen area and extends into the non-screen area, such as extending into the bending area in the non-screen area. As shown in FIG. 1, the encapsulation layer includes an inner boundary 104 and an outer boundary 103. An encapsulation area of ​​a given width is formed between the inner boundary 104 of the encapsulation layer and the outer boundary 103 of the encapsulation layer, effectively encapsulating the screen panel as the encapsulation area constitutes an effective encapsulation area.

[0033] Furthermore, in wiring area 39, a metallic layer disposed in the encapsulation layer is electrically connected to the matrix substrate through the first wiring hole. However, in the prior art, during the etching process of the encapsulation layer, due to the large amount of etching and large tilt angle at the inner and outer limits of the encapsulation layer, metallic residue may occur. The resulting metallic residue may cause short circuits between other metals in this region, thus reducing the reliability and overall performance of the screen panel.

[0034] The embodiments of the present application provide a screen panel and a screen device to effectively improve the problem of metallic residue that occurs in the engraved region during the engraving process of the screen panel encapsulation layer due to the large inclined angle formed.

[0035] As shown in FIG. 2A, FIG. 2A is a schematic diagram of a film layer structure of a screen panel provided in the embodiments of the present application. FIG. 2A shows only a film layer structure in a partial area of ​​the screen panel. Specifically, FIG. 2A shows a Petition 870250088005, dated 09 / 29 / 2025, page 23 / 58 12 / 22 part of the screen area 101, a wiring area 39, and a bending area 40 part of the screen panel. The screen panel includes a substrate 119, an inorganic insulation layer 200, an organic insulation layer 17, a first signaling wire layer 404, a barrier 63, a second signaling wire layer 405, a light-emitting layer 174, and an encapsulation layer 202.

[0036] Specifically, substrate 119 is considered a conventional matrix substrate 119 for illustrative purposes. The inorganic insulation layer 200 is disposed over the matrix substrate 119, and the first signaling wiring layer 404 is disposed over the inorganic insulation layer 200. Furthermore, in the following embodiments, the organic insulation layer 17 is considered as a first planarization layer 171 and a second planarization layer 172 for illustrative purposes.

[0037] The first planar layer 171 is laid over the inorganic insulation layer 200 and covers the first signaling wiring layer 404. Furthermore, the second signaling wiring layer 405 is laid over the first planar layer 171, and the second planar layer 172 is laid over the first planar layer 171 and covers the second signaling wiring layer 405.

[0038] In the embodiments of the present application, the inorganic insulation layer 200, the first planarization layer 171, and the second planarization layer 172 are arranged in the screen area and extend into the screen-free area. Furthermore, in the screen-free area, the inorganic insulation layer 200 additionally comprises a first groove, the structure of which is not shown in FIG. 2A. Specifically, the first groove is arranged in the bending area 40 of the screen-free area 102. By providing the first groove in the bending area 40, some of the material in the inorganic insulation layer is removed, which can reduce Petition 870250088005, dated 09 / 29 / 2025, page 24 / 58 13 / 22 increases the tension when the screen panel is flexed and improves the screen panel's bending performance. Additionally, different signal lines can be bridged through the first slot.

[0039] Furthermore, the first 404 signaling wiring layer in the non-screen area of ​​the matrix substrate and the source drainage metal layer in the screen area of ​​the matrix substrate are made of the same metal layer. For example, when preparing the first source drainage metal layer of the matrix substrate, the first source drainage metal layer located in the non-screen area is the first 404 signaling wiring layer; when preparing the second source drainage metal layer of the matrix substrate, the second source drainage metal layer located in the non-screen area is the second 405 signaling wiring layer. Through the first 404 signaling wiring layer and the second 405 signaling wiring layer, the transmission of control signals can be achieved to ensure the normal operation of the screen panel.

[0040] In the embodiments of the present application, in the area without a screen, the second signaling wiring layer 405 is mainly arranged in the wiring area 39, and transmits the signals to the wiring layers in the wiring area 39. The second signaling wiring layer 405 is electrically connected to the first signaling wiring layer 404, for example, electrically connected through through holes.

[0041] Furthermore, as shown in FIG. 2A, the second planarization layer 172 is disposed in the screen area and extends to the non-screen area. In addition, the second planarization layer 172 includes a barrier 63 disposed between the first groove and the screen area, and an organic isolation portion 1721 disposed on the side of the barrier 63 away from the screen area.

[0042] In addition, a second groove 65 is arranged between the screen area and the organic insulation portion 1721, and Petition 870250088005, dated 09 / 29 / 2025, page 25 / 58 14 / 22 a first wiring hole K1 is arranged between the organic insulation portion 1721 and the first slot. In the embodiments of the present application, the first wiring hole K1 is arranged in the wiring area 39, so as to achieve the electrical connection between different signal lines.

[0043] In the embodiments of the present application, the light-emitting layer 174 is disposed in the screen area and on a surface of the second planarization layer 172 away from the substrate. Furthermore, forming a pixel definition layer 175 corresponding to forming the light-emitting layer 174.

[0044] Furthermore, the encapsulation layer 202 is arranged on a surface of the light-emitting layer 174 away from the substrate, the encapsulation layer 202 is arranged in the screen area and extends to the non-screen area. Since a plurality of barriers 63 are formed in the non-screen area, the barriers 63 can further increase the contact area between the encapsulation layer 202 and other film layers, thus increasing the encapsulation effect. In the embodiments of the present application, the area corresponding to the barrier 63 is in an effective encapsulation area 38 of the screen panel. In the effective encapsulation area 38, the encapsulation layer 202 can achieve an improved sealing effect on the screen panel and ensure the performance of the screen panel.

[0045] In the embodiments of the present application, the encapsulation layer 202 covers at least part of the organic insulation portion 1721, and the encapsulation layer 202 does not extend to the first wiring hole K1. Furthermore, the encapsulation layer 202 covers the second groove 65, and the encapsulation layer 202 comes into direct contact with and seals a surface of the inorganic insulation layer 200 away from the substrate 119 in the region of the second groove 65. The thickness of a portion of the encapsulation layer 202 located in the second groove 65 is greater than the thickness of a portion of the encapsulation layer Petition 870250088005, dated 09 / 29 / 2025, page 26 / 58 15 / 22 202 located in the organic isolation portion 1721.

[0046] The encapsulation layer 202 having different thicknesses in different positions can be formed through a plurality of engraving processes. In the following embodiments, the encapsulation layer formed through two engraving processes is taken as an example for illustrative purposes. In the first engraving process, the engraving depth for the encapsulation layer is greater than the engraving depth for the encapsulation layer in the second engraving process. In the embodiments of the present application, when engraving the encapsulation layer 202, the two engraving processes described above are performed on the encapsulation layer 202 in the second groove 65 on one side of the barrier 63 away from the screen area, the amounts of engraving corresponding to the two engraving processes are different (the engraving depth in the second engraving process is less).Under different engraving amounts, both the roughness of the formed film layer and the engraved tilt angle vary. By controlling the engraving amount, the roughness of the film layer after engraving can be improved, and the flatness of the engraved surface and the overall performance of the screen panel can be ensured.

[0047] As shown in FIG. 2B, FIG. 2B is a schematic diagram of a film layer structure of another screen panel provided in embodiments of the present application. In combination with the structures shown in FIGS. 1-2A, in embodiments of the present application, since the second planar layer 172 is directly disposed over other film layers, the second planar layer 172 is provided with a certain height. Furthermore, the organic insulation portion 1721 includes a first lateral surface 2011 close to the screen area and a top surface 2012 away from the matrix substrate. In embodiments of the present application, the first Petition 870250088005, dated 09 / 29 / 2025, page 27 / 58 16 / 22 lateral surface 2011 is a curved surface with a given curvature. Furthermore, the top surface 2012 is a horizontal plane or a surface with other structures, and the cross-sectional shape of the surface is shown in FIG. 2B.

[0048] In the embodiments of the present application, the encapsulation layer 202 has different thicknesses at different positions between the screen area and the non-screen area. The encapsulation layer 202 with different thicknesses is formed through an engraving process. In the embodiments of the present application, the film thickness of the encapsulation layer 202 in the second groove on the side near the screen area is greater than the film thickness of the encapsulation layer 202 on the upper surface 2012 of the organic insulation portion 1721, i.e., the thickness of the encapsulation layer 202 on the side near the screen area is greater. Therefore, it is possible to ensure the encapsulation effect of the encapsulation layer 202 in the film layer in the screen area of ​​the screen panel, and it is possible to effectively prevent the entry of external air and other substances into the screen panel.

[0049] As shown in FIG. 2B, the encapsulation layer 202 includes a first encapsulation portion 2021 and a second encapsulation portion 2022. The first encapsulation portion 2021 is located on the side near the screen area, and the second encapsulation portion 2022 is connected to the first encapsulation portion 2021 and covers at least a portion of the organic insulation portion 1721. The second encapsulation portion 2022 is located on the side away from the screen area.

[0050] In the embodiments of the present application, the thickness of the first encapsulation portion 2021 is greater than or equal to the thickness of the second encapsulation portion 2022. Furthermore, the width of the encapsulation area of ​​the first portion of Petition 870250088005, dated 09 / 29 / 2025, page 28 / 58 The 17 / 22 encapsulation 2021 is larger than the width of the encapsulation area of ​​the second encapsulation portion 2022, thus ensuring the encapsulation effect of the encapsulation layer.

[0051] In addition, an engraving groove 277 is also provided between the first encapsulation portion 2021 and the second encapsulation portion 2022. The engraving groove 277 is disposed above the organic insulation portion 1721. The first encapsulation portion 2021 is connected to the second encapsulation portion 2022 through the engraving groove 277. That is, the region where the engraving groove 277 is located is a transition region between the first encapsulation portion 2021 and the second encapsulation portion 2022. In the embodiments of the present application, by providing the engraving groove 277, the height difference between the first encapsulation portion 2021 and the second encapsulation portion 2022 can be effectively reduced, thus effectively reducing the corresponding tilt angle and improving the engraving effect, and making the engraved surface smoother to prevent metallic residue during the engraving processes.

[0052] Specifically, in the engraving groove 277, the thickness of a portion of the encapsulation layer on one side of the first engraved surface 278 near the screen area is greater than the thickness of a portion of the encapsulation layer on one side of the first engraved surface 278 away from the screen area.

[0053] Furthermore, in the embodiments of the present application, the engraving depth of the engraving groove 277 is greater than or equal to the thickness of the second encapsulation portion 2022, the second encapsulation portion 2022 being the encapsulation layer located outside the engraving groove 277. From the edge of the screen area towards the opposite side of the screen area, the thickness of the second encapsulation portion 2022 gradually decreases, thus allowing the second portion of Petition 870250088005, dated 09 / 29 / 2025, page 29 / 58 18 / 22 encapsulation 2022 forms a smooth transition, so as to effectively reduce the thickness of the screen panel film layer.

[0054] Furthermore, in embodiments of the present application, the height of the first encapsulation portion 2021 is greater than the height of the second planarization layer 172, and a certain difference is formed between the first encapsulation portion 2021 and the second planarization layer 172, which can effectively prevent the entry of external water vapor into the film layers of the screen panel, thus improving the encapsulation effect of the screen panel. In embodiments of the present application, the edge of the second encapsulation portion 2022 on a side away from the screen area is arranged at least on the first side surface 2011 or on the top surface 2012. This can raise the height of the edge of the second encapsulation portion, thus effectively improving the sealing effect.

[0055] In the embodiments of the present application, with respect to the upper surface of the first encapsulation portion 2021, the engraving depth of the engraving groove 277 is D1, and with respect to the edge of the second encapsulation portion 2022, the engraving depth of the engraving groove 277 is D2. The value of the engraving depth D1 is greater than the value of the engraving depth D2. Preferably, the engraving depth D1 > 1 pm, and the total engraving depth of the engraving depth D1 and the engraving depth D2 is less than 2.4 pm. Alternatively, the total engraving depth of the engraving depth D1 and the engraving depth D2 is 2 pm, which can ensure that the encapsulation layer after engraving has a smaller inclination angle, effectively reducing the height difference between the first encapsulation portion 2021 and the second encapsulation portion 2022, and avoiding metallic residues during the engraving processes. Petition 870250088005, dated 09 / 29 / 2025, page 30 / 58 19 / 22

[0056] Furthermore, in the embodiments of the present application, a first angle α1 between the upper surface 2012 and a substrate on one side of the upper surface 2012 away from the screen area is less than 90 degrees. Additionally, a second angle α2 between the first engraved surface 278 and a substrate on one side of the first engraved surface 278 close to the screen area is less than 90 degrees. By setting the first angle α1 above and the second angle α2 above, the sealing effect can be guaranteed.

[0057] In the embodiments of the present application, the second angle α2 is less than or equal to 60°. Alternatively, the angle α can be defined as 50°, 40° and 30°. Through the engraving groove 277, the inclination of the encapsulation layer can be effectively reduced, thus avoiding metallic residues during the engraving processes.

[0058] In the embodiments of the present application, the number of the first wiring holes K1 is plural, and a plurality of wiring holes 220 are spaced and arranged in the edge area near the screen panel. Wiring hole 220 penetrates the second planarization layer 172.

[0059] Furthermore, the orthographic projection of the second encapsulation portion 2022 onto the substrate overlaps the orthographic projection of the second signaling wire layer 405 onto the substrate. In wiring area 39, the second signaling wire layer 405 is electrically connected to the first signaling wire layer 404 through through holes, and the organic insulation portion 1721 covers at least part of the second signaling wire 405.

[0060] Furthermore, in the embodiments of the present application, the surface roughness of the upper surface 2012 of the organic insulation portion 1721 between the encapsulation layer 202 and the first wiring hole K1 is greater than the surface roughness of the upper surface of the organic insulation portion 1721 covered by the encapsulation layer 202. Petition 870250088005, dated 09 / 29 / 2025, page 31 / 58 20 / 22

[0061] Furthermore, the encapsulation layer 202 covers the second groove 65 and comes into direct contact and bonds directly to a surface of the inorganic insulation layer 200 in the second groove 65 away from the substrate, effectively encapsulating the film layers in the screen area and blocking the entry of external water vapor, etc., into the screen panel.

[0062] Optionally, as shown in FIG. 2B, in the embodiments of the present application, the organic insulation layer 17 includes a first planarization layer 171 and a second planarization layer 172. In addition, the organic insulation layer 17 is also provided with an organic insulation sublayer and a second organic insulation sublayer on a side away from the screen area.

[0063] Specifically, the first organic insulation sublayer is arranged on a surface of the inorganic insulation layer 200 away from the substrate. The first organic insulation sublayer includes a first organic insulation subportion 411 arranged on the side of the second groove away from the screen area, and the first organic insulation subportion fills the first groove. The second organic insulation sublayer is arranged on a surface of the first organic insulation sublayer away from the substrate. The second organic insulation sublayer includes a second organic insulation subportion arranged on the side of the second groove away from the screen area, and the second organic insulation subportion is arranged on a surface of the first organic insulation subportion away from the substrate.

[0064] Furthermore, the first wiring hole K1 penetrates the second organic insulation subportion 412 and exposes the second signaling wire 405.

[0065] Alternatively, the first wiring hole K1 penetrates through both the first organic insulation sub-portion 411 and the second organic insulation sub-portion. Petition 870250088005, dated 09 / 29 / 2025, page 32 / 58 21 / 22 412, and directly exposes the first signaling wire 404. The film layer structure on the right side of the first wiring hole K1 shown in FIG. 2B is only a partial film layer structure.

[0066] Correspondingly, as shown in FIG. 2A, the organic insulation portion 1721 includes a first organic insulation sublayer and a second organic insulation sublayer. The first organic insulation subportion includes a first lateral subsurface adjacent to the screen area, and the second organic insulation subportion includes a second lateral subsurface adjacent to the screen area. The first etched surface 278 of the encapsulation layer corresponds to the first lateral subsurface or the second lateral subsurface. For example, the first etched surface 278 of the encapsulation layer corresponds to the first lateral surface 2011.

[0067] As shown in FIG. 3, FIG. 3 is a schematic diagram of a film layer structure of another screen panel provided in the embodiments of this application. In the embodiments of this application, in addition to the structure shown in FIG. 1, the screen panel additionally includes a touch layer 66. The touch layer 66 includes an insulation sublayer 667, an organic sublayer 668, and a metallic touch sublayer 666. The insulation sublayer 667 is disposed over a surface of the encapsulation layer 202 away from the substrate, the organic sublayer 668 is disposed over the insulation sublayer 667, and the insulation sublayer covers the screen area and extends to the non-screen area. The boundary of the insulation sublayer 667 in the non-screen area does not exceed the first etched surface 278.Furthermore, the metallic touch sublayer 666 is located within the organic sublayer 668, and the metallic touch sublayer 666 is located within the screen area and extends into the non-screen area, while the metallic touch sublayer includes a wire. Petition 870250088005, dated 09 / 29 / 2025, p. 33 / 58 22 / 22 touch. The touch wire passes through the first engraved surface 278 along the screen area towards the non-screen area and extends to the first wiring hole K1, and is electrically connected to the second signaling wire layer 405 to achieve the transmission of touch signals on the screen panel.

[0068] In addition, the embodiments of the present application further provide a screen device including the screen panel according to the embodiments of the present application, wherein the encapsulation layer in the screen panel is structured according to the embodiments of the present application. By defining the groove engraved on the side or top surface of the organic insulation portion, the engraving effect of the encapsulation layer can be effectively improved during the screen panel preparation process, and the surface roughness after engraving can be improved, increasing the reliability and overall performance of the screen panel.

[0069] In the embodiments of the present application, the flexible screen device may be any product or component having a screen function or touch operation function, such as a foldable mobile phone, computer, electronic paper, display, etc. The specific type is not specifically limited.

[0070] In summary, the foregoing describes a screen panel 100 and a screen device provided in the embodiments of the present invention in detail. Specific examples are used to explain the principles and embodiments of the present application. The above embodiments are used only to help understand the technical solutions and main ideas of the present application. Although the present invention discloses the above preferred embodiments, the above preferred embodiments are not intended to limit the present application. Changes and modifications made by those skilled in the art shall be included within the scope of protection of the present application as defined by the claims. Petition 870250088005, dated 09 / 29 / 2025, page 34 / 58

Claims

1 / 5 CLAIMS:

1. A screen panel comprising a screen area and a non-screen area disposed on one side of the screen area, characterized in that the screen panel comprises: a substrate; an inorganic insulation layer disposed on a surface of the substrate, the inorganic insulation layer comprising a first groove disposed in the non-screen area; an organic insulation layer disposed on a surface of the inorganic insulation layer away from the substrate, the organic insulation layer comprising a barrier disposed between the first groove and the screen area, an organic insulation portion disposed on one side of the barrier away from the screen area, a second groove disposed between the barrier and the organic insulation portion, and a first wiring hole disposed between the organic insulation portion and the first groove;a light-emitting layer arranged on a surface of the organic insulation layer away from the substrate and correspondingly arranged in the screen area; an encapsulation layer arranged on a surface of the light-emitting layer away from the substrate, the encapsulation layer being arranged in the screen area and extending to the non-screen area, the encapsulation layer covering at least part of the organic insulation portion and not extending to the first wiring hole, a thickness of the encapsulation layer corresponding to the second groove being greater than a thickness of the encapsulation layer corresponding to the organic insulation portion.

2. Screen panel, according to claim 1, characterized in that the organic insulation portion comprises a first lateral surface close to the screen area and an upper surface away from the substrate, the first lateral surface being connected to the upper surface; the thickness of the encapsulation layer corresponding to the second groove is greater than the thickness of the encapsulation layer corresponding to the upper surface.

3. Screen panel, according to claim 2, characterized in that the encapsulation layer comprises a first engraved surface arranged corresponding to the first lateral surface, the thickness of a portion of the encapsulation layer located on one side of the first engraved surface close to the screen area being greater than the thickness of a portion of the encapsulation layer located on one side of the first engraved surface away from the screen area.

4. Screen panel, according to claim 3, characterized in that a first angle between the upper surface and a substrate on one side of the upper surface away from the screen area is less than 90 degrees; a second angle between the first engraved surface and a substrate on one side of the first engraved surface near the screen area is less than 90 degrees.

5. Screen panel, according to claim 3, characterized in that it further comprises: a touch layer disposed on a surface of the encapsulation layer away from the substrate, wherein the touch layer comprises: an insulation sublayer disposed on a surface of the encapsulation layer away from the substrate, the insulation sublayer covering the screen area and extending into the non-screen area, a boundary of the insulation sublayer in the non-screen area not exceeding the first etched surface; a metallic touch sublayer disposed on a surface of the insulation sublayer away from the substrate, the metallic touch sublayer comprising a touch conductor wire disposed from the screen area to the non-screen area, and a passage through the first etched surface and extending into the first wiring hole.

6. Screen panel, according to claim 3, characterized in that the organic insulation layer comprises: a first organic insulation sublayer disposed on a surface of the inorganic insulation layer away from the substrate, the first organic insulation sublayer comprising a first organic insulation subportion disposed in the second groove away from the screen area, the first organic insulation subportion filling the first groove; a second organic insulation sublayer disposed on a surface of the first organic insulation sublayer away from the substrate, the second organic insulation sublayer comprising a second organic insulation subportion disposed in the second groove away from the screen area, the second organic insulation subportion disposed on a surface of the first organic insulation subportion away from the substrate;where the first wiring hole penetrates through the second organic insulation sub-portion; or, the first wiring hole penetrates through both the second organic insulation sub-portion and the first organic insulation sub-portion.

7. Screen panel, according to claim 6, characterized in that the first organic insulation subportion comprises a first lateral subsurface on a side adjacent to the screen area; the second organic insulation subportion comprises a second lateral subsurface on a side adjacent to the screen area; the first engraved surface is arranged corresponding to the first lateral subsurface or the second lateral subsurface. Petition 870250088005, dated 09 / 29 / 2025, pp. 48 / 58 4 / 5 8. Screen panel, according to claim 2, characterized in that the surface roughness of the upper surface between the encapsulation layer and the first wiring hole is greater than the surface roughness on the upper surface covered by the encapsulation layer.

9. Screen panel, according to claim 1, characterized in that the encapsulation layer covers the second groove and comes into direct contact with a surface of the inorganic insulation layer away from the substrate in the second groove.

10. Screen device comprising a screen panel, characterized in that the screen panel comprises a screen area and a non-screen area disposed on one side of the screen area, wherein the screen panel comprises: a substrate; an inorganic insulation layer disposed on a surface of the substrate, the inorganic insulation layer comprising a first groove disposed in the non-screen area; an organic insulation layer disposed on a surface of the inorganic insulation layer away from the substrate, the organic insulation layer comprising a barrier disposed between the first groove and the screen area, an organic insulation portion disposed on one side of the barrier away from the screen area, a second groove disposed between the barrier and the organic insulation portion, and a first wiring hole disposed between the organic insulation portion and the first groove;a light-emitting layer disposed on a surface of the organic insulation layer away from the substrate and correspondingly disposed in the screen area; an encapsulation layer disposed on a surface of the light-emitting layer away from the substrate, the encapsulation layer being disposed in the screen area and extending Petition 870250088005, dated 09 / 29 / 2025, page 49 / 58 5 / 5 to the area without screen, the encapsulation layer covering at least part of the organic insulation portion and not extending to the first wiring hole, a thickness of the encapsulation layer corresponding to the second groove being greater than a thickness of the encapsulation layer corresponding to the organic insulation portion. Petition 870250088005, dated 09 / 29 / 2025, page 50 / 58;

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