Polyamide composition, use of polyamide composition and articles.

BR112025021296A2Pending Publication Date: 2026-09-01
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Application Number
BR112025021296
Authority / Receiving Office
BR · BR
Patent Type
Applications
Publication Date
2026-09-01
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Description

1 / 32 “POLYAMIDE COMPOSITION, USE OF POLYAMIDE COMPOSITION AND ARTICLES” Field of Invention

[001] The present invention relates to a high-voltage resistant polyamide composition and its use as insulating materials that withstand high electrical voltages, particularly as insulating plastic materials in high-voltage transmission and distribution systems. Background of the Invention

[002] High-voltage electricity transmission and distribution require insulating materials in almost all applications, such as circuit breakers, reclosers, and transformers. Insulating materials in such applications must be able to withstand high electrical voltages due to the high applied voltage and therefore need excellent dielectric characteristics. Ceramics and thermosets, such as epoxy resins and silicone rubbers, are commonly used as insulating materials in many applications. However, thermoplastics have rarely been developed as insulating materials in high-voltage transmission and distribution applications, as the high-voltage resistance of thermoplastics is generally insufficient.

[003] Document US6653571B1 describes a high-voltage electrical insulation material comprising a polymeric material and an ester compound with a fluorinated alkyl terminal group as a water-repellent additive. The polymeric material of the insulating material, as described in the patent, includes polyolefins, olefin copolymers, substituted polyolefins, substituted olefin copolymers, particularly ethylene vinyl acetate (EVA) copolymers; linear low-density polyethylene (LLDPE); acrylic rubbers, silicone polymers, epoxy resins, polyurethanes, and polyethers. It is described that the electrical insulation material can be used Petition 870250089865, dated 02 / 10 / 2025, p. 37 / 73 2 / 32 in a wide range of applications in which electrical components are exposed to voltages above 1 kV.

[004] In addition to insufficient high voltage resistance, the application of some thermoplastics as insulating materials can be hampered by other properties. For example, polyamides, a versatile engineering thermoplastic, have not been well developed for high voltage insulation applications due to their inherent moisture absorption property.

[005] Document US20180033519A1 describes a thermoplastic composite for insulation and / or encapsulation of electrical components, which includes a polymer matrix and a filler with micro and / or nano size scale. The polymer matrix can be polyamide, polyimide, fluoropolymer, polyester, polyolefin, polystyrene, cyclic olefin copolymer and mixtures thereof. The filler is in the form of microparticle, microtube, microchip, microfiber, nanoparticle, nanotube, nanochip, nanofiber and mixtures thereof. There is no mention of high tensile strength of any thermoplastic composite in such patent application. In particular, polyamide is mentioned as an option for the polymer matrix in the patent application, but no application and performance tests of this material are described.

[006] Developing polyamide thermoplastic materials with desirable high-voltage insulation performance is a major challenge. Brief Description of the Invention

[007] The objective of the present invention is to provide a polyamide composition useful as an insulating material in high voltage applications, which is resistant to high voltage and preferably exhibits excellent strength, color stability and / or reduced moisture absorption.

[008] The inventors surprisingly discovered that the objective can be achieved by a polyamide composition that Petition 870250089865, dated 02 / 10 / 2025, p. 38 / 73 3 / 32 comprises a long-chain polyamide and a lamellar filler with a high diameter-to-thickness ratio (D / E ratio).

[009] Thus, in the first aspect, the present invention provides a polyamide composition comprising; (A) 40% to 80% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms; and (B) 20% to 60% by weight of a filler in lamellar form with a diameter-to-thickness (D / E) ratio of at least 70, based on the total weight of the polyamide composition.

[010] In the second aspect, the present invention relates to the use of the polyamide composition as described in the present invention as insulating materials in high voltage transmission and distribution systems, particularly in circuit breakers, reclosers and transformers.

[011] In the third aspect, the present invention relates to articles produced using the polyamide composition as described in this invention, particularly articles in high voltage transmission and distribution systems, such as circuit breakers, reclosers and transformers. Detailed Description of the Invention

[012] The present invention will be described in detail below. It should be understood that the present invention can be carried out in many different ways and should not be interpreted as limited to the exemplary embodiments presented herein.

[013] The singular forms “um / uma” and “o / a” include plural referents, unless the context clearly indicates otherwise. The terms “compreender”, “compreendendo”, etc. are used interchangeably with “conter”, “contendo”, etc. and should be interpreted in an open and non-restrictive manner. That is, for example, other components or elements may Petition 870250089865, dated 02 / 10 / 2025, page 39 / 73 4 / 32 to be present. The expressions “consists of” or “consisting of” or cognates may be included within the terms “comprises”, “comprising” or cognates.

[014] Different aspects of the invention are defined in more detail. Each aspect thus defined can be combined with any other aspect or aspects, unless clearly indicated otherwise. In particular, any feature indicated as preferred can be combined with any other feature or features described generally or indicated as preferred.

[015] Here, any reference to “some exemplary embodiments” means that a specific component, quantity, composition, or feature described in connection with the exemplary embodiments is included in some exemplary embodiments of the present invention. Thus, the appearance of the phrase “in some exemplary embodiments” or similar phrases in various places throughout the description does not necessarily refer to the same exemplary embodiments, but may refer to them. Furthermore, the component, quantity, composition, or feature may be combined in any suitable manner, as would be evident to a person skilled in the art from disclosure in more exemplary embodiments.

[016] In the description of the present invention, the terms “high voltage” and “high voltage” refer to alternating current (AC) voltages of 1 kV or more, particularly 1.5 kV or more, more particularly 2.0 kV or more.

[017] Here, the term “diameter-thickness ratio” refers to a value according to the following equation, D / E = 3π x (Da / Ds)2 / 2 where Da is the particle diameter (D50) determined based on Petition 870250089865, dated 02 / 10 / 2025, page 40 / 73 5 / 32 static laser light diffraction method, according to standard GB / T 19077-2016; and Ds is the particle diameter (D50) determined based on the gravitational liquid sedimentation method, according to ISO 133173:2001.

[018] The determination of the “diameter-thickness ratio” is known and described, for example, in Daniel Gantenbein et al., “Determining the size distribution-defined aspect ratio of platy particles” Applied Clay Science 53 (2011), pages 544 to 552. Here, the term “D / E ratio” is also used as an abbreviation for the diameter-thickness ratio.

[019] As used in the present invention, the term “structural unit(s)”, also referred to as “monomeric unit(s)”, refers to the minimum molecular residue(s) resulting from the respective monomeric molecules after polymerization. For example, PA6 has one type of structural unit of -NH(CH2)5CO-, PA66 has two types of structural units, namely -NH(CH2)6NH- and -CO(CH2)4CO-, and so on.

[020] As used in the present invention, the term “repeating unit(s)” refers to the minimum unit(s) with the same chemical composition in a polymer. The repeating units may consist of one or more types of structural units. For example, PA6 has repeating units that are the same as the structural units, namely NH(CH2)5CO-; PA66 has repeating units of NH(CH2)6NHCO(CH2)4CO-, which consist of two types of structural units, namely -NH(CH2)6NH- of the diamine monomer and CO(CH2)4CO- of the dicarboxylic acid monomer. "Polyamide Composition"

[021] In the first aspect, the present invention provides a polyamide composition comprising; Petition 870250089865, dated 02 / 10 / 2025, page 41 / 73 6 / 32 (A) 40% to 80% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms; and (B) 20% to 60% by weight of a filler in lamellar form with a diameter-to-thickness (D / E) ratio of at least 70, based on the total weight of the polyamide composition. (A) POLYAMIDE

[022] Polyamide, as widely known in the state of the art, is a polymer containing repeating amide groups (-CONH-) along the polymer backbone. In general, a polyamide is composed of many identical repeating units connected by covalent bonds. The repeating units of a polyamide are known to be typically derived from one or more monomers selected from lactams, amino acids, a combination of dicarboxylic acid and diamine, and a combination of dicarboxylic acid chloride and diamine.

[023] Polyamides suitable as component (A) in the polyamide composition according to the present invention may have repeating units of formula (I): The 4NH-R1-C-]-(I), in which R1 is an unsubstituted or substituted linear chain C7-24 alkylene, preferably a C8-20 alkylene, more preferably a C9-16 alkylene.

[024] The straight-chain C7-24 alkylene, C8-20 alkylene or C9-16 alkylene indicated for R1 in formula (I) may be unsubstituted or substituted with C1-8 alkyl, especially C1-6 alkyl.

[025] Polyamide with repeating units of formula (I) is Petition 870250089865, dated 02 / 10 / 2025, p. 42 / 73 7 / 32 typically derived from at least one aliphatic monomer selected from lactams, amino acids, or any combination thereof. Suitable lactams preferably have 8 to 25 carbon atoms, more preferably 9 to 21 carbon atoms, particularly 10 to 17 carbon atoms. Examples of lactams may include, but are not limited to, caprylolactam (2-azacyclononanone), caprinolactam (azacycloundecan-2-one), laurolactam (2-azacyclotridecanone), or any combination thereof. Suitable amino acids preferably have 8 to 25 carbon atoms, more preferably 9 to 21 carbon atoms, particularly 10 to 17. Examples of amino acids may include, but are not limited to, 8-aminocaprylic acid, 10-aminodecanoic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, or any combinations thereof.

[026] Alternatively, suitable polyamides as component (A) in the polyamide composition according to the present invention may have repeating units of formula (II): [2O 3 OI +nh-r2-nh—c—r3-c-|- (ii) in which R2 is a linear chain C4-24 alkylene, unsubstituted or substituted, preferably C4-20 alkylene, more preferably C4-16 alkylene, R3 is an aliphatic or aromatic C4-30 hydrocarbylene, preferably a C6-20 hydrocarbylene, more preferably a C6-16 hydrocarbylene, provided that at least one of the -NH-R2-NH- portions and the —C-R3-C— portion has at least 8 carbon atoms.

[027] C4-24 alkylene, C4-20 alkylene or C4-16 alkylene of Petition 870250089865, dated 02 / 10 / 2025, p. 43 / 73 The 8 / 32 linear chain indicated for R2 in formula (II) may be unsubstituted or substituted with C1-8 alkyl, particularly C1-6 alkyl.

[028] The C4-30 hydrocarbylene, C6-20 hydrocarbylene or C6-16 hydrocarbylene indicated for R3 in formula (II) may be an unsubstituted or substituted alkylene, cycloalkylene or arylene. Preferably, R3 is a C6-20 alkylene, C6-20 cycloalkylene or C6-20 arylene group, more preferably a C6-16 alkylene, C6-16 cycloalkylene or C6-16 arylene group.

[029] Polyamide with repeating units of formula (II) is typically derived from an aliphatic or aromatic dicarboxylic acid or dicarboxylic acid chloride with 6 to 32 carbon atoms and an aliphatic diamine with 4 to 24 carbon atoms, provided that at least one diamine and dicarboxylic acid or dicarboxylic acid chloride has at least 8 carbon atoms.

[030] Aliphatic diamines can be linear or branched chain. Examples of aliphatic diamines may include, but are not limited to, 1,5-hexanediamine, 1,6-hexanediamine, 1,7-heptanediamine, 1,8octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11undecandiamine, 1,12-dodecanediamine, 1,13-tridecanediamine, 1,14tetradecanediamine, 1,16-hexadecanediamine, 1,18-octadecanediamine, 1,20eicosandiamine, 1,22-docosanediamine, 2,3-dimethylheptane-1,7-diamine, 2,4dimethylheptane-1,7-diamine, 2,5-dimethylheptane-1,7-diamine, 2,2dimethylheptane-1,7-diamine, 2-methyloctane-1,8-diamine, 1,3-dimethyloctane-1,8-diamine, 1,4-dimethyloctane-1,8-diamine, 2,4-dimethyloctane-1,8-diamine, 3,4-dimethyloctane-1,8-diamine, 4,5-dimethyloctane-1,8-diamine, 2,2-dimethyloctane-1,8-diamine, 3,3-dimethyloctane-1,8-diamine, 4,4-dimethyloctane-1,8-diamine, 5-methylnonane-1,9-diamine, and any combinations thereof.

[031] Examples of dicarboxylic acids may include, but are not limited to, adipic acid, pimelic acid, suberic acid, acid Petition 870250089865, dated 02 / 10 / 2025, page 44 / 73 9 / 32 nonanoic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, octadecanedioic acid, terephthalic acid, isophthalic acid and any combinations thereof.

[032] Examples of dicarboxylic acid chlorides may include, but are not limited to, adipoyl dichloride, heptanedioyl dichloride, octanoyl chloride, azelaoyl dichloride, sebacoyl dichloride, undecanedioyl dichloride, lauroyl dichloride, tridecanedioyl dichloride, tetradecanedioyl dichloride, pentadecanedioyl dichloride, hexadecanedioyl dichloride, octadecanedioyl dichloride, terephthaloyl chloride, isophthaloyl acid and any combinations thereof.

[033] For example, the polyamide as component (A) may be selected from the group consisting of PA11, PA12, PA510, PA610, PA612, PA1010, PA1012, PA1212, PA9T, PA10T, PA11T, PA12T or any combinations of these polyamides.

[034] The polyamides useful in the present invention may also be a mixture of polyamides, as described above, or a copolymerized polyamide (copolyamide). There is no limitation as to the type of copolyamide, which may be, for example, a block copolymer, a random copolymer, a graft copolymer or an alternating copolymer, for example, PA10T / 610, PA5T / 510, PA10T / 1010, PA9T / 612, PA9T / 1010 or any combination thereof.

[035] In some embodiments of the present invention, the polyamide with repeating units of formula (II) is particularly useful as a component (A) in the polyamide composition, among which PA1212, PA610 and PA9T are most preferable.

[036] Polyamide as a component (A) in the polyamide composition according to the present invention may have any weights Petition 870250089865, dated 02 / 10 / 2025, p. 45 / 73 10 / 32 suitable molecular weights, without limitation. The relative viscosity of the polyamide is in the range of 1.8 to 4.0, measured in 96% by weight sulfuric acid at 25 °C.

[037] The polyamides as component (A) in the polyamide composition according to the present invention may have any suitable melting temperatures, without limitation. For example, the melting temperature is in the range of 150 to 350 °C, as measured by differential scanning calorimetry (DSC).

[038] Component (A) may be present in the polyamide composition according to the present invention in an amount of 40% to 80% by weight, for example, 45% to 70% by weight or 50% to 65% by weight, based on the total weight of the polyamide composition.

[039] The polyamide disclosed in the present invention should not be limited to those prepared from virgin crude oil monomers, and may be wholly or at least partially of biological origin or derived from waste stream or recycling activities, i.e., the polyamide used in the present invention may be based on renewable materials, secondary raw materials or recycled raw materials. For example, PA610, PA1212, PA9T, PA10T and PA11T, useful as component (A) in the present invention, may be prepared, obtained or derived from monomers obtained in remonomerization processes. (B) Lamellar Load

[040] The polyamide composition according to the present invention comprises as component (B) a lamellar-shaped filler (also referred to in the present invention as “lamellar filler”) having a diameter-to-thickness ratio of at least 70, preferably at least 100.

[041] There is no specific restriction regarding the upper limit of Petition 870250089865, dated 02 / 10 / 2025, page 46 / 73 11 / 32 diameter-to-thickness ratio. The lamellar filler may have a diameter-to-thickness ratio not exceeding 250, for example, not exceeding 200 or not exceeding 150. The lamellar filler may have a diameter-to-thickness ratio in the range of 70 to 250, or 70 to 200, or 70 to 150, preferably in the range of 100 to 250, or 100 to 200, or 100 to 150.

[042] The lamellar charge may have a particle size D50 in the range of 1 to 30 micrometers ^m), more preferably in the range of 3 to 20 μm, as measured using a laser diffraction particle size distribution analyzer.

[043] The layered filler may consist of microplates or nanoplates, preferably microplates. Useful materials as layered filler may be organic, such as polymeric materials that do not melt during the processing of the polyamide composition (such as mixing and molding), or inorganic, such as synthetic refractory compounds or natural minerals. Preferably, the layered filler is inorganic. Examples of useful materials as inorganic layered filler may include, but are not limited to, boron nitride, kaolin, chalk, talc, calcium carbonate, silicates, graphite, mica, vermiculite, montmorillonite, and glass.

[044] The lamellar filler may be present in the polyamide composition according to the present invention in an amount of 20% to 60% by weight, preferably 25% to 55% by weight, more preferably 25% to 50% by weight, based on the total weight of the polyamide composition.

[045] In particular, the lamellar filler may be present in the polyamide composition according to the present invention in an amount of 20% to 60% by weight, preferably 30% to 55% by weight, more preferably 35% to 50% by weight when the polyamide composition comprises at least one additional filler in an amount Petition 870250089865, dated 02 / 10 / 2025, p. 47 / 73 12 / 32 not exceeding 5% by weight, based on the total weight of the polyamide composition. (C) Additional Charge

[046] Optionally, the polyamide composition according to the present invention may comprise an additional filler, i.e., a filler other than component (B) (i.e., other than the lamellar-shaped filler with a diameter-to-thickness ratio of at least 70).

[047] The additional filler can be of various types, without specific restrictions, such as fibers, yarns, platelets and particles. The additional filler can be selected, in particular, from fibrous fillers and particulate fillers.

[048] Examples of fibrous fillers may include, among others, metallic fibers such as brass fibers, stainless steel fibers, steel fibers, metallized inorganic fibers, metallized synthetic fibers, glass fibers, carbon fibers, boron fibers, asbestos fibers, ceramic fibers, mineral fibers, basalt fibers, kenaf fibers, jute fibers, bamboo fibers, flax fibers, hemp fibers, bagasse fibers, cellulosic fibers, sisal fibers and coconut fibers. Preferably, fibrous fillers may be selected from metallized synthetic fibers, glass fibers, carbon fibers, ceramic fibers, mineral fibers, basalt fibers, kenaf fibers and jute fibers, among which glass fibers and carbon fibers are most preferable.

[049] There is no particular restriction on the length of the fiber and the diameter of the fibrous filler. For example, staple fibers having a length in the range of 1 to 10 mm, preferably 2 to 6 mm, or continuous fibers may be used as starting material for the reinforcing agent. The fibers will be broken down during processing, for example, by kneading the polyamide composition, to a length of a few hundred mm. Petition 870250089865, dated 02 / 10 / 2025, page 48 / 73 13 / 32 microns, as present in the obtained impressions. The fiber diameter is generally in the range of 3 to 20 μm, preferably 7 to 13 μm. The fibrous filler may have a cross-section with an aspect ratio in the range of 1:1 to 5:1.

[050] Glass fibers are particularly useful as an additional filler in the polyamide composition according to the present invention. The glass fibers may have been surface-treated with a silane coupling agent, such as vinylsilane-based coupling agents, silane-acrylic-based coupling agents, epoxysilane-based coupling agents, and aminosilane-based coupling agents; aminosilane-based coupling agents are preferred. The silane coupling agent may be dispersed in a surface treatment agent (sizing agent). Examples of sizing agents are acrylic compounds, compounds modified with acrylic / maleic derivatives, epoxy compounds, urethane compounds, compounds modified with urethane / maleic derivatives, and urethane / amine-modified compounds.

[051] Particulate fillers can be organic or inorganic and have a variety of particle sizes, ranging from powder-like particles to coarse particles. Examples of materials that can be used as inorganic particulate fillers include, but are not limited to, kaolin, chalk, wollastonite, talc, calcium carbonate, silicates, titanium dioxide, zinc oxide, graphite, mica, vermiculite, montmorillonite, and glass particles (e.g., glass beads).

[052] In some embodiments, the additional filler as component (C) is selected from glass fibers. The glass fibers may be, for example, E-glass fibers, A-glass fibers, D-glass fibers, AR-glass fibers, C-glass fibers and S-glass fibers, or any other high-modulus or high-strength glass fibers, such as M-type glass fibers and fibers of Petition 870250089865, dated 02 / 10 / 2025, page 49 / 73 14 / 32 HMG type glass.

[053] The additional filler, if present, may be in the polyamide composition according to the present invention in an amount not exceeding 20% ​​by weight, not exceeding 15%, not exceeding 10% or not exceeding 5%.

[054] In some embodiments, the additional filler may be present in an amount of, for example, 5% to 20% by weight, more preferably 5% to 15% by weight, based on the total weight of the polyamide composition.

[055] Thus, in some embodiments, the present invention provides a polyamide composition comprising; (A) 40% to 80% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms; (B) 20% to 60% by weight of a filler in lamellar form with a diameter-to-thickness ratio of at least 70, and (C) 0% to 20% by weight of a filler other than the filler in lamellar form with a diameter-to-thickness ratio of at least 70, based on the total weight of the polyamide composition.

[056] It is understood that the sum of the lamellar filler as component (B) and the additional filler as component (C) shall not exceed 60% by weight, based on the total weight of the polyamide composition. Preferably, the sum of the lamellar filler as component (B) and the additional filler as component (C) shall not exceed 55% by weight, particularly 50% by weight, based on the total weight of the polyamide composition. (D) Additives

[057] Optionally, the polyamide composition according to the present invention may include at least one additive, for example, Petition 870250089865, dated 02 / 10 / 2025, pp. 50 / 73 15 / 32 UV absorber, light stabilizer based on hindered amine, antioxidant, lubricant, nucleating agent, colorant, release agent, anti-dripping agent, impact modifier, compatibilizing agent, plasticizer, surfactant, flame retardant, flame retardant synergist, coupling agent, antimicrobial agent, antistatic agents and any combinations thereof.

[058] At least one additive, if present, may be in conventional amounts. For example, the polyamide composition may comprise at least one additional additive in a total amount not exceeding 25% by weight, or not higher than 15% by weight, or not exceeding 10% by weight, based on the total weight of the polyamide composition.

[059] In some embodiments, the polyamide composition according to the present invention comprises a UV absorber. There is no specific restriction as to the UV absorber useful for the polyamide composition according to the present invention, which may be selected from any known UV absorbers, for example, hydroxyphenyl benzotriazoles, hydroxyphenyl triazines, benzophenones, cyanoacrylates, benzoxazinones, benzylidene malonates and salicylate esters, and any combinations thereof.Examples of useful commercially available UV absorbers may include, but are not limited to, Tinuvin® 328 (2-(2-hydroxy-3',5'-di-tert-amylphenyl)benzotriazole), Tinuvin® 360 (2,2'-methylene bis[6-(2H-benzotriazol-2-yl)-4-1,1,3,3-tetramethylbutyl)phenol]), Tinuvin® 900 (2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole), Tinuvin® 1577 ED (2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexyloxyphenol), Tinuvin® 1600 (2,4-bis-biphenyl-6-[2-hydroxy-4-(2ethylhexyloxy)phenyl]-1,3,5-triazine), Cyasorb®UV-531 (2-hydroxy-4-octyloxy benzophenone), Cyasorb® UV-1164 (2-(4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl)5-(octyloxy)phenol.

[060] The UV absorber, if present, may be in a Petition 870250089865, dated 02 / 10 / 2025, pp. 51 / 73 16 / 32 quantity of 0.05% to 5% by weight, preferably 0.1% to 2% by weight, based on the total weight of the polyamide composition.

[061] In some embodiments, the polyamide composition according to the present invention comprises a hindered amine-based light stabilizer (HALS). There is no specific restriction on the hindered amine-based light stabilizer useful for the polyamide composition according to the present invention, which may be selected from any known hindered amine light stabilizers, for example, monomeric, oligomeric and polymeric compounds based on 2,2,6,6-tetramethylpiperidine.Examples of useful commercially available UV absorbers may include, but are not limited to, Chimassorb® 944 (poly-{6-[(1,1,3,3-tetramethylbutyl)amino-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl4-piperidyl)imino]-1,6-hexanediyl[(2,2,6,6-tetramethyl-4-piperidyl)imino)}), Chimassorb® 2020 (1,6-hexanediamine, N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-polymer with 2,4,6-trichloro-1,3,5-triazine, reaction products with N-butyl-1-butanamine and N-butyl-2,2,6,6-tetramethyl-4-piperidinamine), Tinuvin®123 (sebacate of bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidinyl)), Tinuvin® 770 (bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate), Tinuvin®292 (bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate), Cyasorb® UV-3529 (1,6-hexanediamine, N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-, polymer with morpholine-2,4,6-trichloro1,3,5-triazine).

[062] The hindered amine-based light stabilizer, if present, may be in an amount of 0.05% to 3% by weight, preferably 0.1% to 1% by weight, based on the total weight of the polyamide composition.

[063] In some embodiments, the polyamide composition according to the present invention comprises an antioxidant. There is no specific restriction as to the antioxidant useful for the composition of Petition 870250089865, dated 02 / 10 / 2025, pp. 52 / 73 17 / 32 polyamide according to the present invention, which may be selected from any known antioxidants, for example, hindered phenolic antioxidants, phosphite antioxidants, phosphonite antioxidants, aromatic amine antioxidants and any combinations thereof.Examples of useful commercially available UV absorbers may include, but are not limited to, Irganox® 1098 (N,N'-(hexane-1,6-diyl)bis[3(3,5-di-tert-butyl-4-hydroxyphenyl)propanamide]), Irganox® 1010 (pentaerythritol tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate)), Irganox® 1726 (2,4-bis[(dodecylthio)methyl]-o-cresol), Irganox® 1035 (2,2-thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]), Irgafos® 168 (tris(2,4-di-tert-butylphenyl)phosphite), Doverphos® S-9228 (bis(2,4-dicumylphenyl)pentaerythritol diphosphite), Doverphos® TNPP (trisnonylphenol phosphite), ULTRANOX® 627 (bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphonite), Doverphos® S-9228PC (bis(2,4-dicumylphenyl)pentaerythritol diphosphite), bis(2,4-dicumylphenyl)pentaerythritol), Hostanox® P-EPQ (tetrakis(2,4-di-tert-butylphenyl)[1,1-biphenyl]4,4'-diyl bisphosphonite).

[064] The antioxidant, if present, may be in an amount of 0.01% to 5% by weight, for example, 0.1% to 2% by weight, based on the total weight of the polyamide composition.

[065] In some embodiments, the polyamide composition according to the present invention comprises a lubricant. There is no specific restriction as to the lubricant useful for the polyamide composition according to the present invention, which may be selected from any known lubricants, for example, long-chain fatty acids and their salts, such as stearic acid or behenic acid and their salts, esters or amides of saturated or unsaturated aliphatic carboxylic acids, such as N,N'-ethylene di(stearamide), glycerol distearate, glycerol tristearate, glycerol monopalmitate, glycerol trilaurate, glycerol monobehenate and pentaerythritol tetrastearate, and waxes, such as natural waxes, waxes Petition 870250089865, dated 02 / 10 / 2025, pp. 53 / 73 18 / 32 montane waxes, paraffin waxes, polyethylene waxes and polypropylene waxes.

[066] The lubricant, if present, may be in an amount of 0.1% to 5% by weight, for example, 0.3% to 3% by weight, based on the total weight of the polyamide composition.

[067] In some embodiments, the polyamide composition according to the present invention comprises a nucleating agent. There is no specific restriction as to the nucleating agent useful for the polyamide composition according to the present invention, which may be selected from any known nucleating agents, for example, talc, boron nitride, mica, kaolin, carbonates, bicarbonates or sulfates of alkali or alkaline earth metals, alkali metal titanates, silicon nitride and molybdenum disulfide.

[068] The nucleating agent, if present, may be in an amount of 0.01% to 5% by weight, preferably 0.01% to 2% by weight, based on the total weight of the polyamide composition. Formulations

[069] It will be understood that any options relating to species and / or quantities, as described in the present invention, generally or preferably for components A), B), C) and D), may be combined in any way, without restrictions. For example, a combination of a general range of the quantity of one component with any preferred ranges of the quantities of other components, or a combination of a preferred range of the quantity of one component with general ranges of the quantities of the other components, and so forth, are included in the present invention.

[070] The following embodiments will be described as examples of polyamide composition formulations according to Petition 870250089865, dated 02 / 10 / 2025, pp. 54 / 73 19 / 32 present invention.

[071] In some embodiments, the polyamide according to the present invention comprises; (A) 40% to 80% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms, (B) 20% to 60% by weight of a filler in lamellar form with a diameter-to-thickness ratio (D / E) of at least 70, (C) 0% to 20% by weight of a filler other than the filler in lamellar form with a diameter-to-thickness ratio of at least 70, and (D) 0% to 25% by weight of an additive, based on the total weight of the polyamide composition. [07 2] In some additional embodiments, the polyamide according to the present invention comprises; (A) 45% to 70% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms, (B) 25% to 55% by weight of a filler in lamellar form with a diameter-to-thickness ratio of at least 70, (C) 0% to 20% by weight of a filler other than the filler in lamellar form with a diameter-to-thickness ratio of at least 70, and (D) 0% to 25% by weight of an additive, based on the total weight of the polyamide composition. [07 3] In other embodiments, the polyamide according to the present invention comprises; (A) 50% to 65% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms, Petition 870250089865, dated 02 / 10 / 2025, pp. 55 / 73 20 / 32 (B) 25% to 50% by weight of a filler in lamellar form with a diameter-to-thickness ratio in the range of at least 70, (C) 0% to 20% by weight of a filler other than the filler in lamellar form with a diameter-to-thickness ratio in the range of at least 70, and (D) 0% to 25% by weight of an additive, based on the total weight of the polyamide composition. [07 4] In some specific embodiments, the polyamide according to the present invention comprises; (A) 45% to 70% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms, (B) 25% to 50% by weight of a filler in lamellar form with a diameter-to-thickness ratio of at least 70, (C) 5% to 20% by weight of a filler other than the filler in lamellar form with a diameter-to-thickness ratio of at least 70, and (D) 0% to 25% by weight of an additive, based on the total weight of the polyamide composition. [07 5] Preferably, the polyamide according to the present invention comprises; (A) 50% to 65% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms, (B) 25% to 45% by weight of a filler in lamellar form with a diameter-to-thickness ratio of at least 70, (C) 5% to 15% by weight of a filler other than the filler in lamellar form with a diameter-to-thickness ratio of at least 70, and (D) 0% to 15% by weight of an additive, Petition 870250089865, dated 02 / 10 / 2025, pp. 56 / 73 21 / 32 based on the total weight of the polyamide composition.

[076] In other specific embodiments, the polyamide according to the present invention comprises; (A) 45% to 70% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms, (B) 30% to 55% by weight of a filler in lamellar form with a diameter-to-thickness ratio of at least 70, (C) 0% to 5% by weight of a filler other than the filler in lamellar form with a diameter-to-thickness ratio of at least 70, and (D) 0% to 25% by weight of an additive, based on the total weight of the polyamide composition. [07 7] Preferably, the polyamide according to the present invention comprises; (A) 50% to 65% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms, (B) 35% to 50% by weight of a filler in lamellar form with a diameter-to-thickness ratio of at least 70, (C) 0% to 5% by weight of a filler other than the filler in lamellar form with a diameter-to-thickness ratio of at least 70, and (D) 0% to 15% by weight of an additive, based on the total weight of the polyamide composition.

[078] The polyamide composition according to the present invention can be processed by any conventional methods without particular restrictions. The method generally includes at least the step of preparing the composition (also called mixing or, alternatively, by the English term compounding) of the components, as described in Petition 870250089865, dated 02 / 10 / 2025, pp. 57 / 73 22 / 32 present invention. Compounding itself is a technique well known to those skilled in the art of polymer processing and manufacturing, and comprises preparing plastic formulations by mixing and / or combining the components in a molten state. The mixing can be carried out at a rotational speed ranging from 200 rpm to 320 rpm. It is understood in the state of the art that compounding is distinct from blending or mixing processes conducted at temperatures lower than the temperature at which the components become molten. The compounding step can, for example, be used to form a masterbatch composition (concentrate of additives and pigments). The compounding step can, for example, involve adding a masterbatch composition to a polymer to form an additional polymer composition.The preparation stage of the composition can be carried out at a temperature of 220 °C to 350 °C.

[079] Polyamide composition can be processed and molded into a desired shape of articles, for example, by molding such as compression molding, injection molding, blow molding and stretching, injection and blow molding and hollow molding, extrusion, casting or thermoforming. Use of the Polyamide composition

[080] As surprisingly discovered by the inventors, the polyamide composition according to the present invention, as an insulating material, can exhibit superior high voltage resistance while exhibiting good dielectric strength and electrical resistivity.

[081] Thus, in the second aspect, the present invention provides the use of the polyamide composition as described in the present invention as an insulating material in high voltage transmission and distribution systems. Petition 870250089865, dated 02 / 10 / 2025, pp. 58 / 73 23 / 32

[082] In particular, the present invention provides the use of the polyamide composition as described in the present invention as an insulating material in circuit breakers, reclosers and transformers. Articles

[083] In the third aspect, the present invention relates to articles produced using the polyamide composition described in the present invention. Articles produced using the polyamide composition are useful in various applications, particularly in high-voltage transmission and distribution systems.

[084] For example, articles produced using polyamide composition can be circuit breakers, reclosers and transformers in high voltage transmission and distribution systems. Examples of Achievement

[085] Several exemplary embodiments are listed below. It will be understood that the embodiments listed below can be combined with all aspects and other embodiments according to the scope of the invention.

[086] 1. A polyamide composition comprising; (A) 40% to 80% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms; and (B) 20% to 60% by weight of a filler in lamellar form with a diameter-to-thickness ratio of at least 70, based on the total weight of the polyamide composition.

[087] 2. The polyamide composition, according to Example of Embodiment 1, in which the polyamide is selected from PA11, PA12, PA510, PA610, PA612, PA1010, PA1012, PA1212, PA9T, PA10T, PA11T, PA12T or any combination of these polyamides, among which PA610, PA1212 and PA9T polyamides are preferred. Petition 870250089865, dated 02 / 10 / 2025, pp. 59 / 73 24 / 32

[088] 3. The polyamide composition, according to either of the Embodiment Examples 1 or 2, wherein the polyamide is present in an amount of 45% to 70% by weight, based on the total weight of the polyamide composition.

[089] 4. The polyamide composition, according to Example of Embodiment 3, in which polyamide is present in an amount of 50% to 65% by weight, based on the total weight of the polyamide composition.

[090] 5. The polyamide composition, according to any of the previous Embodiment Examples, in which the diameter-to-thickness ratio of the lamellar filler is at least 100.

[091] 6. The polyamide composition, according to any of the previous Embodiment Examples, wherein the diameter-to-thickness ratio of the lamellar filler does not exceed 250.

[092] 7. The polyamide composition, according to Example of Embodiment 6, in which the diameter-to-thickness ratio (D / E) of the lamellar-shaped load is no greater than 200.

[093] 8. The polyamide composition, according to Example of Embodiment 7, in which the diameter-to-thickness ratio of the lamellar-shaped load does not exceed 150.

[094] 9. A polyamide composition, according to any of the previous embodiments, wherein the filler in lamellar form is selected from microplates or nanoplates of boron nitride, kaolin, chalk, talc, calcium carbonate, silicates, graphite, mica, vermiculite, montmorillonite, glass or any combination thereof.

[095] 10. The polyamide composition, according to any of the previous Embodiment Examples, in which the filler in lamellar form is present in an amount of 25% to 55% by weight, based on weight. Petition 870250089865, dated 02 / 10 / 2025, pp. 60 / 73 25 / 32 total of the composition is polyamide.

[096] 11. The polyamide composition, according to Example of Embodiment 10, in which the lamellar filler is present in an amount of 25% to 50% by weight, based on the total weight of the polyamide composition.

[097] 12. The polyamide composition, according to any of the previous Embodiment Examples, comprising an additional filler (C) other than the filler in lamellar form in an amount not exceeding 20% ​​by weight, based on the total weight of the polyamide composition.

[098] 13. The polyamide composition, according to Embodiment Example 12, comprising the filler in lamellar form in an amount of 30% to 55% by weight and the additional filler in an amount not exceeding 5% by weight, based on the total weight of the polyamide composition.

[099] 14. The polyamide composition, according to Embodiment Example 13, comprising the filler in lamellar form in an amount of 35% to 50% by weight and the additional filler in an amount not exceeding 5% by weight, based on the total weight of the polyamide composition.

[100] 15. The polyamide composition, according to any of the Embodiment Examples 12 to 14, wherein the additional filler is selected from glass fibers.

[101] 16. The polyamide composition, according to any of the preceding Embodiment Examples, comprising at least one additive selected from UV absorber, hindered amine-based light stabilizer, antioxidant, lubricant, nucleating agent, colorant, release agent, anti-drip agent, impact modifier, agent Petition 870250089865, dated 02 / 10 / 2025, pp. 61 / 73 26 / 32 compatibilizer, plasticizer, surfactant, flame retardant, flame retardant synergist, coupling agent, antimicrobial agent and antistatic agents.

[102] 17. The polyamide composition, according to Example of Embodiment 16, comprising a UV absorber in an amount of 0.05% to 5% by weight, preferably 0.1% to 2% by weight, based on the total weight of the polyamide composition.

[103] 18. The polyamide composition, according to Example of Embodiment 16 or 17, comprising a hindered amine-based light stabilizer, in an amount of 0.05% to 3% by weight, preferably 0.1% to 1% by weight, based on the total weight of the polyamide composition.

[104] 19. Use of the polyamide composition, as defined in any of the previous Embodiment Examples, wherein the composition is used as an insulating material in high-voltage transmission and distribution systems.

[105] 20. The use of the polyamide composition, according to Embodiment Example 19, in circuit breakers, reclosers and transformers.

[106] 21. Articles produced using the polyamide composition, as defined in any of the Embodiment Examples 1 to 18.

[107] 22. The articles, according to the Implementation Example 21, which are items in high-voltage transmission and distribution systems, such as circuit breakers, reclosers, and transformers. Examples

[108] Aspects of the present invention will be more fully illustrated by the following Examples, which are presented to illustrate certain aspects of the present invention and should not be interpreted as limiting the same. Petition 870250089865, dated 02 / 10 / 2025, pp. 62 / 73 27 / 32 Table 1 Materials Acronym / Name Description PA9T Polyamide, Genestar® GC51010 from Kuraray Co., Ltd., Tm = 305 °C PA610 Polyamide, PA610 II from DongChen Plastic Co., Ltd., Tm = 220 °C PA1212 Polyamide, PA1212 II from DongChen Plastic Co., Ltd., Tm = 182-191 °C PA6 Polyamide, YH800N from SINOPEC, Tm = 215-225 °C PA66 Polyamide, TORZEN® U4800 NC01 from INVISTA, Tm = 259 °C BN Layered filler, boron nitride in hexagonal form, HN-425 from DCEI Co., Ltd., D50 = 10 μm, D / E ratio >=70 Talc Layered filler, layered talc, Luzenac® HAR T84 from Imerys SA, D50 = 10.5 μm, D / E ratio = 130. Talc Lamellar filler, lamellar talc, Jetfine® 3CA from Imerys SA, D50 = 3.9 μm, D / E ratio = 72. Talc Lamellar filler, lamellar talc, Steamic® T1CF from Imerys SA, D50 = 5.5 μm, D / E ratio = 40. SiO2 Spherulite filler, SJS-0080S932 from Estone Co., Ltd., D50 = 8 μm. PTFE Polymer filler powder, polytetrafluoroethylene, POLYFLON® PTFE L-5 from Daikin Industries, Ltd., D50 = 5 μm Si Rubber Polymer filler pellet, core-shell silicone rubber, Metablen® S-2200 from Mitsubishi Chemical Corporation GF Fibrous filler, glass fiber, CHOPVANTAGE® HP 3660 from Nippon Electric Glass Co., Ltd., average fiber diameter = 10 μm UVA UV absorber, Tinuvin® 1600 from BASF HALS Hindered amine-based light stabilizer, Chimassorb® 2020 from BASF AO1 Antioxidant, Irganox® 1098 from BASF AO2 Antioxidant, Hostanox® P-EPQ from Clariant AG LU Lubricant, oxidized polyethylene wax, Luwax® OA 5 from BASF NU Nucleating agent, TALC 100 from Elementis Minerals BV BK Colorant, black smoke, Special Black 4 from Orion Engineered Carbons. Preparation of Test Specimens

[109] The test specimens were prepared according to the formulations shown in Table 2.

[110] All raw materials, except the feedstock, were mixed in a Turbula T50A high-speed agitator and fed into a ZE25Ax twin-screw extruder (Berstorff) at the extruder throat, and then the feedstock was added downstream by a side feeder. The mixed materials were melt-extruded at a temperature of 320 °C for PA9T, 285 °C for PA66, 275 °C for PA6, 275 °C for PA610 and 220 °C for Petition 870250089865, dated 02 / 10 / 2025, pp. 63 / 73 28 / 32 PA1212, and pelletized to obtain the polyamide composition in pellet form. The screw diameter is 26 mm, the screw speed is 300 rpm, and the flow rate is 15 to 30 kg / h.

[111] The dry pellets were processed on a Krauss Maffei KM130CX injection molding machine with a clamping force of 130T at a melting temperature of 240 °C to 320 °C, depending on the specific polyamide, to obtain the test specimens. Measurements and Test Methods (1) Diameter-Thickness Ratio (D / E Ratio)

[112] The D / E ratio was calculated according to the following equation D / E = 3π x (Da / Ds)2 / 2 where Da is the particle diameter (D50) based on the static laser light diffraction method, according to standard GB / T 19077-2016, measured using a Malvern Mastersizer 2000 instrument, and Ds is the particle diameter (D50) determined based on the gravitational liquid sedimentation method, according to ISO 133173:2001, measured using a Micromeritics Sedigraph 5100 instrument. (2) Mechanical Properties

[113] Tensile strength, tensile modulus, tensile elongation, flexural modulus and flexural strength were measured on 4 mm thick specimens on the Z050 testing machine (Zwick Roell, Germany) according to ISO 527-1-2012. Type 1 specimens described in ISO 527-1-2012 were used.

[114] Notched Charpy impact resistance and unnotched Charpy impact resistance were measured on the testing machine. Petition 870250089865, dated 02 / 10 / 2025, pp. 64 / 73 29 / 32 HIT25P (Zwick Roell, Germany), according to ISO 179-1-2010 by edge impact. The specimens for the non-notched Charpy test are type 1 with dimensions of 80 mm χ 10 mm χ 4 mm (length χ width χ thickness). The specimens for the notched Charpy test are type 1 with a type A notch.

[115] All test specimens were conditioned at 23 °C and 50% relative humidity for 16 hours. The tests were conducted in the same atmosphere as the conditioning. (3) Insulating properties

[116] Resistance to electrical tracking and erosion under high voltage was evaluated by inclined plane testing (IPT) according to GB / T 6553-2014, corresponding to IEC60587:2007. The specimens (130 mm χ 50 mm χ 4 mm) were subjected to tests under voltages of 2.0 and 3.5 kV using the time-to-track method.

[117] Dielectric strength measurement was performed according to IEC 60243-1:2013 standard, using the short-duration method (rapid voltage rise). Specimens with a thickness of 2 mm were preconditioned at 23 °C, 50% relative humidity for 24 hours and tested under a voltage application frequency of 50 Hz. The voltage rise rate was 2000 V / s.

[118] Dielectric loss measurement was performed according to IEC62631-2-1:2018. Specimens with a thickness of 2 mm were preconditioned at 23 °C, 50% relative humidity for 96 hours and tested at a frequency of 1 M Hz.

[119] Volume resistivity and surface resistivity were tested under 500 V according to IEC62631-3-1:2016 standard with a specimen thickness of 3 mm. Petition 870250089865, dated 02 / 10 / 2025, pages 65 / 73 30 / 32

[120] The formulations and results for the polyamide compositions tested were summarized in Table 2. Table 2 Formulations Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Ex. 8 Comp. 1 Comp. 2 Comp. 3 Comp. 4 Comp. 5 Comp. 6 Comp. 7 PA9T 57.95 57.95 57.95 47.95 77.95 57.95 57.95 57.95 57.95 57.95 57.95 PA610 57.95 PA1212 57.95 PA6 57.95 PA66 57.95 BN, D / E ratio >70 40 40 40 25 Talc, D / E=130 40 50 20 40 40 Talc, D / E= 72 40 Talc, D / E= 40 40 S1O2 40 PTFE 40 Si Rubber 40 GF 15 40 UVA 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 HALS 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 AO1 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 AO2 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 LU 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 NU 0.0 5 0.05 0.0 5 0.05 0.0 5 0.05 0.05 0.0 5 0.05 0.05 0.05 0.05 0.05 0.05 0.05 BK 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 Properties Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Ex. 8 Comp. 1 Comp. 2 Comp. 3 Comp. 4 Comp. 5 Comp. 6 Comp.7 Tensile Modulus (MPa) 836 0 114 00 986 0 110 00 506 0 114 00 139 00 621 0 928 0 464 0 237 0 115 0 135 00 112 00 114 00 Tensile Strength (MPa) 41 48 44 61 38 100 48 54 51 47 30 27 151 90 93 Tensile Elongation (%) 0.7 0.4 0.5 1.1 2.5 1.4 0.4 1 0.6 1.1 1.5 4 1.4 1.6 1.6. Petition 870250089865, dated 02 / 10 / 2025, pp. 66 / 73 31 / 32 Properties Flexural modulus 854 118 900 100 538 121 134 616 905 469 241 116 136 110 114 (MPa) 0 00 0 00 0 00 00 0 0 0 0 0 00 00 00 Flexural strength (MPa) 76 118 102 95 66 157 90.5 104 110 97 56 36 228 137 141 Charpy with notch (kJ / m2) 1.3 1.2 1.4 1.7 2.7 5.4 1.2 1.5 1.6 1.5 1 2.5 9.9 1.9 1.9 Charpy without notch (kJ / m2) 8.5 8.8 14 14 16 29 5.8 16 13 19 12 34 38 32 28 IPT 2.0 kV (min) >36 0 >36 0 213 >36 0 332 >36 0 >36 0 67 18 10 42 17 9 7 6 IPT 3.5 kV (min) - - - - - 275 - - - - - - - - - Dielectric strength (kV / mm) 23.6 20.1 19.4 25.9 21.6 22.9 18.5 17.8 20.4 17.1 17 17.3 17.3 33.3 32.1 Dielectric loss (x 10-3) 10.2 13.2 11.3 15.0 16.8 13.6 10.7 14.3 11.9 11.7 11.4 30.1 12.4 20.7 19.2 Volume resistivity (x 10¹⁵ Ohm.m) 5 1.1 25 8.8 1.8 11 20 8.5 51 0.11 0.11 8.2 0.11 6.8 7.7 Surface resistivity (x 10¹⁵ Ohm) 11 8.3 2.1 0.03 2.4 2.7 4.2 2.5 2.8 0.8 0.77 1.1 0.96 3 4.2 “-”: not determined; “Comp.”: Comparative Example; “Ex.”: Example

[121] As can be seen from the results presented in Table 2, the specimens of Ex. 2, Ex. 3 and Ex. 7, prepared from the polyamide compositions containing PA9T and the lamellar talc filler with a high D / E ratio, according to the present invention, exhibit excellent resistance to electrical tracking and erosion under voltage up to 2.0 kV, for which no failure mode (current > 60 mA or rupture, fire during the test) was observed over 213 minutes and even 360 minutes (i.e., 6 hours). This excellent performance will certainly meet the real operating conditions in high-voltage transmission and distribution applications. On the other hand, the specimens prepared from the comparative polyamide compositions comprising PA9T and a non-lamellar filler (Comp. 2 to Comp. 5), from the comparative polyamide compositions comprising PA9T and the lamellar talc filler with a low D / E ratio (Comp.1), as well as comparative polyamide compositions. Petition 870250089865, dated 02 / 10 / 2025, pp. 67 / 73 The 32 / 32 compositions comprising PA6 or PA66 and the lamellar talc filler (Comp. 6 and Comp. 7) exhibited very low resistance to a high voltage of 2.0 kV, with failure occurring in less than an hour, or even in a few minutes. The specimen of Example 8, prepared from the polyamide compositions comprising PA9T and a lamellar talc filler with a high D / E ratio, according to the present invention, also exhibits significantly better resistance to electrical tracking and erosion, even with a much lower dosage of the lamellar talc filler, compared to specimens prepared from the comparative polyamide compositions.

[122] Similarly, each of the specimens prepared from polyamide compositions comprising PA9T, PA610 or PA1212 and lamellar boron nitride filler (Ex. 1, Ex. 4 to Ex. 6) also exhibits excellent high voltage resistance of 2.0 kV.

[123] It will be evident to a person skilled in the art that various modifications and variations can be made to the present invention without compromising its scope or essence. The intention is that the embodiments and examples are merely illustrative. Therefore, it is intended that the present invention encompasses all modifications and variations that fall within the scope of the appended claims and their equivalents. Petition 870250089865, dated 02 / 10 / 2025, pp. 68 / 73

Claims

1 / 3 Claims 1. POLYAMIDE COMPOSITION, characterized by comprising; (A) 40% to 80% by weight of a polyamide containing at least one type of monomeric units with at least 8 carbon atoms; and (B) 20% to 60% by weight of a filler in lamellar form with a diameter-to-thickness ratio of at least 70, based on the total weight of the polyamide composition.

2. POLYAMIDE COMPOSITION, according to claim 1, characterized in that the polyamide is selected from PA11, PA12, PA510, PA610, PA612, PA1010, PA1012, PA1212, PA9T, PA10T, PA11T, PA12T or any combination of these polyamides, among which polyamides PA610, PA1212 and PA9T are preferred.

3. POLYAMIDE COMPOSITION, according to any one of claims 1 or 2, characterized in that the polyamide is present in an amount of 45% to 70% by weight, or 50% to 65% by weight, based on the total weight of the polyamide composition.

4. POLYAMIDE COMPOSITION, according to any of the preceding claims, characterized in that the diameter-to-thickness ratio of the lamellar filler is at least 100.

5. POLYAMIDE COMPOSITION, according to any of the preceding claims, characterized in that the diameter-to-thickness ratio of the lamellar filler does not exceed 250, or does not exceed 200, or does not exceed 150.

6. POLYAMIDE COMPOSITION, according to any of the preceding claims, characterized by the lamellar filler being selected from microchips or nanochips of boron nitride, kaolin, chalk, talc, calcium carbonate, silicates, graphite, mica, vermiculite, montmorillonite, glass or any combination thereof.

7. POLYAMIDE COMPOSITION, according to any of the preceding claims, characterized in the lamellar-shaped filler being present in an amount of 25% to 55% by weight, or more preferably from 25% to 50% by weight, based on the total weight of the polyamide composition.

8. POLYAMIDE COMPOSITION, according to any of the preceding claims, characterized by comprising an additional filler (C) other than the filler in lamellar form in an amount not exceeding 20% ​​by weight, based on the total weight of the polyamide composition.

9. POLYAMIDE COMPOSITION, according to any of the preceding claims, characterized by comprising the filler in lamellar form in an amount of 30% to 55% by weight, preferably 35% to 50% by weight, and the additional filler in an amount not exceeding 5% by weight, based on the total weight of the polyamide composition.

10. POLYAMIDE COMPOSITION, according to any one of claims 8 or 9, characterized in that the additional filler is selected from glass fibers.

11. POLYAMIDE COMPOSITION, according to any of the preceding claims, characterized by comprising at least one additive selected from UV absorber, hindered amine-based light stabilizer, antioxidant, lubricant, nucleating agent, colorant, release agent, anti-drip agent, impact modifier, compatibilizing agent, plasticizer, surfactant, flame retardant, flame retardant synergist, coupling agent, antimicrobial agent and antistatic agents. Petition 870250089865, dated 02 / 10 / 2025, pp. 70 / 73 3 / 3 12. POLYAMIDE COMPOSITION, according to claim 11, characterized by comprising a UV absorber in an amount of 0.05% to 5% by weight, preferably 0.1% to 2% by weight, based on the total weight of the polyamide composition.

13. POLYAMIDE COMPOSITION, according to any one of claims 11 or 12, characterized by comprising a hindered amine-based light stabilizer, in an amount of 0.05% to 3% by weight, preferably 0.1% to 1% by weight, based on the total weight of the polyamide composition.

14. USE OF POLYAMIDE COMPOSITION, as defined in any of the preceding claims, characterized by being for use as an insulating material in high-voltage transmission and distribution systems.

15. USE OF POLYAMIDE COMPOSITION, according to claim 14, characterized by being in circuit breakers, reclosers and transformers.

16. ITEMS, characterized by being produced using the polyamide composition as defined in any one of claims 1 to 13.

17. ITEMS, according to claim 16, characterized by being items in high-voltage transmission and distribution systems, such as circuit breakers, reclosers, and transformers. Petition 870250089865, dated 10 / 02 / 2025, pp. 71 / 73