Optical communication method, main device, and sub-device.

Description

1 / 68 Optical communication method, main device, and sub-device. TECHNICAL FIELD

[001] This application relates to the field of optical communication and, in particular, to a method of optical communication, a main device, and a sub-device. BACKGROUND

[002] A passive optical network (PON) includes an optical line terminal (OLT), an optical distribution network (ODN), and a plurality of main optical network units (ONUs). Each main ONU can be connected to a plurality of sub-ONUs via an optical splitter. In the uplink direction, a sub-ONU receives an uplink wireless signal from a station (STA), converts the uplink wireless signal into an analog signal using a radio frequency unit, and then converts the analog signal into a digital signal. The sub-ONU then performs the related processing of a physical layer and a medium access control (MAC) layer on the signal to obtain a service packet.The sub-ONU converts the service packet into an uplink optical signal using a photoelectric converter unit, and transmits the uplink optical signal to the main ONU via the optical splitter. The main ONU is configured to demodulate the uplink optical signal using the photoelectric converter unit to obtain the service packet, and transmit the service packet to the OLT via the ODN. The OLT is configured to send the service packet to a public network.

[003] In real-world applications, sub-UN manufacturing costs are high, resulting in high PON manufacturing costs. Petition 870250091527, dated 07 / 10 / 2025, page 15 / 130 2 / 68 SUMMARY

[004] This application provides a method of optical communication, a main device, and a subdevice. The related processing of a MAC layer in the subdevice is moved to the main device, so that the costs of the subdevice can be reduced, thereby reducing the costs of an optical communication system.

[005] A first aspect of this application provides a method of optical communication. The optical communication method includes the following steps: A principal device receives a first optical uplink signal from a first subdevice; the principal device converts the first optical uplink signal into a first electrical uplink signal; the principal device performs uplink-related processing on the first electrical uplink signal to obtain a first service packet, wherein the uplink-related processing includes the first uplink-related processing of a MAC layer; and the principal device transmits the first service packet. In this application, unless otherwise specified, the MAC layer or a physical layer is a MAC layer or a physical layer related to a wireless protocol, for example, a Wi-Fi MAC layer or a Wi-Fi physical layer.Similarly, unless otherwise specified, MAC layer uplink / downlink-related processing refers to MAC layer uplink / downlink-related processing in the wireless protocol, and physical layer uplink / downlink-related processing refers to physical layer uplink / downlink-related processing in the wireless protocol.

[006] In an optional manner of the first aspect, the first uplink electrical signal is a phase / quadrature signal. Petition 870250091527, dated 07 / 10 / 2025, page 16 / 130 3 / 68 Digital I / Q. The uplink-related processing performed by the main device on the first uplink electrical signal additionally includes the second uplink-related processing of the physical layer, the first uplink-related processing of the physical layer, and the second uplink-related processing of the MAC layer. The second uplink-related processing of the physical layer, the first uplink-related processing of the physical layer, and the second uplink-related processing of the MAC layer are moved to the main device so that the subdevice costs can be further reduced.

[007] Optionally, in the first aspect, the uplink-related processing performed by the main device on the first uplink electrical signal additionally includes the first uplink-related processing of the physical layer and the second uplink-related processing of the MAC layer. The first uplink-related processing of the physical layer and the second uplink-related processing of the MAC layer are moved to the main device so that the subdevice costs can be further reduced.

[008] In an optional manner of the first aspect, the uplink-related processing performed by the main device on the first uplink electrical signal additionally includes the second uplink-related processing of the MAC layer. The second uplink-related processing of the MAC layer is moved to the main device, so that the subdevice costs can be further reduced.

[009] In an optional manner of the first aspect, the optical communication method additionally includes the following step: The main device sends incremental signaling to the Petition 870250091527, dated 07 / 10 / 2025, page 17 / 130 4 / 68 first subdevice. Incremental signaling includes a frame identifier and information about a variable field. The frame identifier is used by the first subdevice to obtain a first set of fixed fields based on a first mapping relationship. The first mapping relationship includes a mapping relationship between a plurality of frame identifiers and a plurality of sets of fixed fields. The variable field is used by the first subdevice to obtain a first control frame based on the variable field and the first set of fixed fields. In this order, incremental signaling is transmitted so that transmission resources between the first subdevice and the main device can be saved.

[010] In an optional manner of the first aspect, the optical communication method additionally includes the following steps: The main device performs downlink-related processing in a second service packet to obtain a first downlink electrical signal, where the downlink-related processing includes the first downlink-related processing of the MAC layer; the main device converts the first downlink electrical signal into a first downlink optical signal; and the main device transmits the first downlink optical signal to the first subdevice. The first downlink-related processing of the MAC layer is moved to the main device, so that the subdevice costs can be further reduced.

[011] In an optional manner of the first aspect, the downlink-related processing performed by the main device in the second service packet additionally includes the second downlink-related processing of the MAC layer, the first related processing Petition 870250091527, dated 07 / 10 / 2025, page 18 / 130 5 / 68 the downlink physical layer and the second downlink-related processing of the downlink physical layer. The first downlink-related processing of the downlink physical layer, the second downlink-related processing of the downlink physical layer, and the second downlink-related processing of the downlink MAC layer are moved to the main device, so that the subdevice costs can be further reduced.

[012] In an optional manner of the first aspect, the downlink-related processing performed by the main device in the second service packet additionally includes the second downlink-related processing of the MAC layer and the first downlink-related processing of the physical layer. The first downlink-related processing of the physical layer and the second downlink-related processing of the MAC layer are moved to the main device, so that the subdevice costs can be further reduced.

[013] In an optional manner of the first aspect, the downlink-related processing performed by the main device in the second service packet additionally includes the second downlink-related processing of the MAC layer. The second downlink-related processing of the MAC layer is moved to the main device, so that the subdevice costs can be further reduced.

[014] In an optional way of the first aspect, the main device is connected to the first subdevice by means of an optical splitter.

[015] In an optional way of the first aspect, the main device is connected to a second sub-device by means of an optical splitter.

[016] In an optional way of the first aspect, the method Petition 870250091527, dated 07 / 10 / 2025, page 19 / 130 Optical communication (6 / 68) additionally includes the following steps: The main device receives a second optical uplink signal from the second subdevice; the main device converts the second optical uplink signal into a second electrical uplink signal; and the main device performs uplink-related processing on the second electrical uplink signal to obtain a third service packet.

[017] In an optional manner of the first aspect, the optical communication method additionally includes the following steps: The main device receives a fourth service packet; the main device performs downlink-related processing on the fourth service packet to obtain a second downlink electrical signal; and the main device converts the second downlink electrical signal into a second downlink optical signal, and transmits the second downlink optical signal to the second subdevice.

[018] In an optional manner of the first aspect, the optical communication method additionally includes the following steps: The main device allocates a first uplink slot for the first subdevice and allocates a second uplink slot for the second subdevice, where the first uplink slot is different from the second uplink slot; the main device receives the first optical uplink signal from the first subdevice in the first uplink slot; and the main device receives the second optical uplink signal from the second subdevice in the second uplink slot.

[019] A second aspect of this application provides a method of optical communication. The optical communication method includes the following steps: A first subdevice receives a first Petition 870250091527, dated 07 / 10 / 2025, page 20 / 130 7 / 68 Wireless uplink signal from a STA station. The first subdevice obtains a first electrical uplink signal based on the first wireless uplink signal. The first subdevice converts the first electrical uplink signal into a first optical uplink signal. The first subdevice transmits the first optical uplink signal to a main device. The main device performs uplink-related processing on the first optical uplink signal to obtain a first service packet. The main device's uplink-related processing includes the first uplink-related processing of a MAC layer.

[020] In an optional manner of the second aspect, the first uplink electrical signal is a digital I / Q signal.

[021] In an optional manner of the second aspect, the first uplink-related MAC layer processing includes analysis of the aggregation-medium access control protocol data unit (A-MPDU) and cyclic redundancy check (CRC). The second uplink-related MAC layer processing additionally includes acknowledgment (ACK) or block acknowledgment (BA). The first uplink-related MAC layer processing includes analysis of the aggregation-medium access control service data unit (A-MSDU). The related processing that affects STA delay is retained in the subdevice so that STA delay can be reduced.

[022] In an optional manner of the second aspect, the first subdevice converts the first uplink wireless signal into an electrical signal, and performs a second Petition 870250091527, dated 07 / 10 / 2025, page 21 / 130 8 / 68 processing related to the uplink of a physical layer on the electrical signal, to obtain the first uplink electrical signal.

[023] In an optional manner of the second aspect, the second uplink-related physical layer processing includes at least one of the uplink-related physical layer processing. Uplink-related physical layer processing includes synchronization, fast Fourier transform (FFT), constellation mapping, unscramble, and restoration of a medium access control protocol data unit (MPDU).

[024] In an optional manner of the second aspect, the first subdevice converts the first uplink wireless signal into an electrical signal, and performs the second uplink-related processing of a physical layer and the first uplink-related processing of the physical layer on the electrical signal sequentially, to obtain the first uplink electrical signal.

[025] In an optional manner of the second aspect, the first physical layer uplink-related processing includes a first subset of physical layer uplink-related processing. The second physical layer uplink-related processing includes a second subset of physical layer uplink-related processing. Physical layer uplink-related processing includes synchronization, FFT, constellation mapping, unscramble, and restoration of a media access control protocol data unit (MPDU). The first subset is different from the second subset.

[026] In an optional manner of the second aspect, the first subdevice converts the first uplink wireless signal into an electrical signal, and performs the second Petition 870250091527, dated 07 / 10 / 2025, page 22 / 130 9 / 68 Uplink-related processing of a physical layer, the first uplink-related processing of the physical layer, and the second uplink-related processing of the MAC layer on the electrical signal sequentially, to obtain the first uplink electrical signal.

[027] In an optional manner of the second aspect, the first uplink-related MAC layer processing includes a first uplink-related MAC layer processing subset. The second uplink-related MAC layer processing includes a second uplink-related MAC layer processing subset. The uplink-related MAC layer processing includes A-MPDU, CRC, ACK or BA block acknowledgment parsing, and A-MSDU parsing. The first subset is different from the second subset.

[028] In an optional manner of the second aspect, the optical communication method additionally includes the following steps: The first subdevice receives incremental signaling from the main device, where the incremental signaling includes a frame identifier and information about a variable field; the first subdevice obtains a first set of fixed fields based on the frame identifier and a first mapping relationship, where the first mapping relationship includes a mapping relationship between a plurality of frame identifiers and a plurality of sets of fixed fields; the first subdevice obtains a first control frame based on the variable field and the first set of fixed fields; and the first subdevice sends the first control frame to the STA.

[029] In an optional manner of the second aspect, a frame format of the first control frame conforms to a specification in the 802.11 protocol.

[030] In an optional way of the second aspect, the first Petition 870250091527, dated 07 / 10 / 2025, page 23 / 130 The 10 / 68 control frame is an ACK confirmation frame. The frame identifier indicates that the first control frame type is an ACK frame. The variable field information includes at least one of the following: information about a duration field, a destination address field, a frame check sequence field, an over fragments indicator field, a retry indicator, and an extension field. The first set of fixed fields includes at least one of the following: information about a distributed system to indicator, a distributed system from indicator, a power management indicator, and a protected field.

[031] In an optional manner of the second aspect, the optical communication method additionally includes the following steps: The first subdevice receives the first optical downlink signal from the main device; the first subdevice converts the first optical downlink signal into a first electrical downlink signal, where the first electrical downlink signal is obtained after the main device performs downlink-related processing on a second service packet, and downlink-related processing includes the first downlink-related processing of the MAC layer; the first subdevice obtains a first wireless downlink signal based on the first electrical downlink signal; and the first subdevice sends the first wireless downlink signal to the STA.

[032] In an optional manner of the second aspect, the first subdevice performs the second downlink-related physical layer processing on the first downlink electrical signal, and obtains the first downlink wireless signal based on a processed electrical signal.

[033] In an optional way of the second aspect, the first Petition 870250091527, dated 07 / 10 / 2025, page 24 / 130 The 11 / 68 subdevice performs the first downlink-related physical layer processing and the second downlink-related physical layer processing on the first sequential downlink electrical signal, and obtains the first downlink wireless signal based on a processed electrical signal.

[034] In an optional manner of the second aspect, the first subdevice performs the second downlink-related MAC layer processing, the first downlink-related physical layer processing and the second downlink-related physical layer processing on the first downlink electrical signal in sequence, and obtains the first downlink wireless signal based on a processed electrical signal.

[035] A third aspect of this application provides a main device. The main device includes a photoelectric conversion unit and a processor. The photoelectric conversion unit is configured to receive a first optical uplink signal from a first subdevice, and convert the first optical uplink signal into a first electrical uplink signal. The processor is configured to perform uplink-related processing on the first electrical uplink signal to obtain a first service packet. Uplink-related processing includes the first uplink-related processing of a MAC layer. The processor is additionally configured to emit the first service packet.

[036] In an optional third aspect manner, the first uplink electrical signal is a digital I / Q signal.

[037] In an optional third aspect, the uplink-related processing performed by the main device on the first electrical link signal Petition 870250091527, dated 07 / 10 / 2025, page 25 / 130 12 / 68 uplink additionally includes the second uplink-related processing of a physical layer, the first uplink-related processing of the physical layer, and the second uplink-related processing of the MAC layer.

[038] In an optional third aspect, uplink-related processing performed by the main device on the first uplink electrical signal additionally includes the first uplink-related processing of a physical layer and the second uplink-related processing of the MAC layer.

[039] In an optional third aspect manner, the uplink-related processing performed by the main device on the first uplink electrical signal additionally includes the second uplink-related processing of the MAC layer.

[040] In an optional third aspect manner, the photoelectric conversion unit is additionally configured to send incremental signaling to the first subdevice. The incremental signaling includes a frame identifier and information about a variable field. The frame identifier is used by the first subdevice to obtain a first set of fixed fields based on a first mapping relationship. The first mapping relationship includes a mapping relationship between a plurality of frame identifiers and a plurality of sets of fixed fields. The variable field is used by the first subdevice to obtain a first control frame based on the variable field and the first set of fixed fields.

[041] In an optional third aspect, the processor is additionally configured to perform downlink-related processing in a second service packet to obtain a first link electrical signal. Petition 870250091527, dated 07 / 10 / 2025, page 26 / 130 13 / 68 downlink. Downlink-related processing includes the first downlink-related processing of the MAC layer. The photoelectric conversion unit is additionally configured to convert the first downlink electrical signal into a first downlink optical signal, and transmit the first downlink optical signal to the first subdevice.

[042] In an optional third aspect manner, the downlink-related processing performed by the main device in the second service packet additionally includes the second downlink-related processing of the MAC layer, the first downlink-related processing of the physical layer and the second downlink-related processing of the physical layer.

[043] In an optional third aspect manner, the downlink-related processing performed by the main device in the second service packet additionally includes the second downlink-related processing of the MAC layer and the first downlink-related processing of the physical layer.

[044] In an optional third aspect manner, the downlink-related processing performed by the main device in the second service packet additionally includes the second downlink-related processing of the MAC layer.

[045] In an optional third aspect method, the main device is connected to a second sub-device by means of an optical splitter.

[046] In an optional third aspect, the photoelectric conversion unit is additionally configured to receive a second uplink optical signal from the second subdevice. The photoelectric conversion unit is additionally configured to convert the second optical signal. Petition 870250091527, dated 07 / 10 / 2025, page 27 / 130 14 / 68 uplink signal in a second uplink electrical signal. The processor is additionally configured to perform uplink-related processing on the second uplink electrical signal to obtain a third service packet.

[047] In an optional third aspect, the photoelectric conversion unit is additionally configured to receive a fourth service packet. The processor is additionally configured to perform downlink-related processing on the fourth service packet to obtain a second downlink electrical signal. The photoelectric conversion unit is additionally configured to convert the second downlink electrical signal into a second downlink optical signal, and transmit the second downlink optical signal to the second subdevice.

[048] Optionally, in the third aspect, the processor is further configured to allocate a first uplink slot to the first subdevice, and to allocate a second uplink slot to the second subdevice. The first uplink slot is different from the second uplink slot. The photoelectric conversion unit is configured to receive the first optical uplink signal from the first subdevice in the first uplink slot. The photoelectric conversion unit is configured to receive the second optical uplink signal from the second subdevice in the second uplink slot.

[049] A fourth aspect of this application provides a subdevice. The subdevice includes a wireless module and a photoelectric conversion unit. The wireless module is configured to receive a first uplink wireless signal from a STA, and to obtain a first uplink electrical signal. Petition 870250091527, dated 07 / 10 / 2025, page 28 / 130 15 / 68 based on the first uplink wireless signal. The photoelectric conversion unit is configured to convert the first uplink electrical signal into a first uplink optical signal, and transmit the first uplink optical signal to a main device. The main device performs uplink-related processing on the first uplink optical signal to obtain a first service packet. The uplink-related processing of the main device includes the first uplink-related processing of a MAC layer.

[050] In an optional fourth aspect manner, the first uplink electrical signal is a digital I / Q signal.

[051] In an optional fourth aspect manner, the first uplink-related MAC layer processing includes one or more of the following: A-MPDU parsing, CRC, ACK, BA block acknowledgment, and A-MSDU parsing.

[052] In an optional fourth aspect manner, the wireless module is configured to convert the first uplink wireless signal into an electrical signal, and perform the second uplink-related processing of a physical layer on the electrical signal, to obtain the first uplink electrical signal.

[053] In an optional fourth aspect manner, the second uplink-related physical layer processing includes at least one of the uplink-related physical layer processing. Uplink-related physical layer processing includes synchronization, FFT, constellation mapping, unscramble, and MPDU restoration.

[054] In an optional manner of the fourth aspect, the wireless module is configured to convert the first uplink wireless signal into an electrical signal, and perform the second Petition 870250091527, dated 07 / 10 / 2025, page 29 / 130 16 / 68 uplink-related processing of a physical layer and the first uplink-related processing of the physical layer on the sequential electrical signal, to obtain the first uplink electrical signal.

[055] In an optional fourth aspect manner, the first physical layer uplink-related processing includes a first subset of physical layer uplink-related processing. The second physical layer uplink-related processing includes a second subset of physical layer uplink-related processing. Physical layer uplink-related processing includes synchronization, FFT, constellation mapping, unscramble, and MPDU restoration. The first subset is different from the second subset.

[056] In an optional fourth aspect manner, the wireless module is configured to convert the first uplink wireless signal into an electrical signal, and perform the second uplink-related processing of a physical layer, the first uplink-related processing of the physical layer, and the second uplink-related processing of the MAC layer on the electrical signal sequentially, to obtain the first uplink electrical signal.

[057] In an optional manner of the fourth aspect, the first uplink-related MAC layer processing includes a first uplink-related MAC layer processing subset. The second uplink-related MAC layer processing includes a second uplink-related MAC layer processing subset. The uplink-related MAC layer processing includes A-MPDU, CRC, ACK or BA block acknowledgment parsing, and A-MSDU parsing. The first subset is different from the second subset. Petition 870250091527, dated 07 / 10 / 2025, p. 30 / 130 17 / 68

[058] In an optional fourth aspect, the subdevice additionally includes a processor. The photoelectric conversion unit is additionally configured to receive incremental signaling from the main device. The incremental signaling includes a frame identifier and information about a variable field. The processor is configured to obtain a first set of fixed fields based on the frame identifier and a first mapping relationship. The first mapping relationship includes a mapping relationship between a plurality of frame identifiers and a plurality of sets of fixed fields. The processor is additionally configured to obtain a first control frame based on the variable field and the first set of fixed fields. The wireless module is additionally configured to send the first control frame to the STA.

[059] In an optional fourth aspect manner, a first control frame format conforms to a specification in the 802.11 protocol.

[060] In an optional fourth aspect manner, the first control frame is an ACK frame. The frame identifier indicates that a type of the first control frame is the ACK frame. The variable field information includes at least one of the following: information about a duration field, a destination address field, a frame check sequence field, an over fragments indicator field, a retry indicator, and an extension field. The first set of fixed fields includes at least one of the following: information about a distributed system to indicator, a distributed system from indicator, a power management indicator, and a protected field.

[061] In an optional way of the fourth aspect, the unit Petition 870250091527, dated 07 / 10 / 2025, page 31 / 130 The 18 / 68 photoelectric converter is additionally configured to receive a first optical downlink signal from the main device. The photoelectric converter is additionally configured to convert the first optical downlink signal into a first electrical downlink signal. The first electrical downlink signal is obtained after the main device performs downlink-related processing on a second service packet. Downlink-related processing includes the first downlink-related processing of the MAC layer. The wireless module is additionally configured to obtain a first wireless downlink signal based on the first electrical downlink signal. The wireless module is additionally configured to send the first wireless downlink signal to the STA.

[062] In an optional fourth aspect manner, the wireless module is configured to perform the second downlink-related physical layer processing on the first downlink electrical signal, and obtain the first downlink wireless signal based on a processed electrical signal.

[063] In an optional fourth aspect manner, the wireless module is configured to perform the first downlink-related physical layer processing and the second downlink-related physical layer processing on the first downlink electrical signal in sequence, and obtain the first downlink wireless signal based on a processed electrical signal.

[064] Optionally, in the fourth aspect, the wireless module is configured to perform the second downlink-related MAC layer processing, the first downlink-related physical layer processing, and the second downlink-related physical layer processing. Petition 870250091527, dated 07 / 10 / 2025, page 32 / 130 19 / 68 physical layer in the first downlink electrical signal in sequence, and obtain the first downlink wireless signal based on a processed electrical signal.

[065] A fifth aspect of this application provides an optical communication system. The optical communication system includes a main device and a first subdevice. The main device and the first subdevice are connected by means of an optical splitter. The main device is configured to perform the method according to either of the first aspect or of the optional ways of the first aspect. The first subdevice is configured to perform the method according to either of the second aspect or of the optional ways of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[066] FIG. 1 is a first diagram of a structure of an optical communication system according to an embodiment of this application.

[067] FIG. 1.1 is a diagram of a processing structure related to the uplink of a wireless signal according to one embodiment of this application.

[068] FIG. 2 is a second diagram of a structure of an optical communication system according to an embodiment of this application.

[069] FIG. 2.1 is a third diagram of a structure of an optical communication system according to an embodiment of this application.

[070] FIG. 3 is a fourth diagram of a structure of an optical communication system according to an embodiment of this application.

[071] FIG. 4 is a fifth diagram of a structure of an optical communication system according to an embodiment of this application.

[072] FIG. 5 is a sixth diagram of a structure of a Petition 870250091527, dated 07 / 10 / 2025, p. 33 / 130 20 / 68 optical communication system according to one embodiment of this application.

[073] FIG. 5.1 is a diagram of a subdevice structure according to an embodiment of this application.

[074] FIG. 6 is a diagram of a structure of a first uplink electrical signal of an optical layer according to an embodiment of this application.

[075] FIG. 6.1 is a diagram of a processing structure related to the downlink of a wireless signal according to one embodiment of this application.

[076] FIG. 7 is a diagram of an incremental signaling structure according to one modality of this request.

[077] FIG. 8 is a diagram of a structure of a first set of fixed fields according to one embodiment of this application.

[078] FIG. 9 is a diagram of an ACK frame structure.

[079] FIG. 10 is a diagram of a communication system structure according to one embodiment of this application.

[080] FIG. 11 is a first schematic flowchart of an optical communication method according to one embodiment of this request.

[081] FIG. 12 is a second schematic flowchart of an optical communication method according to an embodiment of this request.

[082] FIG. 13 is a diagram of a structure of a first subdevice according to an embodiment of this application.

[083] FIG. 14 is a diagram of a structure of a main device according to an embodiment of this application. DESCRIPTION OF THE MODALITIES

[084] This application provides a method of optical communication, a main device, and a subdevice. The related processing of a medium access control layer (medium) Petition 870250091527, dated 07 / 10 / 2025, p. 34 / 130 The 21 / 68 access control (MAC) address in the subdevice is moved to the main device so that the manufacturing costs of the subdevice can be reduced, thereby reducing the manufacturing costs of an optical communication system. It should be understood that first, second, target, and similar terms used in this application are merely used for distinction and description, but cannot be understood as an indication or implication of relative importance or an indication or implication of a sequence. Unless otherwise specified, detailed descriptions of some technical features in one embodiment may also be used to explain corresponding technical features mentioned in another embodiment. For example, a processing action included in a first uplink-related processing in one embodiment may also be applied to the first uplink-related processing mentioned in another embodiment.Furthermore, for the sake of brevity and clarity, reference numbers and / or letters are repeated in a plurality of drawings accompanying this application. Repetition is not indicative of a strict limiting relationship between various embodiments and / or configurations.

[085] The optical communication system in this application can be applied to a passive optical network (PON). In a PON system, a main optical network unit (ONU) can be connected to a plurality of sub-ONUs via an optical splitter. In the downlink direction, the downlink optical signals sent by the main ONU are allocated, through the optical splitter, to the sub-ONUs connected to the optical splitter. In the uplink direction, the uplink optical signals from the sub-ONUs are coupled to the main ONU via the optical splitter in a time-division manner. In real-world applications, the costs of the sub-ONU are high, resulting in high PON costs. Petition 870250091527, dated 07 / 10 / 2025, page 35 / 130 22 / 68

[086] In view of this, this application provides an optical communication system. FIG. 1 is a first diagram of a structure of an optical communication system according to an embodiment of this application. As shown in FIG. 1, the optical communication system 100 includes a main device 101, an optical splitter 102, and a subdevice. There may be one or more subdevices. In an example in FIG. 1, the optical communication system 100 includes a plurality of subdevices. The plurality of subdevices includes subdevices 103 to 105. The main device 101 may be a main gateway, an access controller (AC), a main ONU, a main optical network terminal (ONT), a main FTTR unit (MFU), or a main FTTR.The subdevice can be a subgateway, an access point (AP), a sub ONU, a sub ONT, a sub FTTR unit (SFU), or a sub FTTR. The main device 101 and the subdevice are connected via the optical splitter 102. In the uplink direction, the uplink optical signals from the subdevices are coupled to the main device 101 via the optical splitter 102 in a time-division manner. In the downlink direction, a downlink optical signal sent by the main device 101 is allocated, through the optical splitter 102, to the subdevice connected to the optical splitter 102.

[087] The main device 101 is associated with a first station (STA) through a first subdevice in the plurality of subdevices. The first subdevice can be any of the subdevices 103 to 105. The first subdevice is configured to receive a first uplink wireless signal from the first STA. The first uplink wireless signal can be a Wi-Fi signal or a millimeter wave signal. The first Petition 870250091527, dated 07 / 10 / 2025, p. 36 / 130 Subdevice 23 / 68 is additionally configured to obtain a first uplink electrical signal based on the first uplink wireless signal, convert the first uplink electrical signal into a first uplink optical signal, and transmit the first uplink optical signal to main device 101. Main device 101 is configured to receive the first uplink optical signal from the first subdevice, and convert the first uplink optical signal into the first uplink electrical signal. FIG. 1.1 is a diagram of an uplink-related processing structure of a wireless signal according to one embodiment of this application. As shown in FIG. 1.1. Wireless uplink-related processing includes physical layer uplink-related processing and MAC layer uplink-related processing. Physical layer uplink-related processing includes physical layer 2 uplink-related processing 112 and physical layer 1 uplink-related processing 111. MAC layer uplink-related processing includes MAC layer 1 uplink-related processing 113 and MAC layer 2 uplink-related processing 114. Descriptions are provided separately below.

[088] Uplink-related physical layer processing may include synchronization, fast Fourier transform (FFT), constellation mapping, unscramble, and restoration of a medium access control protocol data unit (MPDU). It should be understood that this request describes only one example of uplink-related physical layer processing. In actual applications, processing Petition 870250091527, dated 07 / 10 / 2025, page 37 / 130 24 / 68 related to the physical layer uplink may include more or less processing actions. For example, processing related to the physical layer uplink does not include synchronization. As another example, processing related to the physical layer uplink additionally includes channel estimation or forwarding error correction.

[089] The first uplink-related processing of the physical layer may also be called higher-order uplink-related processing of the physical layer, and the second uplink-related processing of the physical layer may also be called lower-order uplink-related processing of the physical layer. For example, the second uplink-related processing of the physical layer includes synchronization, FFT, and constellation mapping; and the first uplink-related processing of the physical layer includes MPDU decoding and restoration. It should be understood that a person skilled in the art may divide the uplink-related processing of the physical layer into the second uplink-related processing of the physical layer and the first uplink-related processing of the physical layer as needed.Therefore, specific processing actions included in the second uplink-related processing 112 of the physical layer and in the first uplink-related processing 111 of the physical layer are not limited in this request.

[090] Uplink-related MAC layer processing may include aggregation-medium access control protocol data unit (A-MPDU) analysis, cyclic redundancy check (CRC), and control service data unit analysis. Petition 870250091527, dated 07 / 10 / 2025, page 38 / 130 25 / 68 Aggregation-Medium Access Control Service Data Unit (A-MSDU). Uplink-related MAC layer processing may additionally include acknowledgment (ACK) or block recognition (BA) responses. Deframing includes A-MPDU parsing and / or A-MSDU parsing. It should be understood that, in this application, only one example of MAC layer uplink-related processing is described. In actual applications, MAC layer uplink-related processing may include more or fewer processing actions. For example, MAC layer uplink-related processing may not include CRC. As another example, uplink-related processing at the MAC layer additionally includes managing the MAC frame receive buffer or filtering receive frames.

[091] The first uplink-related processing 113 of the MAC layer can also be called the higher-order uplink-related processing of the MAC layer, and the second uplink-related processing 114 of the MAC layer can also be called the lower-order uplink-related processing of the MAC layer. For example, the first uplink-related processing 113 of the MAC layer includes ACK response and A-MSDU analysis. The second uplink-related processing 114 of the MAC layer includes A-MPDU and CRC analysis. For another example, the first uplink-related processing 113 of the MAC layer includes A-MPDU analysis. The second uplink-related processing 114 of the MAC layer includes CRC, ACK response, and A-MSDU analysis.It should be understood that a subject matter expert can divide the uplink-related processing of the MAC layer into the first uplink-related processing 113 of. Petition 870250091527, dated 07 / 10 / 2025, page 39 / 130 26 / 68 MAC layer and in the second uplink-related processing 114 of the MAC layer, as needed. Therefore, specific processing actions included in the first uplink-related processing 113 and in the second uplink-related processing 114 of the MAC layer are not limited in this application.

[092] MAC layer uplink-related processing may include MAC layer data plane uplink processing and MAC layer control plane uplink processing. MAC layer data plane uplink processing includes ACK response, A-MSDU parsing, or CRC. MAC layer control plane uplink processing includes obtaining a user protocol packet and response, obtaining a system status and parsing the system status, or similar. The first MAC layer uplink-related processing 113 may include MAC layer data plane uplink processing and / or MAC layer control plane uplink processing.The second uplink-related processing of the MAC layer 114 may include uplink processing of the MAC layer data plane and / or uplink processing of the MAC layer control plane.

[093] This can be learned from the description in FIG. 1.1 that the uplink-related processing of a wireless protocol includes four parts. The four parts are, respectively, the first uplink-related processing of the MAC layer 113, the second uplink-related processing of the MAC layer 114, the first uplink-related processing of the physical layer 111, and the second uplink-related processing of the physical layer 112. In this embodiment of this application, one or more of the four parts are moved to the device Petition 870250091527, dated 07 / 10 / 2025, page 40 / 130 27 / 68 main 101, in other words, the main device 101 is configured to perform part or all of the uplink processing of the wireless signal on the first uplink electrical signal. According to the solutions provided in this application, the subdevice processing is simplified, and the hardware and software capacity requirements of the subdevice are reduced, thus reducing the costs of the subdevice. Several possible implementation solutions are described separately below.

[094] FIG. 2 is a second diagram of a structure of an optical communication system according to an embodiment of this application. As shown in FIG. 2, the optical communication system includes a main device 101 and a sub-device 103. The main device 101 and the sub-device 103 are connected by means of an optical splitter 102 (not shown in the figure).

[095] Subdevice 103 includes a wireless module 201 and a photoelectric conversion unit 202. The wireless module 201 includes a radio frequency unit 207, a physical layer processing unit 206, and a MAC layer processing unit 205. A physical layer may also be called a PHY layer. The radio frequency unit 207 is configured to receive a first uplink wireless signal from a first STA, and convert the first uplink wireless signal into an electrical signal. The physical layer processing unit 206 may include a digital signal processor (DSP) chip. The physical layer processing unit 206 is configured to perform uplink-related physical layer processing on the electrical signal, and transmit a processed electrical signal to the MAC layer processing unit 205. The MAC layer processing unit 205 may be a MAC chip.The MAC layer processing unit. Petition 870250091527, dated 07 / 10 / 2025, page 41 / 130 28 / 68 Unit 205 is configured to perform the second uplink-related MAC layer processing on the processed electrical signal, to obtain a first uplink electrical signal. MAC layer processing unit 205 is configured to transmit the first uplink electrical signal to photoelectric conversion unit 202. Photoelectric conversion unit 202 is configured to convert the first uplink electrical signal into a first uplink optical signal, and transmit the first uplink optical signal to main device 101.

[096] The main device 101 includes a photoelectric conversion unit 203 and a processor 220. The processor 220 includes a MAC layer processing unit 204. The photoelectric conversion unit 203 includes an optical module. The optical module is configured to convert the first uplink optical signal into the first uplink electrical signal. The MAC layer processing unit 204 is configured to perform the first uplink-related MAC layer processing on the first uplink electrical signal, to obtain a first service packet, and to transmit the first service packet. For example, the main device 101 is a main ONU. The main device 101 additionally includes another optical module. The other optical module is configured to convert the first service packet into a third uplink optical signal, and to transmit the third uplink optical signal to an OLT.The OLT is configured to send the third uplink optical signal or an electrical signal obtained based on the third uplink optical signal to a public network. In another example, primary device 101 is configured to transmit the first service packet to another device. In another example, primary device 101 is configured to... Petition 870250091527, dated 07 / 10 / 2025, page 42 / 130 29 / 68 encapsulate the first service packet to obtain a Layer 3 packet, and transmit the Layer 3 packet to another device. Optionally, the first service packet is an Ethernet packet (Ethernet, ETH).

[097] FIG. 2.1 is a third diagram of a structure of an optical communication system according to an embodiment of this application. As shown in FIG. 2.1, based on FIG. 2, the photoelectric conversion unit 202 includes an optical MAC layer processing unit 209, an optical physical layer processing unit 208, and an optical module 210; and the photoelectric conversion unit 203 includes an optical MAC layer processing unit 231, an optical physical layer processing unit 230, and an optical module 232. Optical MAC layer processing may also be called PON protocol MAC layer processing. Optical physical layer processing may also be called PON protocol physical layer processing. The MAC layer processing unit 205 is configured to transmit a first uplink electrical signal to the optical MAC layer processing unit 209.Optical MAC layer processing unit 209 is configured to perform uplink-related processing of an optical MAC layer on the first uplink electrical signal, to obtain a first processed uplink electrical signal. Optical MAC layer processing unit 209 is configured to transmit the first processed uplink electrical signal to optical physical layer processing unit 208. The optical physical layer processing unit... Unit 208 is configured to perform uplink-related processing of an optical physical layer on the first processed uplink electrical signal. Optical physical layer processing unit 208 is configured to transmit a first uplink electrical signal. Petition 870250091527, dated 07 / 10 / 2025, page 43 / 130 30 / 68 processed for optical module 210. Optical module 210 is configured to convert the first processed uplink electrical signal into a first uplink optical signal, and transmit the first uplink optical signal to photoelectric conversion unit 203. Optical module 232 in photoelectric conversion unit 203 is configured to convert the first uplink optical signal into the first uplink electrical signal, and transmit the first uplink electrical signal to optical physical layer processing unit 230. Optical physical layer processing unit 230 is configured to perform uplink-related optical physical layer processing on the first uplink electrical signal, and transmit a processed first uplink electrical signal to optical MAC layer processing unit 231.Optical MAC layer processing unit 231 is configured to perform optical MAC layer uplink-related processing on the first processed uplink electrical signal, and transmit a first processed uplink electrical signal to MAC layer processing unit 204. MAC layer processing unit 204 is configured to perform the first uplink-related processing of a MAC layer on the first processed uplink electrical signal.

[098] It can be seen in FIG. 2 and FIG. 2.1 that the photoelectric conversion unit 202 and the photoelectric conversion unit 203 include at least the optical module, and may additionally include the optical MAC layer processing unit and the optical physical layer processing unit. In subsequent embodiments of this application, for brevity of description, the photoelectric conversion unit 202 and the photoelectric conversion unit 203 are not described in detail. However, a person skilled in the art should understand that the unit of Petition 870250091527, dated 07 / 10 / 2025, page 44 / 130 31 / 68 photoelectric conversion 202 and the photoelectric conversion unit 203 shown in FIG. 2 and FIG. 2.1 are also applicable to other embodiments of this application.

[099] In real-world applications, MAC layer uplink-related processing includes a processing action that affects a STA delay. To reduce the STA delay, the processing action affecting the STA delay can be retained in subdevice 103. In this case, the second MAC layer uplink-related processing includes the processing action affecting the STA delay. The processing action affecting the STA delay may include an A-MPDU and CRC analysis. The processing action affecting the STA delay may additionally include an ACK or BA response. In this case, the first MAC layer uplink-related processing includes the A-MSDU analysis.

[100] In the example in FIG. 2, the main device 101 is configured to perform the first uplink-related MAC layer processing, and the subdevice 103 is configured to perform the second uplink-related MAC layer processing. In the actual application, the main device 101 can also be configured to perform the second uplink-related MAC layer processing, and the subdevice 103 does not need to perform the second uplink-related MAC layer processing. This is described below.

[101] FIG. 3 is a fourth diagram of the structure of an optical communication system according to an embodiment of this application. As shown in FIG. 3, the optical communication system includes a main device 101 and a sub-device 103. The sub-device 103 includes a wireless module 301 and a photoelectric conversion unit 202. The wireless module 301 includes a radio frequency unit 304 and a physical layer processing unit 303. The radio frequency unit Petition 870250091527, dated 07 / 10 / 2025, page 45 / 130 32 / 68 Unit 304 is configured to receive a first wireless uplink signal from a first STA, and convert the first wireless uplink signal into an electrical signal. Physical layer processing unit 303 is configured to perform uplink-related physical layer processing on the electrical signal, to obtain a first electrical uplink signal. The first electrical uplink signal can be a MAC frame or a Wi-Fi MAC frame. The MAC frame or Wi-Fi MAC frame is an MPDU. Photoelectric conversion unit 202 is configured to convert the first electrical uplink signal into a first optical uplink signal, and transmit the first optical uplink signal to main device 101. Main device 101 includes a photoelectric conversion unit 203 and a processor 320. Processor 320 includes a MAC layer processing unit 302.The photoelectric conversion unit 203 is configured to convert the first optical uplink signal into the first electrical uplink signal. The MAC layer processing unit 302 is configured to perform uplink-related MAC layer processing on the first electrical uplink signal to obtain a first service packet and transmit the first service packet.

[102] In the example in FIG. 3, subdevice 103 is configured to perform the first uplink-related physical layer processing and the second uplink-related physical layer processing. In the actual application, the main device 101 can also be configured to perform the first uplink-related physical layer processing, and subdevice 103 is configured to perform the second uplink-related physical layer processing. This is described below.

[103] FIG. 4 is a fifth diagram of a structure of a Petition 870250091527, dated 07 / 10 / 2025, p. 46 / 130 33 / 68 optical communication system according to an embodiment of this application. As shown in FIG. 4, the optical communication system includes a main device 101 and a sub-device. 103. Subdevice 103 includes a wireless module 401 and a photoelectric conversion unit 202. Wireless module 401 includes a radio frequency unit 404 and a physical layer processing unit 403. Radio frequency unit 404 is configured to receive a first wireless uplink signal from a first STA, and convert the first wireless uplink signal into an electrical signal. Physical layer processing unit 403 is configured to perform second uplink-related physical layer processing on the electrical signal, to obtain a first electrical uplink signal. Photoelectric conversion unit 202 is configured to convert the processed first electrical uplink signal into a first optical uplink signal, and transmit the first optical uplink signal to the main device 101.The main device 101 includes a photoelectric conversion unit 203 and a processor 420. The processor. The 420 includes a physical layer processing unit 402 and a MAC layer processing unit 302. The photoelectric conversion unit 203 is configured to convert the first optical uplink signal into the first electrical uplink signal. The physical layer processing unit 402 is configured to perform the first physical layer uplink-related processing on the first electrical uplink signal. The MAC layer processing unit 302 is configured to perform MAC layer uplink-related processing on the first processed electrical uplink signal to obtain a first service packet.

[104] In the example in FIG. 4, subdevice 103 is Petition 870250091527, dated 07 / 10 / 2025, page 47 / 130 Device 34 / 68 is configured to perform the second uplink-related physical layer processing, and primary device 101 is configured to perform the first uplink-related physical layer processing. In the actual application, primary device 101 can also be configured to perform the second uplink-related physical layer processing, and subdevice 103 does not need to perform the second uplink-related physical layer processing. This is described below.

[105] FIG. 5 is a sixth diagram of a structure of an optical communication system according to an embodiment of this application. As shown in FIG. 5, the optical communication system includes a main device 101 and a subdevice 103. The subdevice 103 includes a wireless module 501 and a photoelectric conversion unit 202. The wireless module 501 includes a radio frequency unit 503. The radio frequency unit 503 is configured to receive a first uplink wireless signal from a first STA, and convert the first uplink wireless signal into a first uplink electrical signal. The photoelectric conversion unit 202 is configured to convert the first uplink electrical signal into a first uplink optical signal, and transmit the first uplink optical signal to the main device 101.The main device 101 includes a photoelectric conversion unit 203 and a processor 520. The processor 520 includes a physical layer processing unit 502 and a MAC layer processing unit 302. The photoelectric conversion unit 203 is configured to convert the first optical uplink signal into the first electrical uplink signal. The physical layer processing unit 502 is configured to perform uplink-related processing of a physical layer on the first electrical signal. Petition 870250091527, dated 07 / 10 / 2025, page 48 / 130 35 / 68 uplink. The MAC layer 302 processing unit is configured to perform uplink-related processing of a MAC layer on a first processed uplink electrical signal, to obtain a first service packet.

[106] FIG. 5.1 is a diagram of a subdevice structure according to an embodiment of this application. As shown in FIG. 5.1, the subdevice 103 includes a photoelectric conversion unit 202 and a wireless module. The wireless module includes an antenna 503, a physical layer processing circuit 504, and a MAC layer processing circuit 505. In an uplink direction, the physical layer processing circuit 504 includes a preamble addition circuit or frequency shift correction circuit, an FFT circuit, a channel evaluation circuit, a multiple-input multiple-output (MIMO) processing circuit, and a demodulation, deinterleaving, decoding, or unscrambling circuit.The MAC layer 505 processing circuit includes a physical layer protocol data unit (PHY) / MPDU (PPDU) frame parsing circuit, an encryption and decryption circuit, and a reordering circuit. In a downlink direction, the MAC layer 505 processing circuit includes a buffering or enhanced distributed channel access (EDCA) circuit, an encryption and decryption circuit, and an MPDU / PPDU aggregation circuit. The physical layer 504 processing circuit includes a preamble addition circuit, a guard interval (GI) or contention period (CP) circuit, an IFFT circuit, a spatial flow mapping circuit, and a scrambling, encoding, interleaving, or modulation circuit. Petition 870250091527, dated 07 / 10 / 2025, page 49 / 130 36 / 68

[107] In this request, some circuits in the wireless module can be moved to a main device to reduce subdevice costs. For example, for a cutoff point 1, a circuit on the left side of cutoff point 1 in the wireless module can be moved to the main device, and a circuit on the right side of cutoff point 1 can be retained in subdevice 103. In this case, the wireless module of subdevice 103 may not need to include the reordering circuit. Subdevice 103 transmits an ETH packet to the main device. For another example, for a cutoff point 2, a circuit on the left side of cutoff point 2 in the wireless module can be moved to the main device, and a circuit on the right side of cutoff point 2 can be retained in subdevice 103. In this case, the wireless module of subdevice 103 may not need to include the MAC layer 505 processing circuit.Subdevice 103 transmits an Ethernet MPDU packet to the main device. For another example, for a cutoff point 3, a circuit on the left side of cutoff point 3 in the wireless module can be moved to the main device, and a circuit on the right side of cutoff point 3 can be retained in subdevice 103. In this case, the wireless module of subdevice 103 may not need to include the 505 MAC layer processing circuit, the MIMO processing circuit, the demodulation, deinterleaving, decoding or unscrambling circuit, the spatial flow mapping circuit, and the scrambling, encoding, interleaving or modulation circuit. Subdevice 103 transmits an Ethernet frequency domain code stream to the main device. For another example, for a cutoff point 4, a circuit on the left side of cutoff point 4 in the wireless module can be moved to the main device.In this case, the wireless module of subdevice 103 may not need to include the MAC layer 505 processing circuit. Petition 870250091527, dated 07 / 10 / 2025, page 50 / 130 37 / 68 and the physical layer processing circuit 504. Subdevice 103 transmits an I / Q signal to the main device. In the examples in FIG. 2 to FIG. 5.1, the photoelectric conversion unit 202 is configured to receive a first uplink electrical signal from an electrical layer from the wireless module, and convert the first uplink electrical signal from the electrical layer into a first uplink optical signal. Before the electrical-to-optical conversion, the photoelectric conversion unit 202 can be configured to add a header and a check bit to the first uplink electrical signal from the electrical layer, to obtain a first uplink electrical signal from an optical layer. The photoelectric conversion unit 202 is configured to convert the first uplink electrical signal from the optical layer into the first uplink optical signal. FIG.Figure 6 is a diagram of the structure of a first uplink electrical signal of an optical layer according to one embodiment of this application. As shown in FIG. 6, the first uplink electrical signal of the optical layer includes a PON header field, a payload field, and a passive optical network frame check sequence (PON FCS) field. The payload field is used to carry a wireless modulation signal emitted by a wireless module, i.e., a first uplink electrical signal of an electrical layer.

[108] In the examples in FIG. 2 to FIG. 5.1, the wireless modulation signal can be in different formats. For example, in FIG. 5, a wireless modulation signal emitted by the wireless module501 is an in-phase / quadrature (I / Q) signal. In FIG. In Figure 3, a wireless modulation signal emitted by wireless module 301 is a Wi-Fi MAC frame. In Figure 4, a wireless modulation signal emitted by wireless module 401 is an intermediate signal generated. Petition 870250091527, dated 07 / 10 / 2025, page 51 / 130 38 / 68 in a procedure for acquiring a MAC frame using an I / Q signal. In FIG. 2, a wireless modulation signal emitted by wireless module 201 is an intermediate signal generated in a procedure for acquiring a service packet using a MAC frame. In the examples in FIG. 2 to FIG. 5.1, subdevice 103 moves uplink-related processing from the physical layer and / or uplink-related processing from the layer MAC processing is carried out up to the main device 101, so that the manufacturing costs of the subdevice 103 are reduced. Similarly, in the actual application, the subdevice 103 can move some or all of the downlink-related wireless signal processing to the main device 101. FIG. 6.1 is a diagram of a downlink-related wireless signal processing structure according to one embodiment of this application. As shown in FIG. 6.1, the downlink-related wireless signal processing includes downlink-related physical layer processing and downlink-related MAC layer processing. Descriptions are provided separately below.

[109] Physical layer downlink-related processing may include scrambling, encoding, constellation mapping, inverse fast Fourier transform (IFFT), and composition of a physical layer protocol data unit (PPDU). It should be understood that this request describes only one example of physical layer downlink-related processing. In actual applications, physical layer downlink-related processing may include more or fewer processing actions. For example, physical layer downlink-related processing may not include encoding. As another example, physical layer downlink-related processing may additionally include interleaving or signal enhancement. Petition 870250091527, dated 07 / 10 / 2025, page 52 / 130 39 / 68

[110] Physical layer downlink-related processing includes first physical layer downlink-related processing 603 and second physical layer downlink-related processing 604. First physical layer downlink-related processing 603 may also be called higher-order physical layer downlink-related processing. Second physical layer downlink-related processing 604 may also be called lower-order physical layer downlink-related processing. For example, second physical layer downlink-related processing 604 includes IFFT and PPDU composition; and first physical layer downlink-related processing 603 includes scrambling, encoding, and constellation mapping.It should be understood that a subject matter expert may divide the downlink-related processing 602 of the physical layer into the first downlink-related processing 603 of the physical layer and the second downlink-related processing 604 of the physical layer, as needed. Therefore, specific processing actions included in the first downlink-related processing 603 and the second downlink-related processing 604 of the physical layer are not limited in this application.

[111] Downlink-related MAC layer processing may include frame encapsulation, aggregation, transmission vector generation, air interface status determination, and sending to the physical layer. Frame encapsulation refers to encapsulating a service frame in an MPDU. Aggregation refers to aggregating MPDUs to form an A-MPDU. Transmission vector generation refers to generating related control information to be sent to a physical layer processing unit. To determine the Petition 870250091527, dated 07 / 10 / 2025, page 53 / 130 40 / 68 air interface status, the air interface status can be determined using carrier sense multiple access with collision avoidance (CSMA / CA). Sending to the physical layer refers to the transfer of a MAC frame and a transmission vector to the physical layer processing unit. It should be understood that this request describes only one example of downlink-related MAC layer processing. In actual applications, downlink-related MAC layer processing may include more or fewer processing actions. For example, downlink-related MAC layer processing may not include determining an air interface status. As another example, downlink-related MAC layer processing may additionally include data encryption or session establishment.

[112] MAC layer downlink-related processing includes MAC layer first downlink-related processing 606 and MAC layer second downlink-related processing 607. MAC layer first downlink-related processing 606 may also be called MAC layer higher-order downlink-related processing. MAC layer second downlink-related processing 607 may also be called MAC layer lower-order downlink-related processing. For example, MAC layer first downlink-related processing 606 includes frame encapsulation; and MAC layer second downlink-related processing 607 includes aggregation, transmission vector generation, air interface status determination, and sending to the physical layer.For another example, the first processing related to the 606 downlink of the MAC layer includes frame encapsulation and aggregation; and the second processing related to... Petition 870250091527, dated 07 / 10 / 2025, page 54 / 130 41 / 68 MAC layer 607 downlink processing includes the generation of a transmission vector, the determination of an air interface status, and the sending to the physical layer. It should be understood that a technician in the field may divide MAC layer downlink-related processing into first MAC layer 606 downlink-related processing and second MAC layer 607 downlink-related processing, as needed. Therefore, specific processing actions included in first MAC layer 606 downlink-related processing and second MAC layer 607 downlink-related processing are not limited in this application.

[113] MAC layer downlink-related processing may include MAC layer data plane downlink processing and MAC layer control plane downlink processing. MAC layer data plane downlink processing includes ACK response, A-MSDU parsing, or CRC. MAC layer control plane downlink processing includes obtaining a user protocol packet and response, obtaining a system status and parsing the system status, or similar. The first MAC layer downlink-related processing 606 may include MAC layer data plane downlink processing and / or MAC layer control plane downlink processing.The second downlink-related processing of the MAC layer 607 may include downlink processing of the MAC layer data plane and / or downlink processing of the MAC layer control plane.

[114] This can be learned from the description in FIG. 6.1 that downlink-related processing includes four parts. The four parts are, respectively, the first downlink-related processing 606 of the MAC layer, Petition 870250091527, dated 07 / 10 / 2025, page 55 / 130 42 / 68 the second downlink-related processing 607 of the MAC layer, the first downlink-related processing 603 of the physical layer, and the second downlink-related processing 604 of the physical layer. In this embodiment of this application, one or more of the four parts are moved to the main device 101, so that the subdevice processing is simplified, and the hardware and software capacity requirements of the subdevice are reduced, thus reducing the subdevice costs. Several possible implementation solutions are described separately below using FIGS. 2 to 5 as examples.

[115] As shown in FIG. 2, the optical communication system includes the main device 101 and the sub-device 103. The main device 101 and the sub-device 103 are connected via the optical splitter 102 (not shown in the figure). The main device 101 is configured to receive a second service packet. For example, the main device 101 is a main ONU, and the main device 101 receives the second service packet from a public network via an OLT. The main device 101 includes the photoelectric conversion unit 203 and the processor 220. The processor 220 includes the MAC layer processing unit 204. The MAC layer processing unit 204 is configured to perform the first downlink-related processing of a MAC layer on the second service packet, to obtain a first downlink electrical signal.The photoelectric conversion unit 203 is configured to convert the first downlink electrical signal into a first downlink optical signal, and transmit the first downlink optical signal to subdevice 103. The main device 101 may additionally include an optical MAC layer processing unit and an optical physical layer processing unit. The layer processing unit... Petition 870250091527, dated 07 / 10 / 2025, page 56 / 130 43 / 68 MAC 204 is configured to transmit the first downlink electrical signal to the optical MAC layer processing unit. The optical MAC layer processing unit is configured to perform downlink-related processing of an optical MAC layer on the first downlink electrical signal. The optical MAC layer processing unit is configured to transmit the first downlink electrical signal to the optical physical layer processing unit. The optical physical layer processing unit is configured to perform downlink-related processing of an optical physical layer on the first downlink electrical signal. The optical physical layer processing unit is configured to transmit the first downlink electrical signal to the photoelectric conversion unit 203.

[116] Subdevice 103 includes wireless module 201 and photoelectric conversion unit 202. Photoelectric conversion unit 202 is configured to convert the first downlink optical signal into the first downlink electrical signal. Wireless module 201 includes radio frequency unit 207, physical layer processing unit 206, and MAC layer processing unit 205. MAC layer processing unit 205 is configured to perform second downlink-related MAC layer processing on the first downlink electrical signal. Physical layer processing unit 206 is configured to perform downlink-related physical layer processing on a first processed downlink electrical signal.The radio frequency unit 207 is configured to convert the first downlink electrical signal obtained after downlink-related processing at the physical layer into a first downlink wireless signal. The radio frequency unit 207 is additionally configured to... Petition 870250091527, dated 07 / 10 / 2025, page 57 / 130 44 / 68 send the first downlink wireless signal to a first STA.

[117] In real-world applications, downlink-related MAC layer processing includes a processing action that affects a STA delay. To reduce the STA delay, the processing action that affects the STA delay can be retained in subdevice 103. In this case, the second downlink-related MAC layer processing includes the processing action that affects the STA delay. The processing action that affects the STA delay may include determining an air interface status and sending it to the physical layer. In this case, the first downlink-related MAC layer processing includes frame encapsulation, aggregation, and transmission vector generation.

[118] In the example in FIG. 2, the main device 101 is configured to perform the first downlink-related MAC layer processing, and the subdevice 103 is configured to perform the second downlink-related MAC layer processing. In the actual application, the main device 101 can also be configured to perform the second downlink-related MAC layer processing, and the subdevice 103 does not need to perform the second downlink-related MAC layer processing. This is described below.

[119] As shown in FIG. 3, the optical communication system includes the main device 101 and the sub-device 103. The main device 101 includes the photoelectric conversion unit 203 and the processor 320. The processor 320 includes the MAC layer processing unit 302. The MAC layer processing unit 302 is configured to perform downlink-related processing of a MAC layer in a second service packet, to obtain a first downlink electrical signal. The conversion unit Petition 870250091527, dated 07 / 10 / 2025, page 58 / 130 Photoelectric unit 203 is configured to convert the first downlink electrical signal into a first downlink optical signal, and transmit the first downlink optical signal to subdevice 103. Subdevice 103 includes wireless module 301 and photoelectric conversion unit 202. Photoelectric conversion unit 202 is configured to convert the first downlink optical signal into the first downlink electrical signal. Wireless module 301 includes radio frequency unit 304 and a physical layer processing unit 303. Physical layer processing unit 303 is configured to perform downlink-related physical layer processing on the first downlink electrical signal. Radio frequency unit 304 is configured to convert a processed first downlink electrical signal into a first downlink wireless signal.The radio frequency unit 304 is additionally configured to send the first downlink wireless signal to a first STA.

[120] In the example in FIG. 3, subdevice 103 is configured to perform the second downlink-related processing and the first downlink-related processing of the physical layer. In the actual application, the main device 101 can also be configured to perform the first downlink-related processing of the physical layer, and subdevice 103 is configured to perform the second downlink-related processing of the physical layer. This is described below.

[121] FIG. 4 is a fifth diagram of a structure of an optical communication system according to an embodiment of this application. As shown in FIG. 4, the optical communication system includes the main device 101 and the sub-device 103. The main device 101 includes the conversion unit. Petition 870250091527, dated 07 / 10 / 2025, p. 59 / 130 46 / 68 photoelectric 203 and processor 420. Processor 420 includes physical layer processing unit 402 and MAC layer processing unit 302. MAC layer processing unit 302 is configured to perform downlink-related MAC layer processing on a second service packet to obtain an electrical signal. Physical layer processing unit 402 is configured to perform second downlink-related physical layer processing on the electrical signal to obtain a first downlink electrical signal. Photoelectric conversion unit 203 is configured to convert the first downlink electrical signal into a first downlink optical signal and transmit the first downlink optical signal to subdevice 103. Subdevice 103 includes wireless module 401 and photoelectric conversion unit 202.The photoelectric conversion unit 202 is configured to convert the first optical downlink signal into the first electrical downlink signal. The wireless module 401 includes the radio frequency unit 404 and a physical layer processing unit 403. The physical layer processing unit 403 is configured to perform the second downlink-related physical layer processing on the first electrical downlink signal. The radio frequency unit 404 is configured to convert a processed first electrical downlink signal into a first wireless downlink signal. The radio frequency unit 404 is additionally configured to send the first wireless downlink signal to a first STA.

[122] In the example in FIG. 4, subdevice 103 is configured to perform the second downlink-related processing of the physical layer, and the main device is configured to perform the first related processing. Petition 870250091527, dated 07 / 10 / 2025, pp. 60 / 130 47 / 68 the downlink of the physical layer. In the actual application, the main device 101 can also be configured to perform the second downlink-related processing of the physical layer, and the subdevice 103 does not need to perform the second downlink-related processing of the physical layer. This is described below.

[123] FIG. 5 is a sixth diagram of a structure of an optical communication system according to an embodiment of this application. As shown in FIG. 5, the optical communication system includes the main device 101 and the sub-device 103. The main device 101 includes the photoelectric conversion unit 203 and the processor 520. The processor 520 includes the physical layer processing unit 502 and the MAC layer processing unit 302. The MAC layer processing unit 302 is configured to perform downlink-related processing of a MAC layer on a second service packet, to obtain an electrical signal. The physical layer processing unit 402 is configured to perform downlink-related processing of a physical layer on the electrical signal, to obtain a first downlink electrical signal.The photoelectric conversion unit 203 is configured to convert the first downlink electrical signal into a first downlink optical signal, and transmit the first downlink optical signal to subdevice 103. Subdevice 103 includes wireless module 501 and photoelectric conversion unit 202. Photoelectric conversion unit 202 is configured to convert the first downlink optical signal into the first downlink electrical signal. Wireless module 501 includes radio frequency unit 503. Radio frequency unit 503 is configured to convert the first downlink electrical signal into a first downlink wireless signal. Radio frequency unit 503 is further configured. Petition 870250091527, dated 07 / 10 / 2025, page 61 / 130 48 / 68 to send the first downlink wireless signal to a first STA.

[124] In the examples in FIG. 2 to FIG. 5.1, the photoelectric conversion unit 202 is configured to convert the first optical downlink signal into a first electrical downlink signal of an optical layer. After the electrical-to-optical conversion, the photoelectric conversion unit 202 can be further configured to remove a header and a check bit from the first electrical downlink signal of the optical layer, to obtain a first electrical downlink signal of an electrical layer. In the examples in FIG. 2 to FIG. 5.1, the first electrical downlink signal of the electrical layer can be in different formats. For example, in FIG. 5, a wireless modulation signal emitted by the photoelectric conversion unit 202 is an in-phase / quadrature (I / Q) signal. In FIG. 3, a wireless modulation signal emitted by the photoelectric conversion unit 202 is a Wi-Fi MAC frame. In FIG.Figure 4 shows a wireless modulation signal emitted by wireless module 401, which is an intermediate signal generated in a process of obtaining an I / Q signal based on a MAC frame. Figure 2 shows a wireless modulation signal emitted by photoelectric conversion unit 202, which is an intermediate signal generated in a procedure for obtaining a MAC frame based on a service packet. In real-world applications, when subdevice 103 does not include a MAC layer processing unit, subdevice 103 cannot generate, using the MAC layer processing unit, a control frame necessary for the first STA. In this case, subdevice 103 can receive a control frame from main device 101 and send the control frame to the first STA. However, to save transmission resources between main device 101 and subdevice 103, subdevice 103 can send the control frame to... Petition 870250091527, dated 07 / 10 / 2025, page 62 / 130 49 / 68 the first STA using incremental signaling. This is described below.

[125] The main device 101 can learn whether a control frame needs to be sent to the first STA. For example, after receiving the first uplink electrical signal, the main device 101 needs to send an ACK frame to the first STA. After knowing that the control frame needs to be sent to the first STA, the main device 101 sends incremental signaling to the subdevice 103. The incremental signaling includes a frame identifier and information about a variable field. FIG. 7 is a diagram of an incremental signaling structure according to an embodiment of this application. As shown in FIG. 7, the incremental signaling 701 includes a PON header field, a payload field, and a PON FCS field. The payload field is used to carry a frame identifier and information about a variable field.Subdevice 103 is configured to obtain a first set of fixed fields based on the frame identifier and a first mapping relationship. The first mapping relationship includes a mapping relationship between a plurality of frame identifiers and a plurality of sets of fixed fields. The set of fixed fields can also be called a frame template. Subdevice 103 is configured to obtain a first control frame based on the variable field and the first set of fixed fields, and send the first control frame to the first STA. The following example uses an instance where the first control frame is an ACK frame for description.

[126] FIG. 8 is a diagram of a structure of a first set of fixed fields according to an embodiment of this application. As shown in FIG. 8, the first set of fixed fields 801 is a model of an ACK frame. The Petition 870250091527, dated 07 / 10 / 2025, p. 63 / 130 The 50 / 68 ACK frame model includes a frame control field. The frame control field includes information about a protocol version, a type, a subtype, an indicator for a distributed system (to distributed system, to DS), an indicator from a distributed system (from distributed system, from DS), a power management indicator, a protected frame, and an order field. Incremental signaling includes an ACK frame identifier and information about a variable field. The variable field includes a duration field, a destination address (DA) field, a frame check sequence (FCS) field, a more fragments indicator, a retry indicator, and an extension field. The extension field may also be called a more data indicator.

[127] Subdevice 103 obtains the ACK frame template based on the ACK frame identifier, and populates the variable field in the ACK frame template to obtain the ACK frame. FIG. 9 is a diagram of the structure of an ACK frame. After obtaining ACK frame 901, subdevice 103 sends ACK frame 901 to the first STA.

[128] It should be understood that FIG. 8 and FIG. 9 are merely examples of a first control frame obtained according to an embodiment of this application. In actual application, a person skilled in the art may divide a control frame into a fixed field and a variable field, as required. For example, in actual application, the first control frame may be a BA frame. For another example, in FIG. 8, the order field in the first set of fixed fields 801 is a variable field.

[129] In this embodiment of this request, to improve the generalization of the first control frame, the first control frame may conform to a specification in Petition 870250091527, dated 07 / 10 / 2025, p. 64 / 130 51 / 68 802.11 protocol. The 802.11 protocol may also be called the IEEE 802.11 protocol. The 802.11 protocol includes, but is not limited to, any of the following protocols: 802.11a, 802.11b, 802.11n, 802.11ac, or 802.11ax.

[130] In actual application, the plurality of subdevices may additionally include a second subdevice. For example, the second subdevice is a 104 subdevice. Similar to the uplink description of the first subdevice described above, the main device may be configured to receive a second optical uplink signal from the second subdevice. The main device is configured to convert the second optical uplink signal into a second electrical uplink signal. The main device is configured to perform uplink-related processing on the second electrical uplink signal to obtain a third service packet. Uplink-related processing includes the first uplink-related processing of a MAC layer. This is similar to the downlink description of the first subdevice described above.The main device can be configured to receive a fourth service packet. The main device is configured to perform downlink-related processing on the fourth service packet to obtain a second downlink electrical signal. Downlink-related processing includes the first downlink-related processing of the MAC layer. The main device converts the second downlink electrical signal into a second downlink optical signal, and transmits the second downlink optical signal to the second subdevice.

[131] When the second subdevice is also within wireless communication range of the first STA, the second subdevice will also be able to receive the first wireless signal from Petition 870250091527, dated 07 / 10 / 2025, page 65 / 130 52 / 68 uplink from the first STA. The second subdevice is configured to transmit a first optical uplink signal to the main device 101 via an optical fiber. The main device 101 is additionally configured to receive the first optical uplink signal from the second subdevice and convert the first optical uplink signal into a first electrical uplink signal. When the main device 101 wirelessly communicates with the first STA via the first subdevice, the main device 101 can discard the first electrical uplink signal received from the second subdevice.

[132] The main device 101 can switch the subdevice that performs wireless communication with the first STA. In the previous example, the main device 101 performs wireless communication with the first STA through the first subdevice. After the subdevice is switched, the main device 101 can perform wireless communication with the first STA through the second subdevice. After the main device 101 determines to perform wireless communication with the first STA through the second subdevice, the main device 101 transmits the second downlink optical signal to the second subdevice. The second subdevice is configured to obtain a fourth downlink electrical signal based on the second downlink optical signal.The second subdevice is additionally configured to obtain a second downlink wireless signal based on the fourth downlink electrical signal, and send the second downlink wireless signal to the first STA.

[133] After the subdevice is switched, when the first subdevice is also within wireless communication range of the first STA, the first subdevice can also receive Petition 870250091527, dated 07 / 10 / 2025, page 66 / 130 53 / 68 the wireless uplink signal from the first STA. The second subdevice is configured to transmit an optical uplink signal to the main device 101 via an optical fiber. The main device 101 is additionally configured to receive the optical uplink signal from the first subdevice and convert the optical uplink signal into an electrical uplink signal. When the main device 101 wirelessly communicates with the first STA via the second subdevice, the main device 101 can discard the electrical uplink signal received from the first subdevice.

[134] It can be learned from the previous description that subdevice 103 may not include a MAC layer processing unit or a physical layer processing unit. Therefore, subdevice 103 may not be able to buffer the downlink buffer data from the first STA at the MAC layer or physical layer. Therefore, main device 101 can buffer the downlink buffer data from the first STA. For example, the second downlink electrical signal transmitted by main device 101 through the second subdevice is downlink buffer data.

[135] It can be learned from the previous description that the main device 101 can switch the subdevice that performs wireless communication with the first STA. The main device 101 can switch the subdevice that performs wireless communication with the first STA as follows. The first subdevice and the second subdevice are configured to receive the uplink wireless signal, for example, the first uplink wireless signal, from the first STA. The first subdevice and the second subdevice are additionally configured to convert the Petition 870250091527, dated 07 / 10 / 2025, page 67 / 130 The 54 / 68 wireless uplink signal is converted into an electrical uplink signal, the electrical uplink signal is converted into an optical uplink signal, and the optical uplink signal is transmitted to the main device 101. The main device 101 is additionally configured to obtain the first signal quality between the first subdevice and the first STA based on the optical uplink signal carried by the first subdevice, and to obtain the second signal quality between the second subdevice and the first STA based on the optical uplink signal carried by the second subdevice. For example, the main device 101 is configured to restore the optical uplink signal to a Wi-Fi physical layer signal and then obtain the signal quality based on the physical layer signal. Wi-Fi. The main device 101 is configured to determine, based on the first signal quality and the second signal quality, a sub-device with which the first STA performs wireless communication. For example, if the first signal quality is better than or equal to the second signal quality, the main device 101 determines that the first STA performs wireless communication with the first sub-device. If the second signal quality is better than the first signal quality, the main device 101 determines that the first STA performs wireless communication with the second sub-device.

[136] It should be understood that in the previous example, only one instance in which the first subdevice is subdevice 103 is used for description. In the actual application, for descriptions of another subdevice, refer to the descriptions of subdevice 103. When the other subdevice also moves the related physical layer processing and / or the related MAC layer processing to the main device 101, the costs of the other subdevice can be reduced, so that the costs of the optical communication system are also reduced. The Petition 870250091527, dated 07 / 10 / 2025, page 68 / 130 55 / 68 Physical layer related processing includes uplink-related processing of the physical layer and / or downlink-related processing of the physical layer. MAC layer related processing includes uplink-related processing of the MAC layer and / or downlink-related processing of the MAC layer.

[137] In actual application, the main device 101 can also be associated with an STA via a wireless module. To reduce the costs of the main device 101, the wireless module can include the MAC layer processing unit and / or the physical layer processing unit of the main device 101 in FIG. 2 to FIG. 5.1. For example, the wireless module includes the MAC layer processing unit 302 and the physical layer processing unit 402. It is assumed that the main device 101 is associated with a target STA; in this case, the wireless module can be configured to process an uplink electrical signal from the first STA, and can be configured to process an uplink electrical signal from the target STA.

[138] In this embodiment of this application, the plurality of subdevices is connected to the main device 101 through the optical splitter 102. To avoid a conflict between a plurality of uplink optical signals, the main device 101 can allocate respective uplink slots to the subdevices. The uplink slot includes start time and duration. The slot allocation process can also be called bandwidth allocation. Each subdevice sends an uplink optical signal in a specified slot. For example, the main device 101 allocates a first uplink slot to the first subdevice. The first subdevice transmits the first uplink optical signal to the main device 101 in the first uplink slot. The Petition 870250091527, dated 07 / 10 / 2025, page 69 / 130 56 / 68 main device 101 allocates a second uplink slot to the second subdevice. The second subdevice transmits the second optical uplink signal to main device 101 in the second uplink slot. Main device 101 can allocate uplink slots to subdevices in any of the following ways.

[139] In one way, the main device 101 divides an optical slot into an uplink slot and a downlink slot. The main device 101 allocates the uplink slot to a plurality of subdevices. The main device 101 obtains a plurality of frequency bandwidths. The plurality of frequency bandwidths is in one-to-one correspondence with the plurality of subdevices. Each frequency bandwidth indicates a communication frequency bandwidth between a subdevice and a STA. The main device 101 allocates respective bandwidths to the plurality of subdevices based on the plurality of frequency bandwidths. The main device 101 calculates the allocated duration based on the allocated bandwidth. The main device 101 can allocate start time for an uplink slot according to any rule.

[140] In a second way, the main device 101 obtains buffer information in one-to-one correspondence with the subdevices. Each piece of buffer information includes uplink buffer information and / or downlink buffer information. For example, the main device 101 obtains the first buffer information corresponding to the first subdevice. The first buffer information includes the first uplink buffer information and / or the first downlink buffer information. The first uplink buffer information Petition 870250091527, dated 07 / 10 / 2025, pp. 70 / 130 57 / 68 upward indicates the size of the data to be loaded from the first STA. The first downward link buffer information represents a size of downward link data to be sent to the first STA by the main device 101 or the first subdevice. The main device 101 allocates an optical slot for the plurality of subdevices based on the plurality of buffer information chunks. The optical slot includes an upward link slot and / or a downward link slot.

[141] In this embodiment of this application, subdevice 103 may not include a MAC layer processing unit. The MAC layer processing unit is related to an air interface contention function. As a result, the absence of the MAC layer processing unit is not conducive to air interface contention being performed by subdevice 103. Therefore, in this embodiment of this application, the main device 101 may perform air interface scheduling for the plurality of subdevices. Descriptions are provided below using an example.

[142] The main device 101 obtains a plurality of buffer information chunks. The plurality of subdevices is in one-to-one correspondence with the plurality of buffer information chunks. Each buffer information chunk includes uplink buffer information and / or downlink buffer information. For example, the main device 101 obtains the first buffer information corresponding to the first subdevice. The first buffer information includes the first uplink buffer information and / or the first downlink buffer information. The first uplink buffer information indicates the size of the data to be loaded from the first STA. The first downlink buffer information represents a Petition 870250091527, dated 07 / 10 / 2025, page 71 / 130 58 / 68 downlink data size to be sent to the first STA by the main device 101. The main device 101 allocates air interface transmission time slots to the plurality of subdevices based on the plurality of buffer information chunks. For example, the main device 101 allocates a first time slot to the first subdevice. The main device 101 allocates a second time slot to the second subdevice. The main device 101 can send a plurality of scheduling information chunks to the plurality of subdevices. Each scheduling information chunk includes information about a corresponding time slot. For example, the main device 101 sends the first scheduling information to the first subdevice, where the first scheduling information includes information about the first time slot.The first subdevice performs the air interface transmission in the first time period based on the initial scheduling information.

[143] The first time period includes an uplink period and / or a downlink period. When the first time period includes the uplink time period, the first subdevice sends a downlink wireless first signal to the first STA during the uplink time period. When the first time period includes the uplink period, the first access device sends a trigger frame to the first STA. The trigger frame is used to allocate an uplink slot for wireless transmission to the first STA, and instructs the first STA to carry an uplink wireless first signal during the uplink time period. When the first time period includes both the uplink and downlink periods, the uplink period is used by the first STA to send a Petition 870250091527, dated 07 / 10 / 2025, page 72 / 130 59 / 68 first uplink wireless signal, and the downlink period is used by the first subdevice to send a first downlink wireless signal to the first STA.

[144] It should be understood that, in actual application, the main device 101 may not need to send the scheduling information to the subdevice. For example, in this embodiment of this application, after the subdevice receives a downlink optical signal from the main device 101, the subdevice immediately converts the downlink optical signal into a downlink electrical signal, and converts the downlink electrical signal into a downlink wireless signal using a radio frequency unit. Therefore, an initial moment of the downlink time period can be determined based on a final transmission moment of the downlink optical signal, and the transmission duration of the downlink time period can be determined based on the transmission duration of the downlink optical signal, the optical slot bandwidth, and the wireless communication bandwidth.Therefore, the main device 101 can allocate the downlink time slot by allocating the downlink slot in the optical slot. Similarly, the main device 101 can send the trigger frame to the STA via the subdevice. After receiving the trigger frame, the subdevice immediately sends the trigger frame to the STA. The trigger frame is used to allocate an uplink slot for wireless transmission, i.e., an uplink time slot, to the STA. Therefore, the main device 101 can allocate the uplink time slot using the trigger frame. In this embodiment of this application, the second time slot can include an uplink time slot. Therefore, the first. Petition 870250091527, dated 07 / 10 / 2025, page 73 / 130 Subdevice 60 / 68 can send a silence instruction to the first STA. The first STA is in a silent state based on the silence instruction. The silent state means that even if the first STA includes uplink buffer data to be sent to the first subdevice, the first STA does not obtain an air interface transmission opportunity through air interface contention. The first STA carries the first uplink buffer information to await the first subdevice to send the trigger frame, and obtains an air interface transmission opportunity using the trigger frame.

[145] In this embodiment of this application, subdevice 103 may alternatively include a MAC layer processing unit. Therefore, subdevice 103 may satisfy an air interface contention condition. In this case, the main device 101 may also perform air interface scheduling for the plurality of subdevices. Descriptions are provided below using an example.

[146] The main device 101 obtains a plurality of buffer information chunks. The plurality of subdevices is in one-to-one correspondence with the plurality of buffer information chunks. The main device 101 determines an air interface transmission sequence from the plurality of subdevices based on the plurality of buffer information chunks. The main device 101 sequentially sends control instructions to the plurality of subdevices based on the air interface transmission sequence. For example, the main device 101 first sends a first control instruction to the first subdevice. The first subdevice is configured to perform air interface contention based on the first control instruction, and performs air interface transmission after air interface contention is well established. Petition 870250091527, dated 07 / 10 / 2025, page 74 / 130 61 / 68 successful. Air interface transmission may include uplink air interface transmission and / or downlink air interface transmission. For descriptions of uplink air interface transmission and / or downlink air interface transmission, see the descriptions of uplink time period and / or downlink time period. After successful air interface contention, the first subdevice is configured to send a first response frame to the main device. Based on the first response frame, the main device 101 is further configured to send a second control instruction to a second subdevice based on the air interface transmission sequence.The second subdevice is configured to perform air interface contention based on the second control instruction, and to perform air interface transmission after the air interface contention is successful. Similarly, the second subdevice sends a second response frame to the main device 101 after the air interface contention is successful. The main device 101 then sends a control instruction to a subsequent subdevice based on the second response frame.

[147] In the actual application, the main device 101 can also be associated with the STA. Therefore, in the previous solution, in which the main device 101 performs the air interface scheduling for the plurality of subdevices, the main device 101 can additionally obtain buffer information from the main device 101. The main device 101 determines an air interface transmission sequence from the main device 101 and the plurality of subdevices based on the plurality of buffer information and the buffer information from the main device 101, or the main device 101 allocates air interface transmission time periods for Petition 870250091527, dated 07 / 10 / 2025, page 75 / 130 62 / 68 the main device 101 and the plurality of sub-devices based on the plurality of buffer information chunks and the buffer information of the main device 101.

[148] FIG. 10 is a sixth diagram of a communication system structure according to an embodiment of this application. As shown in FIG. 10, based on FIG. 1, the communication system 100 additionally includes a main gateway 1001, an optical splitter 1002, a main device 1003, and a main device 1004. The main gateway 1001 can be an OLT. The main gateway 1001 is connected to a plurality of main devices via the optical splitter 1002. In an example in FIG. 10, the plurality of main devices includes a main device 101, the main device 1003, and the main device 1004. The main device can be an ONU or an ONT. In the uplink direction, the uplink optical signals from the main devices are coupled to the main gateway 1001 via the optical splitter 1002 in a time-split manner.In the downlink direction, the main gateway 1001 allocates downlink optical signals to all main devices via the optical splitter 1002.

[149] The above describes the optical communication system provided in this application. The optical communication method provided in this application is described below. FIG. 11 is a first schematic flowchart of an optical communication method according to an embodiment of this application. As shown in FIG. 11, the optical communication method includes the following steps.

[150] In step 1101, a first subdevice receives a first uplink wireless signal from a STA.

[151] In step 1102, the first subdevice obtains a first uplink electrical signal based on the first uplink wireless signal. Petition 870250091527, dated 07 / 10 / 2025, page 76 / 130 63 / 68

[152] A subdevice may also be called a subgateway or AP. In a PON system, the subdevice may be called a sub ONU or sub ONT. In an FTTR scenario, the subdevice may be called a sub SFU or sub FTTR. The first subdevice includes a wireless module. The wireless module includes a radio frequency unit. The first subdevice receives the first uplink wireless signal from the first STA via the radio frequency unit, and obtains the first uplink electrical signal based on the first uplink wireless signal.

[153] In step 1103, the first subdevice converts the first uplink electrical signal into a first uplink optical signal.

[154] In step 1104, the first subdevice transmits the first uplink optical signal to a main device, where the main device performs uplink-related processing on the first uplink optical signal to obtain a first service packet, and the uplink-related processing of the main device includes the first uplink-related processing of a MAC layer.

[155] In the PON system, the main device 101 may be called the main ONU or main ONT. In the FTTR scenario, the main device may be called the main MFU or main FTTR. The main device includes a photoelectric conversion unit and a MAC layer processing unit. The photoelectric conversion unit is configured to convert the first uplink optical signal into the first uplink electrical signal. The MAC layer processing unit may be a MAC chip. The MAC layer processing unit is configured to perform the first uplink-related MAC layer processing on the first uplink electrical signal, to obtain Petition 870250091527, dated 07 / 10 / 2025, page 77 / 130 64 / 68 the first service package.

[156] FIG. 12 is a second schematic flowchart of an optical communication method according to an embodiment of this application. As shown in FIG. 12, the optical communication method includes the following steps.

[157] In step 1201, a main device receives a first uplink optical signal from a first subdevice.

[158] In step 1202, the main device converts the first optical uplink signal into a first electrical uplink signal.

[159] The main device is connected to the first subdevice via an optical fiber. The main device receives the first optical uplink signal from the first subdevice through the optical fiber. The first optical uplink signal is obtained based on a first wireless uplink signal sent by a first STA. The main device includes an optical module. The optical module is configured to convert the first optical uplink signal into the first electrical uplink signal.

[160] In step 1203, the main device performs uplink-related processing on the first uplink electrical signal to obtain a first service packet, where the uplink-related processing includes the first uplink-related processing of a MAC layer.

[161] At step 1204, the main device sends the first service packet.

[162] The main device additionally includes a MAC layer processing unit. The MAC layer processing unit may be a MAC chip. The MAC layer processing unit is configured to perform the Petition 870250091527, dated 07 / 10 / 2025, page 78 / 130 65 / 68 first uplink-related MAC layer processing on the first uplink electrical signal, to obtain the first service packet. The main device emits the first service packet. For example, the main device is a main ONU. The main device additionally includes another optical module. The other optical module is configured to convert the first service packet into a third uplink optical signal, and transmit the third uplink optical signal to an OLT. The OLT is configured to send the third uplink optical signal to a public network.

[163] It should be understood that the descriptions of the optical communication method in FIG. 11 and FIG. 12 are similar to the descriptions of the optical communication system in FIG. 1 to FIG. 10. Therefore, for the descriptions of the optical communication method, refer to the descriptions of the optical communication system in FIG. 1 to FIG. 10. For example, the first uplink-related MAC layer processing includes A-MSDU analysis. In another example, the MAC layer processing unit is additionally configured to perform the second uplink-related MAC layer processing on the first uplink electrical signal. In another example, the main device is additionally configured to receive a second service packet, and perform the first downlink-related MAC layer processing on the second service packet, to obtain a first downlink electrical signal.

[164] FIG. 13 is a diagram of a structure of a first subdevice according to an embodiment of this application. As shown in FIG. 13, the first subdevice 1300 includes a wireless module 1301 and a photoelectric conversion unit 1302. The wireless module 1301 is configured to receive a first uplink wireless signal from a Petition 870250091527, dated 07 / 10 / 2025, page 79 / 130 66 / 68 STA, and obtain a first uplink electrical signal based on the first uplink wireless signal. The 1302 photoelectric conversion unit is configured to convert the first uplink electrical signal into a first uplink optical signal, and transmit the first uplink optical signal to a main device. The main device performs uplink-related processing on the first uplink optical signal to obtain a first service packet.

[165] It should be understood that the descriptions of the first subdevice 1300 in FIG. 13 are similar to the descriptions of the optical communication system in FIGS. 1 to 10. The wireless module 1301 may be the wireless module 201 in FIG. 2, the wireless module 301 in FIG. 3, the wireless module 401 in FIG. 4, or the wireless module 501 in FIG. 5. The photoelectric conversion unit 1302 may be the photoelectric conversion unit 202 in FIGS. 2 to 5. Therefore, for the descriptions of the first subdevice, refer to the descriptions of the optical communication system in FIGS. 1 to 10. For example, the wireless module 1301 includes a radio frequency unit and a physical layer processing unit. The radio frequency unit is configured to convert the first uplink wireless signal into an electrical signal.The physical layer processing unit is configured to perform uplink-related processing of a physical layer on the electrical signal, to obtain the first uplink electrical signal. In another example, the 1302 photoelectric conversion unit is additionally configured to receive a first downlink optical signal from the main device, and convert the first downlink optical signal into a first downlink electrical signal.

[166] FIG. 14 is a diagram of a structure of a main device according to an embodiment of this application. Petition 870250091527, dated 07 / 10 / 2025, pp. 80 / 130 67 / 68 As shown in FIG. 14, the main device 1400 includes a photoelectric conversion unit 1401 and a processor 1402. The photoelectric conversion unit 1401 is configured to receive a first optical uplink signal from a first subdevice, and convert the first optical uplink signal into a first electrical uplink signal. The processor 1402 may be a central processing unit (CPU), a network processor (NP), or a combination of a CPU and an NP. The processor 1402 may also include a hardware chip or other general-purpose processor. The hardware chip may be an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof.Processor 1402 is configured to perform the first uplink-related processing of a MAC layer on the first uplink electrical signal, in order to obtain a first service packet. Processor 1402 is additionally configured to emit the first service packet.

[167] It should be understood that the descriptions of the main device 1400 in FIG. 14 are similar to the descriptions of the optical communication system in FIG. 1 to FIG. 10. The processor 1402 could be processor 220 in FIG. 2, processor 320 in FIG. 3, the 420 processor in FIG. 4, or the 520 processor in FIG. 5. The photoelectric conversion unit 1401 may be the photoelectric conversion unit 203 in FIG. 2 to FIG. 5. Therefore, for descriptions of the main device, refer to the descriptions of the optical communication system in FIG. 1 to FIG. 10. For example, the processor 1402 is a MAC layer processing unit. The 1402 processor is additionally configured to perform the second processing related to the uplink layer. MAC in the first uplink electrical signal. Like another Petition 870250091527, dated 07 / 10 / 2025, page 81 / 130 In the 68 / 68 example, the 1401 photoelectric conversion unit is additionally configured to receive a second service packet and perform the first downlink-related MAC layer processing on the second service packet to obtain a first downlink electrical signal.

[168] In another embodiment, the first subdevice 1300 and / or the main device 1400 may additionally include memory. The memory may be volatile or non-volatile, or may include both volatile and non-volatile memory. Non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), flash memory, or the like. Volatile memory may be random access memory (RAM). The memory may be configured to store the first uplink electrical signal.

[169] The descriptions above are merely specific implementations of this application, but are not intended to limit the scope of protection of this application. Any variation or substitution easily understood by a person skilled in the art, within the technical scope disclosed in this application, will be covered by the scope of protection of this application. Petition 870250091527, dated 07 / 10 / 2025, page 82 / 130

Claims

1 / 14 CLAIMS 1. An optical communication method, characterized in that it comprises: receiving, by a main device, a first optical uplink signal from a first subdevice; converting, by the main device, the first optical uplink signal into a first electrical uplink signal; performing, by the main device, uplink-related processing on the first electrical uplink signal to obtain a first service packet, wherein the uplink-related processing comprises the first uplink-related processing of a MAC medium access control layer; and transmitting, by the main device, the first service packet.

2. Optical communication method, according to claim 1, characterized in that the first uplink electrical signal is a digital I / Q phase / quadrature signal; and the uplink-related processing performed by the main device on the first uplink electrical signal further comprises the second uplink-related processing of a physical layer, the first uplink-related processing of the physical layer, and the second uplink-related processing of the MAC layer.

3. Optical communication method, according to claim 1, characterized in that the uplink-related processing performed by the main device on the first uplink electrical signal further comprises the first uplink-related processing of a physical layer and the second uplink-related processing of the MAC layer.

4. Optical communication method, according to claim 1, characterized in that the uplink-related processing performed by the main device on the first uplink electrical signal additionally comprises the second uplink-related processing of the MAC layer.

5. Optical communication method, according to claim 4, characterized in that the method further comprises: sending, by the main device, incremental signaling to the first subdevice, wherein the incremental signaling comprises a frame identifier and information about a variable field, the frame identifier is used by the first subdevice to obtain a first set of fixed fields based on a first mapping relationship, the first mapping relationship comprises a mapping relationship between a plurality of frame identifiers and a plurality of sets of fixed fields, and the variable field is used by the first subdevice to obtain a first control frame based on the variable field and the first set of fixed fields.

6. Optical communication method, according to any one of claims 1 to 5, characterized in that the method further comprises: performing, by the main device, downlink-related processing on a second service packet to obtain a first downlink electrical signal, wherein the downlink-related processing comprises the first downlink-related processing of the MAC layer; converting, by the main device, the first downlink electrical signal into a first downlink optical signal; and transmitting, by the main device, the first downlink optical signal to the first subdevice.

7. Optical communication method, according to claim 6, characterized in that the downlink-related processing performed by the main device in the second service packet additionally comprises the second downlink-related processing of the MAC layer, the first downlink-related processing of the physical layer, and the second downlink-related processing of the physical layer.

8. Optical communication method, according to claim 6, characterized in that the downlink-related processing performed by the main device in the second service packet additionally comprises the second downlink-related processing of the MAC layer and the first downlink-related processing of the physical layer.

9. Optical communication method, according to claim 6, characterized in that the downlink-related processing performed by the main device in the second service packet additionally comprises the second downlink-related processing of the MAC layer.

10. Optical communication method, according to any one of claims 6 to 9, characterized in that the main device is connected to a second sub-device via an optical splitter.

11. Optical communication method, according to claim 10, characterized in that the method further comprises: receiving, by the main device, a second optical uplink signal from the second subdevice; converting, by the main device, the second optical uplink signal into a second electrical uplink signal; and performing, by the main device, the uplink-related processing on the second electrical uplink signal to obtain a third service packet.

12. Optical communication method, according to claim 10 or 11, characterized in that the method further comprises: receiving, by the main device, a fourth service packet; performing, by the main device, downlink-related processing on the fourth service packet to obtain a second downlink electrical signal; and converting, by the main device, the second downlink electrical signal into a second downlink optical signal, and transmitting the second downlink optical signal to the second subdevice.

13. Optical communication method, according to any one of claims 10 to 12, characterized in that the method further comprises: allocating, by the main device, a first uplink slot for the first subdevice, and allocating a second uplink slot for the second subdevice, wherein the first uplink slot is different from the second uplink slot; receiving, by the main device, the first optical uplink signal from the first subdevice comprises: receiving, by the main device, the first optical uplink signal from the first subdevice in the first uplink slot; and receiving, by the main device, the second optical signal. Petition 870250091527, dated 07 / 10 / 2025, p.86 / 130 5 / 14 uplink from the second subdevice comprises: receiving, by the main device, the second optical uplink signal from the second subdevice in the second uplink slot.

14. Optical communication method, characterized in that it comprises: receiving, by a first subdevice, a first uplink wireless signal from a STA station; obtaining, by the first subdevice, a first uplink electrical signal based on the first uplink wireless signal; converting, by the first subdevice, the first uplink electrical signal into a first uplink optical signal; and transmitting, by the first subdevice, the first uplink optical signal to a main device, wherein the main device performs uplink-related processing on the first uplink optical signal to obtain a first service packet, and the uplink-related processing of the main device comprises the first uplink-related processing of a MAC medium access control layer.

15. Optical communication method, according to claim 14, characterized in that the first uplink electrical signal is a digital I / Q phase / quadrature signal.

16. Optical communication method, according to claim 14 or 15, characterized in that the first uplink-related MAC layer processing comprises one or more of the following: analysis of the A-MPDU aggregation MAC protocol data unit, CRC cyclic redundancy check, ACK, BA block acknowledgment, and analysis of the A-MSDU aggregation MAC service data unit. Petition 870250091527, dated 10 / 07 / 2025, p. 87 / 130 6 / 14 17. Optical communication method, according to claim 14, characterized in that obtaining, by the first subdevice, the first uplink electrical signal based on the first uplink wireless signal comprises: converting, by the first subdevice, the first uplink wireless signal into an electrical signal, and performing the second uplink-related processing of a physical layer on the electrical signal, to obtain the first uplink electrical signal.

18. Optical communication method, according to claim 17, characterized in that the second uplink-related physical layer processing comprises at least one of the following: uplink-related physical layer processing, and the uplink-related physical layer processing comprises synchronization, Fast Fourier Transform (FFT), constellation mapping, unscrambling, and restoration of a Medium Access Control Protocol (MPDU) data unit.

19. Optical communication method, according to claim 14, characterized in that obtaining, by the first subdevice, the first uplink electrical signal based on the first uplink wireless signal comprises: converting, by the first subdevice, the first uplink wireless signal into an electrical signal, and performing the second uplink-related processing of a physical layer and the first uplink-related processing of the physical layer on the electrical signal sequentially, to obtain the first uplink electrical signal.

20. Optical communication method, according to claim 19, characterized in that Petition 870250091527, dated 10 / 07 / 2025, page 88 / 130 7 / 14 the first uplink-related physical layer processing comprises a first uplink-related physical layer processing subset, the second uplink-related physical layer processing comprises a second uplink-related physical layer processing subset, the uplink-related physical layer processing comprises synchronization, Fast Fourier Transform (FFT), constellation mapping, unscrambling, and restoration of a Media Access Control Protocol Data Unit (MPDU), and the first subset is different from the second subset.

21. Optical communication method, according to claim 14, characterized in that obtaining, by the first subdevice, the first uplink electrical signal based on the first uplink wireless signal comprises: converting, by the first subdevice, the first uplink wireless signal into an electrical signal, and performing the second uplink-related processing of a physical layer, the first uplink-related processing of the physical layer and the second uplink-related processing of the MAC layer on the electrical signal sequentially, to obtain the first uplink electrical signal.

22. Optical communication method, according to claim 21, characterized in that the first uplink-related MAC layer processing comprises a first uplink-related MAC layer processing subset, the second uplink-related MAC layer processing comprises a second uplink-related MAC layer processing subset, the uplink-related MAC layer processing comprises A-MPDU aggregation protocol MAC data unit analysis, cyclic redundancy check CRC, ACK or BA block acknowledgment, and A-MSDU aggregation service MAC data unit analysis, and the first subset is different from the second subset.

23. Optical communication method, according to any one of claims 19 to 22, characterized in that the method further comprises: receiving, by the first subdevice, incremental signaling from the main device, wherein the incremental signaling comprises a frame identifier and information about a variable field; obtaining, by the first subdevice, a first set of fixed fields based on the frame identifier and a first mapping relationship, wherein the first mapping relationship comprises a mapping relationship between a plurality of frame identifiers and a plurality of sets of fixed fields; obtaining, by the first subdevice, a first control frame based on the variable field and the first set of fixed fields; and sending, by the first subdevice, the first control frame to the STA.

24. Optical communication method, according to claim 23, characterized in that a frame format of the first control frame conforms to a specification in the 802.11 protocol.

25. Optical communication method, according to claim 23 or 24, characterized in that the first control frame is an acknowledgment ACK frame, and the frame identifier indicates that a type of the first control frame is the ACK frame; the information on the variable field comprises at least one of the following: information on a duration field, a destination address field, a frame verification sequence field, a fragment indicator field, a retry indicator, and an extension field; and the first set of fixed fields comprises at least one of the following: information on a distributed system indicator for a distributed system indicator for a power management indicator, and a protected field.

26. Optical communication method, according to any one of claims 14 to 25, characterized in that the method further comprises: receiving, by the first subdevice, a first optical downlink signal from the main device; converting, by the first subdevice, the first optical downlink signal into a first electrical downlink signal, wherein the first electrical downlink signal is obtained after the main device performs downlink-related processing on a second service packet, and the downlink-related processing comprises the first downlink-related processing of the MAC layer; obtaining, by the first subdevice, a first wireless downlink signal based on the first electrical downlink signal; and sending, by the first subdevice, the first wireless downlink signal to the STA.

27. Optical communication method, according to claim 26, characterized in that obtaining, by the first subdevice, the first downlink wireless signal based on the first downlink electrical signal comprises: performing, by the first subdevice, the second downlink-related physical layer processing on the first downlink electrical signal, and obtaining the first downlink wireless signal based on a processed electrical signal.

28. Optical communication method, according to claim 26, characterized in that obtaining, by the first subdevice, the first downlink wireless signal based on the first downlink electrical signal comprises: performing, by the first subdevice, the first downlink-related physical layer processing and the second downlink-related physical layer processing on the first downlink electrical signal sequentially, and obtaining the first downlink wireless signal based on a processed electrical signal.

29. Optical communication method, according to claim 26, characterized in that obtaining, by the first subdevice, the first downlink wireless signal based on the first downlink electrical signal comprises: performing, by the first subdevice, the second downlink-related processing of the MAC layer, the first downlink-related processing of the physical layer and the second downlink-related processing of the physical layer on the first downlink electrical signal sequentially, and obtaining the first downlink wireless signal based on a processed electrical signal.

30. Main device, characterized in that it comprises a photoelectric conversion unit and a processor, wherein the photoelectric conversion unit is configured to receive a first uplink optical signal from a first subdevice, and convert the first uplink optical signal into a first uplink electrical signal; the processor is configured to perform uplink-related processing on the first uplink electrical signal to obtain a first service packet, wherein the uplink-related processing comprises the first uplink-related processing of a MAC medium access control layer; and the processor is further configured to emit the first service packet.

31. Main device, according to claim 30, characterized in that the first uplink electrical signal is a digital I / Q phase / quadrature signal; and the uplink-related processing performed by the main device on the first uplink electrical signal further comprises the second uplink-related processing of a physical layer, the first uplink-related processing of the physical layer, and the second uplink-related processing of the MAC layer.

32. Main device, according to claim 30, characterized in that: the uplink-related processing performed by the main device on the first uplink electrical signal further comprises the first uplink-related processing of a physical layer and the second uplink-related processing of the MAC layer.

33. Main device, according to claim 30, characterized in that: the uplink-related processing performed by the main device on the first uplink electrical signal additionally comprises the second uplink-related processing of the MAC layer.

34. Main device, according to claim 33, characterized in that: the photoelectric conversion unit is additionally configured to send, by the main device, incremental signaling to the first subdevice, wherein the incremental signaling comprises a frame identifier and information about a variable field, the frame identifier is used by the first subdevice to obtain a first set of fixed fields based on a first mapping relationship, the first mapping relationship comprises a mapping relationship between a plurality of frame identifiers and a plurality of sets of fixed fields, and the variable field is used by the first subdevice to obtain a first control frame based on the variable field and the first set of fixed fields.

35. Main device, according to any one of claims 30 to 34, characterized in that: the processor is additionally configured to perform downlink-related processing in a second service packet to obtain a first downlink electrical signal, wherein the downlink-related processing comprises the first downlink-related processing of the MAC layer; and the photoelectric conversion unit is additionally configured to convert the first downlink electrical signal into a first downlink optical signal, and transmit the first downlink optical signal to the first subdevice.

36. Subdevice, characterized in that it comprises a wireless module and a photoelectric conversion unit, wherein the wireless module is configured to receive a first uplink wireless signal from a STA station, and to obtain a first uplink electrical signal based on the first uplink wireless signal; and the photoelectric conversion unit is configured for Petition 870250091527, dated 07 / 10 / 2025, page 1.94 / 130 13 / 14 convert the first uplink electrical signal into a first uplink optical signal, and transmit the first uplink optical signal to a main device, wherein the main device performs uplink-related processing on the first uplink optical signal to obtain a first service packet, and the uplink-related processing of the main device comprises the first uplink-related processing of a MAC medium access control layer.

37. Subdevice, according to claim 36, characterized in that the first uplink electrical signal is a digital I / Q phase / quadrature signal.

38. Subdevice, according to claim 36, characterized in that: the wireless module is configured to obtain the first uplink electrical signal based on the first uplink wireless signal, comprising: the wireless module is configured to convert the first uplink wireless signal into an electrical signal, and perform the second uplink-related processing of a physical layer on the electrical signal, to obtain the first uplink electrical signal.

39. Subdevice, according to claim 36, characterized in that: the wireless module is configured to obtain the first uplink electrical signal based on the first uplink wireless signal, comprising: the wireless module is configured to convert the first uplink wireless signal into an electrical signal, and perform the second uplink-related processing of a physical layer and the first uplink-related processing of the physical layer on the electrical signal sequentially, to obtain the first uplink electrical signal.

40. Subdevice, according to claim 36, characterized in that: the wireless module is configured to obtain the first uplink electrical signal based on the first uplink wireless signal, comprising: the wireless module is configured to convert the first uplink wireless signal into an electrical signal, and perform the second uplink-related processing of a physical layer, the first uplink-related processing of the physical layer, and the second uplink-related processing of the MAC layer on the electrical signal sequentially, to obtain the first uplink electrical signal. Petition 870250091527, dated 10 / 07 / 2025, pp. 96 / 130

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