Method for raising property of lanthanum barium manganese oxide film by laser irradiation
A technology of laser irradiation and thin film, applied in ion implantation plating, metal material coating process, coating and other directions, can solve the problems of long time and insignificant TCR value effect of LBMO film, and achieve the improvement of production efficiency and the improvement of laser irradiation. The effect of short exposure time and reduced production cost
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Embodiment 1
[0016] (1) Cleaning the substrate: ①Use acetone and absolute ethanol to ultrasonically clean the substrate in sequence; ②After ultrasonic cleaning, rinse with deionized water repeatedly, and after drying, place the substrate on a silicon plate heater;
[0017] (2) Vacuumize the system and heat the silicon plate: vacuumize the vacuum chamber to 5×10 -5 Pa, then heat the silicon plate and heat it while vacuuming, so that the temperature of the silicon plate rises to 700°C and the pressure in the vacuum chamber is kept at 2×10 -4 Pa;
[0018] (3) Thin film deposition: when the temperature of the silicon plate reaches 700°C and the pressure in the vacuum chamber is 2×10 -4 After Pa, fill the vacuum chamber with oxygen to keep the vacuum chamber at a flow oxygen partial pressure of 5 Pa. After the system is stabilized, the excimer laser bombards La 0.67 Ba 0.33 MnO 3 polycrystalline target;
[0019] (4) Cooling: After the deposition, the silicon plate is cooled to room tempera...
Embodiment 2
[0023] (1) Cleaning the substrate: ①Use acetone and absolute ethanol to ultrasonically clean the substrate in sequence; ②After ultrasonic cleaning, rinse with deionized water repeatedly, and after drying, place the substrate on a silicon plate heater;
[0024] (2) Vacuumize the system and heat the silicon plate: vacuumize the vacuum chamber to 5×10 -4 Pa, then heat the silicon plate and heat it while vacuuming, so that the temperature of the silicon plate rises to 750°C and the pressure in the vacuum chamber is kept at 5×10 -4 Pa;
[0025] (3) Thin film deposition: when the temperature of the silicon plate reaches 750°C and the pressure in the vacuum chamber is 5×10 -4 After Pa, fill the vacuum chamber with oxygen to keep the flow oxygen partial pressure of 30Pa in the vacuum chamber. After the system is stable, bombard La with excimer laser. 0.67 Ba 0.33 MnO 3 polycrystalline target;
[0026] (4) Cooling down: After the deposition is finished, the silicon plate is cooled...
Embodiment 3
[0030] (1) Cleaning the substrate: ①Use acetone and absolute ethanol to ultrasonically clean the substrate in sequence; ②After ultrasonic cleaning, rinse with deionized water repeatedly, and after drying, place the substrate on a silicon plate heater;
[0031] (2) Vacuumize the system and heat the silicon plate: vacuumize the vacuum chamber to 3×10 -4 Pa, then heat the silicon plate and heat it while vacuuming, so that the temperature of the silicon plate rises to 850°C and the pressure in the vacuum chamber is kept at 3×10 -4 Pa;
[0032] (3) Thin film deposition: when the temperature of the silicon plate reaches 850°C and the pressure in the vacuum chamber is 3×10 -4 After Pa, fill the vacuum chamber with oxygen to maintain a flow oxygen partial pressure of 80Pa in the vacuum chamber. After the system is stable, use an excimer laser to bombard La 0.67 Ba 0.33 MnO 3 polycrystalline target;
[0033] (4) Cooling down: After the deposition is finished, the silicon plate is co...
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