System for cleaning substrate

Abstract

Disclosed is a system for cleaning a substrate such as a semiconductor wafer in wet type to thereby reduce airborne molecular contaminants (AMCs) in a wet station and a cleaning room by efficiently exhausting fumes generated during a wet cleaning process. The system for cleaning the substrate includes: a housing; a plurality of bathes placed inside of the housing; a transferring means placed on a top portion of the plurality of bathes for transferring a substrate; a first exhausting means connected to the plurality of bathes for exhausting fumes inside of the plurality of bathes; and a second exhausting means placed in a space inside of the housing and outside of the plurality of bathes for exhausting chemical fumes.

Description

technical field [0001] The present invention relates to a system for wet cleaning substrates, such as semiconductor wafers; airborne molecular pollutants (airborne molecular contaminant, AMC). Background technique [0002] As is well known, after performing a series of steps such as depositing a thin layer, etching, polishing and implanting ions, the substrate should be subjected to a wet cleaning process to continue the subsequent process. The wet station contains multiple dip tanks, which have different chemistries; and thus, the substrate is sequentially transferred to each dip tank placed close to each other. [0003] Figure 1 is a diagram conceptually illustrating a conventional chemical mechanical polishing (CMP) wet station. [0004] As shown, a plurality of dipping tanks 102A, 102B, 102C and 102D are placed at the bottom portion of the housing 101 . For the substrate transfer device, a plurality of robot arms 103A, 103B, 103C, 103D and 103E are placed in the top p...

AI Technical Summary

Problems solved by technology

[0010] Moreover, the inside of the housing is not a closed space from the clean room, and therefore, the pollution of the clean room also becomes serious

Specifically, the fumes are diffused into the clean room outside the housing through the holes for putting the substrates into and taking out the substrates from the housing and through the gaps of the substrate inlets inside the housing, and these diffused fumes are harmful to the clean room. cleanliness creates a serious problem

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