Boiling-chamber type radiating apparatus
A technology of heat dissipation device and boiling chamber, applied in cooling/ventilation/heating transformation, instrument cooling, instrument and other directions, it can solve the difference between the contact between the heat absorption block and the heating element, increase the heat transfer load of the system fan, and the installation and positioning of the heat dissipation device. Inconvenience and other problems, to achieve the effect of improving heat dissipation efficiency
Inactive Publication Date: 2008-09-10
FU ZHUN PRECISION IND SHENZHEN +1
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Problems solved by technology
[0005] (1) The installation and positioning of the cooling device is inconvenient: because the installation of the cooling device must take into account the close contact between the heat absorbing block and the heating element and be fixed on the circuit board and the casing, the installation of the known cooling device is not perfect. Modular positioning design requires fixing the fans and cooling chambers one by one. In addition to increasing the time-consuming and labor-intensive installation and positioning, it is easy to produce contact differences between the heat-absorbing block and the heating element. The reliability of the product is difficult to control and does not meet mass production. Process Economics
[0006] (2) The air volume of the fan is not fully utilized: because the airflow generated by the fan is mixed with the air in the chassis after passing through the radiator, the airflow cannot be fully utilized to cool other heating elements on the circuit board, thus increasing the heat transfer of the system fan load
Method used
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[0019] Further description will be made below in conjunction with the embodiments with reference to the accompanying drawings.
[0020] Please refer to FIG. 1 to FIG. 7 , the boiling chamber heat sink is installed on a heating element, such as CPU100, to dissipate heat.
[0021] Figure 1 and figure 2 As shown, the boiling cavity heat dissipation device includes a radiator 10 , a fan 30 placed at the side end of the radiator 10 , and a wind guide 50 covering the radiator 10 and the fan 30 .
[0022] Referring to Fig. 3 and Fig. 4 at the same time, the radiator 10 includes a sealed cavity 12, a heat absorbing block 14 arranged at the bottom of the cavity 12, a base 15 closely connected with the top of the cavity 12, and a base 15 arranged on the base. A number of cooling fins 16 on the seat 15 and a fixed base plate 18 located at the bottom of the cavity 12, wherein air ducts 160 are formed between the cooling fins 16, and the heat-absorbing surface 140 of the heat-absorbing bl...
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The heat sink includes a radiator, a fan placed at side end of the radiator, and wind scooper in use for covering the radiator and fan. The radiator includes a cavity for accommodating liquid, and fixed base plate setup at base of the cavity. Two edges of the base plate are protruded out of the radiator, and there is at least one through hole on the protruded edge respectively. The wind scooper includes a top cover and two side plates. End of each side plate is extended outwards to form a clamped edge. A fixed hole is fixed on each clamped edge in the position corresponding to the said through hole on the protruded edge respectively. At least a fixed column in use for fixing the heat sink is setup at each clamped edge. Through modularity design, and using few bolts, the invention can fix the heat sink on circuit board and chassis, as well as positions heat absorption block and heating unit, and makes them thermocontact tightly.
Description
【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device used for heat dissipation of electronic components. 【Background technique】 [0002] With the continuous development of the electronic information industry, high-tech electronic products are developing toward thinner, lighter, smaller, multi-functional, and fast-running trends. However, the heat released by electronic components (such as CPU) per unit area is also increasing, resulting in Its further development must face the bottleneck of how to reduce the operating temperature of electronic components. In order to make high-tech electronic products play their due functions, designing high-efficiency and light-weight heat sinks has become an important challenge for the industry to develop the next generation of advanced electronic products. [0003] At present, many heat dissipation devices with different structures have been disclosed in patent documents i...
Claims
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IPC IPC(8): H01L23/34H05K7/20G12B15/00
Inventor 刘泰健
Owner FU ZHUN PRECISION IND SHENZHEN