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Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method

一种致冷设备、半导体的技术,应用在半导体器件、半导体/固态器件零部件、换热器外壳等方向,能够解决零部件不易实现标准化生产、不能实现工业化批量生产、焊接质量没有保证等问题,达到增加有效散热面积、生产加工工艺简单可靠、成品率高的效果

Inactive Publication Date: 2008-11-12
LUQUAN JIWEI ELECTRICAL APPLIANCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The horizontal tube generally adopts the welding of the light pipe and the standpipe. The heat dissipation area of ​​the original horizontal pipe and the standpipe is solved by using the light pipe plus welding heat dissipation wire and heat sink, so the gap between the light pipe, the heat dissipation wire and the heat sink is caused. For spot welding contact, not only the heat dissipation area is limited by the welding point, but also the heat transfer efficiency is only 20% to 30% of the overall structure heat transfer efficiency
This type of radiator has a large number of solder joints on the surface of the heat pipe, and the welding process is complicated, which can only be limited to manual welding, and cannot achieve industrialized mass production. It is difficult to achieve standardized production of parts and components, and the welding quality is not guaranteed.

Method used

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  • Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method
  • Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings, but they are not intended to limit the present invention.

[0028] The finned tubular radiator for semiconductor refrigeration equipment includes a heat dissipation cavity formed by welding the standpipe 1 and the upper and lower horizontal tubes and communicating with each other, and an evaporator 4 that communicates with the cooling cavity through pipelines. The two ends of the horizontal tube are blind ends. Strip fins 6 are distributed on the outer surfaces of the horizontal tube and the standpipe 1 , and the strip fins 6 are radially and equiangularly distributed on the outer surfaces of the tube walls of the horizontal tube and the standpipe 1 and extend in the axial direction. The horizontal tube is a tubular structure consisting of a bar-shaped end cap 2 with an arched section and a connecting plate 9 plugged at the strip-shaped opening of the bar-s...

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PUM

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Abstract

This invention relates to a radiator and its preparation method, and especially refers to a fin-pipe shaped radiator specially applied to semiconductor chilling unit and its preparation method. This radiator consists of vertical pipe and upper & lower horizontal pipe (both ends are blocked) welded into the heat radiation chamber, and the evaporator connected through pipeline with axially extending fins distributed on the external surface of the horizontal pipe and the vertical pipe in an angle "alpha" at the joint within the range of 0°<alpha<=90°. The main components are manufactured into sections by extruding, punching or other machining techniques and then soldered into a radiator. It has overcome the disadvantages of various and numerous welding points, complicated techniques and so on in existing manufactures, and has realized an industrialized batch production upon simple and reliable techniques.

Description

technical field [0001] The invention belongs to a radiator and a preparation method thereof, in particular to a fin-tube radiator for semiconductor refrigeration equipment and a preparation method thereof. Background technique [0002] The current public information shows that the overall structure of the standpipe radiator is completed by artificial assembly and welding by punching connection holes between the upper and lower horizontal pipes and the standpipe and adding cooling wires. The horizontal tube generally adopts the welding of the light pipe and the standpipe. The heat dissipation area of ​​the original horizontal pipe and the standpipe is solved by using the light pipe plus welding heat dissipation wire and heat sink, so the gap between the light pipe, the heat dissipation wire and the heat sink is caused. For spot welding contact, not only the heat dissipation area is limited by the welding point, but also the heat transfer efficiency is only 20% to 30% of the o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L35/02H01L23/34B23P15/26H10N10/80
CPCH01L2924/0002F28F2009/0292F28D15/0266H01L23/427F28F3/048F28F9/0224B23P15/26F28F2265/12F28F2255/16F28D2021/0031B23P2700/09Y10T29/49359H01L2924/00
Inventor 温金宇王双玲
Owner LUQUAN JIWEI ELECTRICAL APPLIANCE
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