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Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus

An electro-optical device and pattern technology, applied in semiconductor/solid-state device manufacturing, instruments, optics, etc., can solve problems such as inability to obtain patterns and deterioration of ink wettability.

Inactive Publication Date: 2008-12-03
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to prevent the adhesion of ink, the surface of the storage compartment is subjected to liquid-repellent treatment. However, if the storage compartment becomes liquid-repellent, if you want to overlap and form other patterns on the top, it will be sprayed on the storage compartment. The wettability of the ink on the weir deteriorates, and there is a problem that a good pattern cannot be obtained

Method used

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  • Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus
  • Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus
  • Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus

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Embodiment Construction

[0037] Below, illustrate the present invention in conjunction with accompanying drawing.

[0038] figure 1 It is a schematic diagram conceptually showing the method of forming a film pattern of the present invention.

[0039] The forming method of the film pattern of the present invention includes: the process of forming the first storage bank B1 on the substrate P; the process of disposing the first functional liquid L1 in the area divided by the first storage bank B1; drying (burning) Forming) the process of forming the first functional liquid L1 and forming the first film pattern F1; the process of forming the second storage cofferdam B2 on the first storage cofferdam B1; in the area divided by the second storage cofferdam B2 A step of disposing the second functional liquid L2; a step of drying (firing) the second functional liquid L2 to form the second film pattern F2.

[0040] In the method of forming the film pattern of the present invention, the film patterns F1 and F...

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Abstract

A method of forming a film pattern by arranging a functional liquid on a substrate includes; forming first banks having a lyophobic property on surfaces thereof; arranging a first functional liquid in regions partitioned by the first banks; baking the first functional liquid; forming second banks on the first banks; and arranging a second functional liquid in regions partitioned by the second banks. A lyophilic treatment is performed on the surfaces of the first banks between the arranging of the first functional liquid and the forming of the second banks.

Description

technical field [0001] The present invention relates to a method of forming a film pattern and a method of manufacturing a device, an electro-optical device, and an electronic instrument. Background technique [0002] For the manufacture of devices having electronic circuits or integrated circuit wiring, for example, photolithography is used. This photolithography method is to apply a photosensitive material called resist on a substrate coated with a conductive film in advance, and develop it by irradiating the circuit pattern, and then etch the conductive film according to the resist pattern to form a thin film. line pattern. This photolithography method requires large-scale equipment or complicated processes, and the use effect of materials is only about a few percent, so most of the materials have to be discarded, so the manufacturing cost is high. [0003] In contrast, there have been proposals for forming a wiring pattern on a substrate using a droplet discharge metho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/133G02F1/136H01L51/00G09F9/30H10K99/00
Inventor 平井利充守屋克之
Owner SEIKO EPSON CORP