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Aqueous alkaline photoresist cleaning composition and method of use

A cleaning composition and composition technology, applied in the direction of organic cleaning composition, inorganic/elemental cleaning composition, ampholyte/electrically neutral surface active compound, etc., can solve developer nozzle clogging, adhesion resistance, and influence on developing process And other issues

Inactive Publication Date: 2009-04-08
EPOCH MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the process of color photoresist coating, a part of the photoresist will splash out of the glass substrate and remain in the coating machine. Under continuous production, a thick layer of photoresist will accumulate on the wall of the machine. Residues, and these photoresist residues will also pass through the developer recovery system and enter the developer pipeline and tank, resulting in dried photoresist on the coating equipment and between the developer pipelines The phenomenon of adhesion, when the photoresist residue peels off, it will enter the developer pipeline and affect the efficiency of the filter. If the photoresist residue peels off at the back of the filter, it will block the nozzle at the outlet of the developer and affect the development process. , leading to abnormal phenomena in the process

Method used

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  • Aqueous alkaline photoresist cleaning composition and method of use
  • Aqueous alkaline photoresist cleaning composition and method of use
  • Aqueous alkaline photoresist cleaning composition and method of use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Operation method

[0033]Mix 50ml of the cleaning solution composition as shown in the table below and 0.06g of photoresist polymer, stir at room temperature, and observe that the photoresist polymer dissolves to 1mm 2 The time required for the following.

[0034] observation results

[0035] (1) The results in Table 1 show that only adding basic compounds cannot effectively dissolve the color photoresist polymer to 1mm in a short time. 2 the following.

[0036] Table 1

[0037]

[0038] (2) The results in Table 2 show that, in addition to the basic compound, adding a surfactant (German BYK; BYK-380N) can further shorten the dissolution time of the color photoresist polymer, but the time required for photoresist dissolution is still too long. long. This is because the purpose of adding the surfactant is mainly to reduce the surface tension and increase the wettability to increase the peeling effect of the photoresist in the tube wall, rather than to improve the ...

Embodiment 2

[0044] Operation method

[0045] The cleaning fluid composition having the composition shown in the following table was diluted with different times of deionized water. Mix 50ml of cleaning solution compositions with different dilution ratios with 0.06g of photoresist polymer, stir at 35°C, and observe that the photoresist polymer dissolves to 1mm 2 The time required for the following.

[0046] observation results

[0047] (1) The results in Table 4 show that the cleaning composition according to the present invention still has a good dissolving effect on the red photoresist polymer after dilution.

[0048] Table 4

[0049]

[0050] (2) The results in Table 5 show that the cleaning composition according to the present invention still has a good dissolving effect on the green photoresist polymer after being diluted.

[0051] table 5

[0052]

[0053] (3) The results in Table 6 show that the cleaning composition according to the present invention still has a good diss...

Embodiment 3

[0057] Operation method

[0058] The cleaning fluid composition having the composition shown in the following table was diluted 1.3 times with deionized water. Stir 50ml of the diluted cleaning solution composition and 0.06g of photoresist polymer at different temperatures, and observe that the photoresist polymer dissolves to 1mm 2 The time required for the following.

[0059] observation results

[0060] The results in Table 7 show that as the operating temperature increases, the dissolving ability of the cleaning composition of the present invention for photoresist can be significantly improved.

[0061] Table 7

[0062]

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Abstract

The invention relates to a kind of aqueous phase alkaline light resistance cleaning compound which includes 1-50wt% of at least one kind alkaline substances; 0.1-20wt% of at least one kind di-amines substances and 30-98.9wt% water; the Ph value of the compound is larger than 12. The temperature of the cleaning compound in the invention can be raised or it can be diluted before being used according to the practical needs; besides, the product in the invention contains no organic solvent so it can be used safely under common operating conditions.

Description

technical field [0001] The invention relates to an aqueous alkaline photoresist cleaning composition, which can be used for removing photoresist in the yellow light process of semiconductor integrated circuits or liquid crystal displays or for cleaning the gap between photoresist coating equipment and developer pipelines Residual photoresist. The aqueous alkaline photoresist cleaning composition of the present invention is particularly suitable for treating color photoresists used in the color filter manufacturing process of liquid crystal displays. Background technique [0002] In the semiconductor and optoelectronic industries, the yellow light process is one of the most important steps. The line width, stacking style, and resolution defined by the yellow light process determine the evolution of generations. As far as the optoelectronic industry is concerned, in the yellow light process, the color photoresist is usually covered on the glass substrate by spin coating or no...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C11D3/02C11D3/30C11D1/94G02B5/23G03F7/42
Inventor 蔡旺亨刘文政陈建清
Owner EPOCH MATERIAL CO LTD
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